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1. 发明授权

US08939079B2 First printing plate and second printing plate 有权
标题翻译：第一印版和第二印版
公开(公告)号：US08939079B2
公开(公告)日：2015-01-27
申请号：US13300689
申请日：2011-11-21
申请人： Joo Yeon Kim , Kyu-Ha Baek , Lee Mi Do , Ji Man Park , Kunsik Park , Zin Sig Kim , Dong-Pyo Kim , Ye Sul Jeong
发明人： Joo Yeon Kim , Kyu-Ha Baek , Lee Mi Do , Ji Man Park , Kunsik Park , Zin Sig Kim , Dong-Pyo Kim , Ye Sul Jeong
IPC分类号： B41N1/00 , B29D11/00 , G02B5/08
CPC分类号： B41N1/00 , B29D11/00596 , G02B5/0816 , Y10T29/49
摘要： Disclosed are a printing plate and a mirror thereof, the printing plate including: printing portions for transferring an immersed solution, the printing portions being formed flat and arranged at regular intervals on one side of an upper part of the printing plate; and non-printing portions corresponding to a remaining area other than the printing portions, the non-printing portions being formed with at least two concavities and convexities respectively and arranged at regular intervals on the other side of the upper part of the printing plate.
摘要翻译：公开了一种印版及其反射镜，印版包括：用于转印浸液的印刷部分，印刷部分在印版的上部一侧上以规则的间隔形成为平坦的; 以及对应于除了印刷部分之外的其余区域的非印刷部分，非印刷部分分别形成有至少两个凹凸，并且在印版的上部的另一侧上以规则的间隔布置。

2. 发明授权

US08486830B2 Via forming method and method of manufacturing multi-chip package using the same 有权
标题翻译：通过使用其制造多芯片封装的形成方法和方法
公开(公告)号：US08486830B2
公开(公告)日：2013-07-16
申请号：US12835289
申请日：2010-07-13
申请人： Dong Pyo Kim , Kyu Ha Baek , Kun Sik Park , Lee Mi Do
发明人： Dong Pyo Kim , Kyu Ha Baek , Kun Sik Park , Lee Mi Do
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L23/3128 , H01L24/03 , H01L24/05 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/05599 , H01L2224/13025 , H01L2224/16147 , H01L2224/16237 , H01L2224/81141 , H01L2224/81191 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2224/05552 , H01L2924/00
摘要： A via forming method that includes forming via-holes in a substrate is provided. The method includes putting the substrate, having the via-holes, in a first solution to fill the via-holes with the first solution. Metal particles are sunk into the via-holes by supplying a second solution containing the metal particles to the first solution. A first curing process of heat-treating the substrate is performed so as to form vias in the via-holes. A multi-chip package that includes the substrate having the vias is also provided.
摘要翻译：提供一种通孔形成方法，其包括在基板中形成通孔。该方法包括将具有通孔的基板放在第一溶液中以用第一溶液填充通孔。通过向第一溶液提供含有金属颗粒的第二溶液将金属颗粒沉入通孔中。进行热处理基板的第一固化方法，以便在通孔中形成通路。还提供了包括具有通孔的基板的多芯片封装。

3. 发明申请

US20100167168A1 Hydrophilic Adjuvant 有权
标题翻译：亲水佐剂
公开(公告)号：US20100167168A1
公开(公告)日：2010-07-01
申请号：US12086519
申请日：2006-12-15
申请人： Dong-Pyo Kim , Lan-Young Hong , Jung Hye Won , Yong Su Park , Chong Kyu Shin
发明人： Dong-Pyo Kim , Lan-Young Hong , Jung Hye Won , Yong Su Park , Chong Kyu Shin
IPC分类号： H01M8/10 , C07F7/02 , B32B1/08 , C08G79/00
CPC分类号： C09K3/18 , C08K3/22 , C08K7/24 , C08K9/04 , C09D7/62 , Y10T428/13
摘要： Disclosed is an adjuvant capable of imparting a hydrophilic or superhydrophilic function to various materials or interfaces. The hydrophilic adjuvant comprises: a composite metal oxide containing Si and at least one metal element selected from the group consisting of Ti(IV), Zr(IV), Sn(IV) and Al(III); and a hydrophilic group-containing organic compound physically or chemically bonded with the Ti(IV), Zr(IV), Sn(IV) or Al of the composite metal oxide.
摘要翻译：公开了能够赋予各种材料或界面亲水或超亲水功能的佐剂。亲水性助剂包括：含有Si和选自Ti（IV），Zr（IV），Sn（IV）和Al（III））的至少一种金属元素的复合金属氧化物; 和与复合金属氧化物的Ti（IV），Zr（IV），Sn（IV）或Al物理或化学键合的含有亲水基团的有机化合物。

