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1. 发明授权

US10466466B2 Imaging adapter for microscope and portable elecronic device 有权
公开(公告)号：US10466466B2
公开(公告)日：2019-11-05
申请号：US15169078
申请日：2016-05-31
申请人： Du Cheng
发明人： Du Cheng
IPC分类号： G02B21/26 , G02B21/36 , G02B25/00 , G02B7/02 , H04N5/225 , H04N7/14 , G06F3/14 , G02B21/00 , H04N5/232
摘要： In general this device allows one to rapidly configure a mobile phone for use with a microscope. When using the device a person can take images or videos and rapidly share them, or have another user videoconference in and see the images in real time. Further, it saves both money and time when using a microscope in a laboratory (or other) setting. This device can also be used without microscope for a macro lens with illumination and light differential for purposes such as jewelry or medical examination.

2. 发明授权

US09721783B2 Methods for particle reduction in semiconductor processing 有权
公开(公告)号：US09721783B2
公开(公告)日：2017-08-01
申请号：US13371185
申请日：2012-02-10
申请人： Tien-Chih Cheng , Hung-Wen Chang , Du-Cheng Wang
发明人： Tien-Chih Cheng , Hung-Wen Chang , Du-Cheng Wang
IPC分类号： H01L21/02 , H01L21/027
CPC分类号： H01L21/0209 , H01L21/02041 , H01L21/02057 , H01L21/02096 , H01L21/0274
摘要： Methods for removing particles from a wafer for photolithography. A method is provided including providing a semiconductor wafer; attaching a polyimide layer to a backside of the semiconductor wafer; and performing an etch on an active surface of the semiconductor wafer; wherein particles that impinge on the backside during the etch are captured by the polyimide layer. In another method, includes attaching a layer of polyimide film to a backside of a semiconductor wafer; dry etching a material on an active surface of the semiconductor wafer; depositing of an additional layer of material on the active surface of the semiconductor wafer; removing the layer of polyimide film from the backside of the semiconductor wafer; patterning the layer of material using an immersion photolithography process to expose a photoresist on the active surface of the wafer; and repeating the attaching, dry etching, depositing, removing and patterning steps.

3. 发明授权

US08363909B2 Image processing apparatus, image processing method, and computer program product 有权
标题翻译：图像处理装置，图像处理方法和计算机程序产品
公开(公告)号：US08363909B2
公开(公告)日：2013-01-29
申请号：US12073500
申请日：2008-03-06
申请人： Haike Guan , Gang Wang , Zhongchao Shi , Tao Li , Du Cheng
发明人： Haike Guan , Gang Wang , Zhongchao Shi , Tao Li , Du Cheng
IPC分类号： G06K9/00
CPC分类号： G06K9/00228
摘要： An image processing apparatus that detects a face area from image information includes a pattern database, a face-direction determining unit, and a face-area detector. The face-direction determining unit determines, as a face direction, a direction in which a face image in image information is upright based on determination pattern information stored in the pattern database. The face-area detector matches the direction of the image information with the direction of the determination pattern information based on the face direction, and detects a face area from the image information.
摘要翻译：从图像信息中检测面部区域的图像处理装置包括图案数据库，面部方向确定单元和面部区域检测器。脸部方向确定单元基于存储在图案数据库中的确定模式信息，确定图像信息中的脸部图像直立的方向作为面部方向。脸部区域检测器基于面部方向将图像信息的方向与确定图案信息的方向相匹配，并根据图像信息检测脸部区域。

