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1. 发明授权

US07539015B2 Riser card housing 失效
标题翻译：提升卡外壳
公开(公告)号：US07539015B2
公开(公告)日：2009-05-26
申请号：US11831214
申请日：2007-07-31
申请人： Gregory Springer , Vinh Diep , Ricardo Mariano , Douglas L. Heirich , Peter Russell-Clarke , Daniele De luliis
发明人： Gregory Springer , Vinh Diep , Ricardo Mariano , Douglas L. Heirich , Peter Russell-Clarke , Daniele De luliis
IPC分类号： H05K7/20
CPC分类号： G06F1/185 , G06F1/20
摘要： A housing for accommodating one or more riser cards is disclosed. The one or more riser cards include a first riser card. The first riser card may be configured to carry at least a first component. The housing may include a first inlet side configured to allow first air to flow into the housing for cooling the first component. The housing may also include an outlet side configured to allow at least a first portion of the first air to flow away from the housing. The housing may be configured to be disposed inside an enclosure of an electronic device. At least one of the first inlet side and the outlet side may include a first guiding structure configured to guide movement of the first riser card relative to the housing.
摘要翻译：公开了一种用于容纳一个或多个转接卡的外壳。一个或多个转接卡包括第一转接卡。第一转接卡可以被配置为承载至少第一组件。壳体可以包括构造成允许第一空气流入壳体中以冷却第一部件的第一入口侧。壳体还可以包括出口侧，其被配置为允许第一空气的至少第一部分从壳体流出。壳体可以被配置为设置在电子设备的外壳内。第一入口侧和出口侧中的至少一个可以包括构造成引导第一转接卡相对于壳体的运动的第一引导结构。

2. 发明授权

US06972953B1 Thermal management system 有权
标题翻译：热管理系统
公开(公告)号：US06972953B1
公开(公告)日：2005-12-06
申请号：US10825784
申请日：2004-04-16
申请人： Douglas L. Heirich , David A. Lundgren , Robert N. Olson , Girish Upadhya , Larry Forsblad , Daniel J. Riccio
发明人： Douglas L. Heirich , David A. Lundgren , Robert N. Olson , Girish Upadhya , Larry Forsblad , Daniel J. Riccio
IPC分类号： G06F1/18 , G06F1/20 , H05K7/20
CPC分类号： G06F1/181 , G06F1/20
摘要： An apparatus for removing heat from heat generating elements is disclosed. The apparatus is a thermal management system having a thermal distribution assembly in either one of or both of conductive and radiative communication with heat generating elements. The thermal distribution assembly has thermal zones, each of which is associated with at least one heat generating element. The thermal distribution assembly includes a heat spreading frame and a heat conducting frame. Heat passes from the heat generating elements to the heat conducting frame and then to the heat spreading frame, from which the heat is removed via convection.
摘要翻译：公开了一种用于从发热元件去除热的装置。该装置是一种热管理系统，其具有与发热元件的导电和辐射通信中的任一个或两者的热分布组件。热分配组件具有热区，每个热区与至少一个发热元件相关联。热分布组件包括散热框架和导热框架。热量从发热元件传递到导热框架，然后传递到散热框架，热量通过散热框架通过对流去除。

3. 发明授权

US06578972B1 Computer monitor bezel 有权
标题翻译：电脑显示器挡板
公开(公告)号：US06578972B1
公开(公告)日：2003-06-17
申请号：US09908205
申请日：2001-07-17
申请人： Douglas L. Heirich , James J. Hong
发明人： Douglas L. Heirich , James J. Hong
IPC分类号： G02B1700
CPC分类号： G06F1/1601 , G06F2200/1611
摘要： The invention provides a computer monitor bezel including a bezel mount, and opaque planar member, and a bezel face. The bezel mount includes a frame and a mounting formation. The frame defines a frame viewing opening entirely surrounded by the frame. The mounting formation is located on the frame to mount the frame to a sub-monitor in a position wherein a screen of the sub-monitor is viewable through the frame viewing opening. The opaque planar member is located over the bezel mount. The bezel face includes a translucent planar member and an attachment component. The translucent planar member is located over the opaque planar member. The attachment component has a first end secured to the translucent planar member, extends past a plane of the opaque planar member, and has a second, opposing end secured to the frame.
摘要翻译：本发明提供了一种包括边框安装件和不透明平面构件以及边框面的计算机监视器挡板。挡板安装架包括框架和安装结构。框架限定了框架完全被框架包围的框架观察开口。安装结构位于框架上，以将框架安装到子监视器上，其中子监视器的屏幕可通过框架观察开口观看。不透明平面构件位于挡板安装件的上方。边框面包括半透明平面构件和附接构件。半透明平面构件位于不透明平面构件的上方。附接部件具有固定到半透明平面构件的第一端，延伸穿过不透明平面构件的平面，并且具有固定到框架的第二相对端。