4. 发明申请

US20110097853A1 VIA FORMING METHOD AND METHOD OF MANUFACTURING MULTI-CHIP PACKAGE USING THE SAME 有权
标题翻译：通过形成方法和使用其制造多芯片包的方法
公开(公告)号：US20110097853A1
公开(公告)日：2011-04-28
申请号：US12835289
申请日：2010-07-13
申请人： Dong Pyo KIM , Kyu Ha Baek , Kun Sik Park , Lee Mi Do
发明人： Dong Pyo KIM , Kyu Ha Baek , Kun Sik Park , Lee Mi Do
IPC分类号： H01L21/768 , H01L21/50
CPC分类号： H01L21/76898 , H01L23/3128 , H01L24/03 , H01L24/05 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/05599 , H01L2224/13025 , H01L2224/16147 , H01L2224/16237 , H01L2224/81141 , H01L2224/81191 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01006 , H01L2924/01014 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/04941 , H01L2924/10253 , H01L2924/15311 , H01L2924/15788 , H01L2224/05552 , H01L2924/00
摘要： A via forming method is provided. The via forming method includes: forming via-holes in a substrate; putting the substrate having the via-holes in a first solution to fill the via-holes with the first solution; sinking the metal particles into the via-holes by supplying a second solution containing metal particles to the first solution, in which there is the substrate; and performing a first curing process of heat-treating the substrate having the via-holes filled with the metal particles so as to form vias in the via-holes. Further, a method of manufacturing a multi-chip package using the via forming method is provided.
摘要翻译：提供通孔形成方法。通孔形成方法包括：在基板中形成通孔; 将具有通孔的基板放置在第一溶液中以用第一溶液填充通孔; 通过向其中存在基底的第一溶液提供含有金属颗粒的第二溶液将金属颗粒沉入通孔中; 并进行热处理具有填充有金属颗粒的通孔的基板的第一固化工艺，以便在通孔中形成通路。此外，提供了使用通孔形成方法制造多芯片封装的方法。

5. 发明申请

US20110084603A1 INORGANIC ELECTROLUMINESCENT DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：无机电致发光器件及其制造方法
公开(公告)号：US20110084603A1
公开(公告)日：2011-04-14
申请号：US12900323
申请日：2010-10-07
申请人： Lee Mi Do , Kun Silk Park , Dong Pyo Kim , Ji Man Park , Jin Yeong Kang , Kyu Ha Baek
发明人： Lee Mi Do , Kun Silk Park , Dong Pyo Kim , Ji Man Park , Jin Yeong Kang , Kyu Ha Baek
IPC分类号： H05B33/02 , H05B33/10
CPC分类号： H05B33/14 , H05B33/10
摘要： An inorganic electroluminescent device includes: patterned metal electrodes periodically disposed at pre-set intervals; and a phosphor layer positioned on the patterned metal electrodes, wherein as a first voltage and a second voltage are alternately applied to the patterned metal electrodes according to the order of their disposition, light emitted from the phosphor layer is discharged to the spaces between the patterned metal electrodes.
摘要翻译：无机电致发光器件包括：以预定间隔周期性地设置的图案化金属电极; 以及位于所述图案化金属电极上的荧光体层，其中，根据其配置的顺序将第一电压和第二电压交替地施加到所述图案化的金属电极，从所述荧光体层发射的光被排出到所述图案化的金属电极之间的空间金属电极。