4. 发明申请

US20080232693A1 Image processing apparatus, image processing method, and computer program product 有权
标题翻译：图像处理装置，图像处理方法和计算机程序产品
公开(公告)号：US20080232693A1
公开(公告)日：2008-09-25
申请号：US12073500
申请日：2008-03-06
申请人： Haike Guan , Gang Wang , Zhongchao Shi , Tao Li , Du Cheng
发明人： Haike Guan , Gang Wang , Zhongchao Shi , Tao Li , Du Cheng
IPC分类号： G06K9/46
CPC分类号： G06K9/00228
摘要： An image processing apparatus that detects a face area from image information includes a pattern database, a face-direction determining unit, and a face-area detector. The face-direction determining unit determines, as a face direction, a direction in which a face image in image information is upright based on determination pattern information stored in the pattern database. The face-area detector matches the direction of the image information with the direction of the determination pattern information based on the face direction, and detects a face area from the image information.
摘要翻译：从图像信息中检测面部区域的图像处理装置包括图案数据库，面部方向确定单元和面部区域检测器。脸部方向确定单元基于存储在图案数据库中的确定模式信息，确定图像信息中的脸部图像直立的方向作为面部方向。脸部区域检测器基于面部方向将图像信息的方向与确定图案信息的方向相匹配，并根据图像信息检测脸部区域。

5. 发明申请

US20170336619A1 IMAGING ADAPTER FOR MICROSCOPE AND PORTABLE ELECRONIC DEVICE 审中-公开
公开(公告)号：US20170336619A1
公开(公告)日：2017-11-23
申请号：US15169078
申请日：2016-05-31
申请人： Du Cheng
发明人： Du Cheng
IPC分类号： G02B21/36 , G06F3/14 , G02B7/02 , G02B25/00 , H04N7/14 , H04N5/225 , H04N5/232
CPC分类号： G02B21/368 , G02B7/02 , G02B7/021 , G02B21/0008 , G02B21/362 , G02B25/001 , G02B25/005 , G02B25/008 , G06F3/1454 , H04N5/2252 , H04N5/2254 , H04N5/2257 , H04N5/23293 , H04N7/142 , H04N7/147
摘要： In general this device allows one to rapidly configure a mobile phone for use with a microscope. When using the device a person can take images or videos and rapidly share them, or have another user videoconference in and see the images in real time. Further, it saves both money and time when using a microscope in a laboratory (or other) setting. This device can also be used without microscope for a macro lens with illumination and light differential for purposes such as jewelry or medical examination.

6. 发明申请

US20130210233A1 Methods for Particle Reduction in Semiconductor Processing 有权
标题翻译：半导体处理中减少粒子的方法
公开(公告)号：US20130210233A1
公开(公告)日：2013-08-15
申请号：US13371185
申请日：2012-02-10
申请人： Tien-Chih Cheng , Hung-Wen Chang , Du-Cheng Wang
发明人： Tien-Chih Cheng , Hung-Wen Chang , Du-Cheng Wang
IPC分类号： H01L21/308
CPC分类号： H01L21/0209 , H01L21/02041 , H01L21/02057 , H01L21/02096 , H01L21/0274
摘要： Methods for removing particles from a wafer for photolithography. A method is provided including providing a semiconductor wafer; attaching a polyimide layer to a backside of the semiconductor wafer; and performing an etch on an active surface of the semiconductor wafer; wherein particles that impinge on the backside during the etch are captured by the polyimide layer. In another method, includes attaching a layer of polyimide film to a backside of a semiconductor wafer; dry etching a material on an active surface of the semiconductor wafer; depositing of an additional layer of material on the active surface of the semiconductor wafer; removing the layer of polyimide film from the backside of the semiconductor wafer; patterning the layer of material using an immersion photolithography process to expose a photoresist on the active surface of the wafer; and repeating the attaching, dry etching, depositing, removing and patterning steps.
摘要翻译：用于从用于光刻的晶片去除颗粒的方法。提供了一种提供半导体晶片的方法; 将聚酰亚胺层附着到所述半导体晶片的背面; 以及对半导体晶片的有源表面进行蚀刻; 其中在蚀刻期间撞击在背面上的颗粒被聚酰亚胺层捕获。在另一种方法中，包括将聚酰亚胺膜层附着到半导体晶片的背面; 干蚀刻半导体晶片的有源表面上的材料; 在半导体晶片的有源表面上沉积附加的材料层; 从半导体晶片的背面去除聚酰亚胺膜层; 使用浸没光刻工艺图案化材料层以暴露晶片的有源表面上的光致抗蚀剂; 并重复附着，干蚀刻，沉积，去除和图案化步骤。

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