4. 发明授权

US5806940A Monitor housing having replaceable lid with thermal vent 失效
标题翻译：显示器带有可更换盖的热插座
公开(公告)号：US5806940A
公开(公告)日：1998-09-15
申请号：US753096
申请日：1996-11-20
申请人： Douglas L. Heirich
发明人： Douglas L. Heirich
IPC分类号： G06F1/16 , H04N5/64 , A47B81/06 , A47B47/02
CPC分类号： H04N5/64 , G06F1/1601 , G06F2200/1611
摘要： A multipiece housing is provided having a mid bucket, an aft bucket secured to the mid bucket, and a replaceable lid fastened to the aft bucket having a thermal vent. The replaceable lid includes a plurality of posts. The posts are inserted against an inner wall of the aft bucket to position and fasten the replaceable lid to the top of aft bucket during assembly. The replaceable lid also includes snap features that clip onto an edge of the mid bucket to further secure the replaceable lid to the bucket. If another replaceable lid having a thermal vent with a different ventilation capacity is desired, a different replaceable lid having a different thermal vent is simply fastened to the same monitor housing.
摘要翻译：提供一种多片壳体，其具有中桶，固定到中斗的后斗，以及紧固到具有热排气口的后桶的可更换盖。可更换盖包括多个柱。支柱插入后排斗的内壁，以便在组装期间将可更换盖定位并紧固在后铲斗的顶部。可替换的盖还包括夹在中间铲斗的边缘上的卡扣特征，以进一步将可更换的盖子固定到铲斗上。如果需要具有不同通风能力的热通风口的另一个可替换的盖子，则具有不同热通风口的不同的可替换盖子简单地紧固到同一个监视器壳体上。

5. 发明授权

US08564955B2 Coupling heat sink to integrated circuit chip with thermal interface material 有权
标题翻译：将散热片耦合到具有热界面材料的集成电路芯片
公开(公告)号：US08564955B2
公开(公告)日：2013-10-22
申请号：US13151144
申请日：2011-06-01
申请人： Chad C Schmidt , Richard Lidio Blanco, Jr. , Douglas L Heirich , Michael D Hillman , Phillip L Mort , Jay S Nigen , Gregory L Tice
发明人： Chad C Schmidt , Richard Lidio Blanco, Jr. , Douglas L Heirich , Michael D Hillman , Phillip L Mort , Jay S Nigen , Gregory L Tice
IPC分类号： H05K7/20
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译：本发明的实施例提供一种用于分配热界面材料的系统。该系统包括：集成电路芯片; 散热器以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的匹配表面之间时以预定图案分布集成电路芯片。

6. 发明申请

US20110228482A1 METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL 有权
标题翻译：用于分配热界面材料的方法和装置
公开(公告)号：US20110228482A1
公开(公告)日：2011-09-22
申请号：US13151144
申请日：2011-06-01
申请人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
发明人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
IPC分类号： H05K7/20 , F28F7/00 , B23P19/00
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译：本发明的实施例提供一种用于分配热界面材料的系统。该系统包括：集成电路芯片; 散热器以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布集成电路芯片。

7. 发明申请

US20100246133A1 METHOD AND APPARATUS FOR DISTRIBUTING A THERMAL INTERFACE MATERIAL 有权
标题翻译：用于分配热界面材料的方法和装置
公开(公告)号：US20100246133A1
公开(公告)日：2010-09-30
申请号：US12415760
申请日：2009-03-31
申请人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
发明人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
IPC分类号： H05K7/20 , H01L23/40 , H01L21/50 , F28F7/00
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译：本发明的实施例提供一种用于分配热界面材料的系统。该系统包括：集成电路芯片; 散热器以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布集成电路芯片。