6. 发明申请

US20090176875A1 METHOD FOR MANUFACTURING METAL NANO PARTICLE SOLUTION 审中-公开
标题翻译：制造金属纳米颗粒溶液的方法
公开(公告)号：US20090176875A1
公开(公告)日：2009-07-09
申请号：US11971614
申请日：2008-01-09
申请人： Dong-Pyo Kim , Yoon-Hyuck Choi , Choong G. Row
发明人： Dong-Pyo Kim , Yoon-Hyuck Choi , Choong G. Row
IPC分类号： A61K31/28 , A61K31/315 , A61K31/295 , A61K31/30
CPC分类号： A61K9/08 , A61K9/0014 , A61K31/28 , A61K31/295 , A61K31/30 , A61K31/315 , A61K33/24 , A61K33/30 , A61K33/34 , A61K47/32 , A61K47/34
摘要： A method for manufacturing a stabilized metal nano particle solution is disclosed. This method manufactures a metal nano particle solution so as to make a metal substance such as silver, gold, copper, zinc or cobalt into ultra-capsular nano particles. That is to say, this new method is simple and suitable for mass production without requiring any separate reducer putting process at a room temperature while a transition metal nano particle solution is produced. In this method, an alcohol solution including a metal salt solution and a soluble polymer is mixed at a room temperature to make a nano metal particle solution with a particle size of 100 nm or less.
摘要翻译：公开了一种用于制造稳定的金属纳米颗粒溶液的方法。该方法制造金属纳米颗粒溶液，以使诸如银，金，铜，锌或钴的金属物质成为超薄纳米颗粒。也就是说，这种新方法简单，适用于批量生产，而不需要在室温下进行单独的减速器放置过程，同时生产过渡金属纳米颗粒溶液。在该方法中，将包含金属盐溶液和可溶性聚合物的醇溶液在室温下混合，制成粒径为100nm以下的纳米金属粒子溶液。

7. 发明申请

US20120140350A1 PRINTING PLATE AND MIRROR THEREOF 有权
标题翻译：印版及其镜像
公开(公告)号：US20120140350A1
公开(公告)日：2012-06-07
申请号：US13300689
申请日：2011-11-21
申请人： Joo Yeon Kim , Kyu-Ha Baek , Lee Mi Do , Ji Man Park , Kunsik Park , Zin Sig Kim , Dong-Pyo Kim , Ye Sul Jeong
发明人： Joo Yeon Kim , Kyu-Ha Baek , Lee Mi Do , Ji Man Park , Kunsik Park , Zin Sig Kim , Dong-Pyo Kim , Ye Sul Jeong
IPC分类号： B41N1/12 , G02B5/08 , B23P17/00
CPC分类号： B41N1/00 , B29D11/00596 , G02B5/0816 , Y10T29/49
摘要： Disclosed are a printing plate and a mirror thereof, the printing plate including: printing portions for transferring an immersed solution, the printing portions being formed flat and arranged at regular intervals on one side of an upper part of the printing plate; and non-printing portions corresponding to a remaining area other than the printing portions, the non-printing portions being formed with at least two concavities and convexities respectively and arranged at regular intervals on the other side of the upper part of the printing plate.
摘要翻译：公开了一种印版及其反射镜，印版包括：用于转印浸液的印刷部分，印刷部分在印版的上部一侧上以规则的间隔形成为平坦的; 以及对应于除了印刷部分之外的其余区域的非印刷部分，非印刷部分分别形成有至少两个凹凸，并且在印版的上部的另一侧上以规则的间隔布置。

