专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5802709A Method for manufacturing surface mount conductive polymer devices 失效
标题翻译：表面贴装导电聚合物器件的制造方法
公开(公告)号：US5802709A
公开(公告)日：1998-09-08
申请号：US838210
申请日：1997-04-16
申请人： Steven Darryl Hogge , Mengruo Zhang , Gary Straker , Paul G. Gratzinger , Duane Wisner
发明人： Steven Darryl Hogge , Mengruo Zhang , Gary Straker , Paul G. Gratzinger , Duane Wisner
IPC分类号： B29C47/92 , B32B37/15 , H01C1/028 , H01C1/034 , H01C1/14 , H01C7/02 , H01C17/28 , H01L51/10 , H01L51/40 , H01R43/00
CPC分类号： B32B37/153 , B29C47/92 , H01C1/028 , H01C1/1406 , H01C7/027 , B29C2947/92019 , B29C2947/92152 , B29C2947/9238 , B29C2947/92438 , B29C2947/92466 , B29C2947/926 , B29C2947/92647 , B29C2947/92828 , B29C2947/92952 , B29C47/0019 , B29K2995/0005 , B32B2309/10 , B32B2309/72 , Y10T29/49121
摘要： A conductive polymer device includes an active element comprising a conductive polymeric layer laminated between a pair of electrodes to which terminal leads are attached. The active element is enclosed in an insulative package. Each of the electrodes may be formed integrally with its associated terminal lead in a single lead frame, with a layer of conductive polymeric material laminated between two such lead frames. Alternatively, a conductive polymeric layer may be laminated between two electrodes, with a terminal lead then being soldered to each electrode. The insulative package for the active element may be either an over-molded housing encasing the active element, or a pre-molded housing having a cavity into which the active element is installed, and which is then hermetically sealed with a suitable sealant material.
摘要翻译：导电聚合物器件包括活性元件，该有源元件包括层叠在一对电极之间的导电聚合物层，末端引线连接到该电极上。有源元件封装在绝缘封装中。每个电极可以与其相关联的端子引线一体地形成在单个引线框架中，其中一层导电聚合材料层压在两个这样的引线框架之间。或者，可以在两个电极之间层叠导电聚合物层，然后将端子引线焊接到每个电极。用于有源元件的绝缘封装可以是封装有源元件的过模制外壳，或者具有空腔的预成型外壳，活动元件安装在该空腔中，然后用合适的密封剂材料气密密封。

2. 发明授权

US5466161A Compliant stacking connector for printed circuit boards 失效
公开(公告)号：US5466161A
公开(公告)日：1995-11-14
申请号：US360471
申请日：1994-12-21
申请人： George Yumibe , Paul Gratzinger , Thanh Nguyen , Duane Wisner
发明人： George Yumibe , Paul Gratzinger , Thanh Nguyen , Duane Wisner
IPC分类号： H01R12/71 , H01R13/24 , H05K1/00 , H05K1/14 , H05K3/36
CPC分类号： H01R12/714
摘要： A device for electrically connecting the conductors on a first PC board to the conductors on a second PC board includes a housing having a mounting surface for mounting on the first board, an exposed surface opposite the mounting surface, and a pair of opposed side walls. A plurality of channels open through the exposed surface, each having an interior defined between the interior surfaces of the side walls. A compliant contact element, formed as an integral conductive element, is disposed in each channel. The contact element includes an end portion formed as a termination pad on the mounting surface, a lead portion extending from the first end portion along an adjacent side wall toward the exposed surface and then through the adjacent side wall and the interior surface of that wall into the interior of one of the channels, a supporting portion extending within the interior of the channel, and an electrical contact portion flexibly joined to the supporting portion and extending outwardly from the channel beyond the exposed surface so as to establish electrical contact with one of the conductors on the second board when the second board is located adjacent to the first board. In one embodiment, the electrical contact portion is flexibly joined to the support portion along an arcuate bend so as to form an acute angle therewith. In another embodiment, the electrical contact portion is a finger-shaped element flexibly joined on each side to a cantilevered supporting portion.

3. 发明授权

US5378160A Compliant stacking connector for printed circuit boards 失效
标题翻译：符合印刷电路板的堆叠连接器
公开(公告)号：US5378160A
公开(公告)日：1995-01-03
申请号：US131257
申请日：1993-10-01
申请人： George Yumibe , Paul Gratzinger , Thanh Nguyen , Duane Wisner
发明人： George Yumibe , Paul Gratzinger , Thanh Nguyen , Duane Wisner
IPC分类号： H01R12/71 , H01R13/24 , H05K1/00 , H05K1/14 , H05K3/36
CPC分类号： H01R12/714
摘要： A device for electrically connecting the conductors on a first PC board to the conductors on a second PC board includes a housing having a mounting surface for mounting on the first board, an exposed surface opposite the mounting surface, and a pair of opposed side walls. A plurality of channels open through the exposed surface, each having an interior defined between the interior surfaces of the side walls. A compliant contact element, formed as an integral conductive element, is disposed in each channel. The contact element includes an end portion formed as a termination pad on the mounting surface, a lead portion extending from the first end portion along an adjacent side wall toward the exposed surface and then through the adjacent side wall and the interior surface of that wall into the interior of one of the channels, a supporting portion extending within the interior of the channel, and an electrical contact portion flexibly joined to the supporting portion and extending outwardly from the channel beyond the exposed surface so as to establish electrical contact with one of the conductors on the second board when the second board is located adjacent to the first board. In one embodiment, the electrical contact portion is flexibly joined to the support portion along an arcuate bend so as to form an acute angle therewith. In another embodiment, the electrical contact portion is a finger-shaped element flexibly joined on each side to a cantilevered supporting portion.
摘要翻译：用于将第一PC板上的导体电连接到第二PC板上的导体的装置包括壳体，其具有用于安装在第一板上的安装表面，与安装表面相对的暴露表面和一对相对的侧壁。多个通道穿过暴露表面开口，每个通道具有限定在侧壁内表面之间的内部。形成为整体导电元件的柔性接触元件设置在每个通道中。接触元件包括形成为安装表面上的终端焊盘的端部，引导部分，其从第一端部沿着相邻的侧壁朝向暴露的表面延伸，然后穿过相邻的侧壁和该壁的内表面进入通道之一的内部，在通道内部延伸的支撑部分以及柔性地接合到支撑部分并从通道向外延伸超过暴露表面的电接触部分，以便与其中一个当第二板位于与第一板相邻时，在第二板上的导体。在一个实施例中，电接触部分沿着弓形弯曲部柔性地接合到支撑部分，以便与其形成锐角。在另一个实施例中，电接触部分是在每一侧柔性地连接到悬臂支撑部分的手指形元件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式