8. 发明申请

US20100138056A1 APPARATUS FOR AIR COOLING OF AN ELECTRONIC DEVICE 有权
标题翻译：电子设备空气冷却装置
公开(公告)号：US20100138056A1
公开(公告)日：2010-06-03
申请号：US12699756
申请日：2010-02-03
申请人： Steven Holmes , Douglas L. Heirich
发明人： Steven Holmes , Douglas L. Heirich
IPC分类号： G05D23/19 , G06F1/20 , G05D7/06
CPC分类号： G06F1/20 , G06F1/206 , G06F1/3203 , Y02D10/16
摘要： An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.
摘要翻译：公开了一种用于空气冷却电子设备的设备。轮廓面板在电子设备的壳体内引导空气流，以便将空气流更直接地传递到诸如微处理器和外围卡之类的制热元件上。还可以使用传感器来确定面板是否存在并被正确放置。如果没有，可以采取措施来减少由发热元件产生的热量。例如，可以显示警告，或者可以指示微处理器进入睡眠模式。

9. 发明申请

US20090141444A1 APPARATUS FOR AIR COOLING OF AN ELECTRONIC DEVICE 有权
标题翻译：电子设备空气冷却装置
公开(公告)号：US20090141444A1
公开(公告)日：2009-06-04
申请号：US12277879
申请日：2008-11-25
申请人： Steven HOLMES , Douglas L. HEIRICH
发明人： Steven HOLMES , Douglas L. HEIRICH
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F1/206 , G06F1/3203 , Y02D10/16
摘要： An apparatus for air-cooling an electronic device is disclosed. A contoured panel channels a flow of air within the housing of an electronic device so as to channel the flow of air more directly over heat producing elements such as the microprocessor and peripheral cards. A sensor can also be employed to determine whether the panel is present and properly placed. If not, measures can be taken to reduce the heat generated by the heat producing elements. For example, a warning can be displayed, or the microprocessor can be instructed to enter sleep mode.
摘要翻译：公开了一种用于空气冷却电子设备的设备。轮廓面板在电子设备的壳体内引导空气流，以便将空气流更直接地传递到诸如微处理器和外围卡之类的制热元件上。还可以使用传感器来确定面板是否存在并被正确放置。如果没有，可以采取措施来减少由发热元件产生的热量。例如，可以显示警告，或者可以指示微处理器进入睡眠模式。

10. 发明授权

US07038914B2 Processor module mounting assembly and a method of use 失效
标题翻译：处理器模块安装组件和使用方法
公开(公告)号：US07038914B2
公开(公告)日：2006-05-02
申请号：US10600127
申请日：2003-06-20
申请人： Douglas L. Heirich , Steven T. Holmes , James Guy Smeenge , Jason Alan Burton
发明人： Douglas L. Heirich , Steven T. Holmes , James Guy Smeenge , Jason Alan Burton
IPC分类号： H05K7/20
CPC分类号： H05K7/142 , G06F1/183 , G06F1/20 , H01L23/4006 , H01L2924/0002 , H05K7/1431 , H01L2924/00
摘要： A computer assembly is disclosed. The computer assembly comprises a chassis and a mounting module rigidly coupled to the chassis. The mounting module is for cooling the computer assembly when in operation. The computer assembly includes at least one circuit board suspended from the module. The at least one circuit board has a known orientation relative to the module and the at least one circuit board has a variable orientation relative to the chassis. A system and method in accordance with the present invention provides a stable mounting for the cooling system that includes a large heat sink. The method and system in accordance with the present invention prevents the disturbance of the critical alignment of the printed circuit board with the heatsink from shock and vibration loading. The system and method in accordance with the present invention provides features that ensure full and consistent engagement of the high density signal connectors, while preventing damage to these fragile components in installation and service. Finally, the system and method in accordance with the present invention provides a quick and easy means of assembly of the system, to enable secure reliable interconnection of the printed circuit board with the suspended circuit board (daughter board), while supporting the cooling system heatsink.
摘要翻译：公开了一种计算机组件。计算机组件包括刚性地联接到底盘的底盘和安装模块。安装模块用于在运行时冷却计算机组件。该计算机组件包括至少一个从模块悬挂的电路板。所述至少一个电路板相对于所述模块具有已知的取向，并且所述至少一个电路板相对于所述底盘具有可变的取向。根据本发明的系统和方法为包括大型散热器的冷却系统提供了稳定的安装。根据本发明的方法和系统防止印刷电路板与散热器的临界对准对冲击和振动负载的干扰。根据本发明的系统和方法提供确保高密度信号连接器的完全和一致的接合的特征，同时防止在安装和服务中损坏这些易碎部件。最后，根据本发明的系统和方法提供了一种快速和容易的组装装置的装置，以使印刷电路板与悬挂电路板（子板）的安全可靠互连，同时支持冷却系统散热器。

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