8. 发明申请

US20120137907A1 INTAGLIO PRINTING PLATE INCLUDING SUPPLEMENTARY PATTERN AND METHOD FOR FABRICATING THE SAME 审中-公开
标题翻译：包括补充图案的INTLLIO印刷版及其制作方法
公开(公告)号：US20120137907A1
公开(公告)日：2012-06-07
申请号：US13310551
申请日：2011-12-02
申请人： Ye Sul JEONG , Kyu-Ha Baek , Lee-Mi Do , Ji Man Park , Kunsik Park , Dong-Pyo Kim , Zin Sig Kim , Joo Yeon Kim
发明人： Ye Sul JEONG , Kyu-Ha Baek , Lee-Mi Do , Ji Man Park , Kunsik Park , Dong-Pyo Kim , Zin Sig Kim , Joo Yeon Kim
IPC分类号： B41N1/06
CPC分类号： B41N1/00 , B41M1/10 , B41N1/06
摘要： Disclosed is an intaglio printing plate including: a pattern portion where a to-be-printed pattern is located; a non-pattern portion corresponding to a remaining area other than the pattern portion; and a supplementary pattern portion having a repetitive pattern with a predetermined form, wherein at least a part of the pattern portion is divided by a pattern structure that is formed by the supplementary pattern portion.
摘要翻译：公开了一种凹版印刷版，其包括：图案部分，其中定位有待印刷图案; 对应于图案部分以外的剩余区域的非图案部分; 以及具有预定形式的重复图案的辅助图案部分，其中图案部分的至少一部分被由辅助图案部分形成的图案结构划分。

9. 发明申请

US20110136338A1 METHOD FOR FABRICATING SEMICONDUCTOR DEVICE 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US20110136338A1
公开(公告)日：2011-06-09
申请号：US12689344
申请日：2010-01-19
申请人： Kunsik Park , Kyu-Ha Baek , Lee-Mi Do , Dong-Pyo Kim , Ji Man Park
发明人： Kunsik Park , Kyu-Ha Baek , Lee-Mi Do , Dong-Pyo Kim , Ji Man Park
IPC分类号： H01L21/768
CPC分类号： H01L21/76898 , H01L21/2885
摘要： A method of fabricating a semiconductor device includes forming a via hole in a semiconductor substrate, forming an isolation layer on an inner side of the via hole, forming a diffusion barrier layer over an upper portion of the semiconductor substrate and the inner side of the via hole where the isolation layer is formed, arranging a solvent, which contains electrically charged metal particles, on the semiconductor substrate where the diffusion barrier layer is formed, and filling the via hole with the metal particles by moving the metal particles using applied external force. The applied external force said includes a voltage causing an electric current to flow between the semiconductor substrate and the solvent, an electrical field applied between the semiconductor substrate and the solvent, or a magnetic field applied between the semiconductor substrate and the solvent.
摘要翻译：一种制造半导体器件的方法包括在半导体衬底中形成通孔，在通孔的内侧形成隔离层，在半导体衬底的上部和通孔的内侧形成扩散阻挡层形成隔离层的孔，在形成有扩散阻挡层的半导体衬底上布置含有带电荷的金属颗粒的溶剂，并通过使用外力移动金属颗粒来填充通孔。所施加的外力包括导致电流在半导体衬底和溶剂之间流动的电压，施加在半导体衬底和溶剂之间的电场或施加在半导体衬底和溶剂之间的磁场。

10. 发明授权

US08981937B2 RFID tag 有权
标题翻译： RFID标签
公开(公告)号：US08981937B2
公开(公告)日：2015-03-17
申请号：US13294359
申请日：2011-11-11
申请人： Ji Man Park , Lee Mi Do , Kyu Ha Baek , Kun Sik Park , Dong Pyo Kim , Jong Chang Woo , Zin Sig Kim , Joo Yeon Kim , Ye Sul Jeong , Yong Hyun Ham
发明人： Ji Man Park , Lee Mi Do , Kyu Ha Baek , Kun Sik Park , Dong Pyo Kim , Jong Chang Woo , Zin Sig Kim , Joo Yeon Kim , Ye Sul Jeong , Yong Hyun Ham
IPC分类号： G08B13/14 , G06K19/073
CPC分类号： G06K19/07345
摘要： An RFID tag includes: an antenna receiving an RF signal from a reader; an AFE (analog front end) generating voltage using the RF signal; and one or more switches interposed between the antenna and the AFE and controlling the connection between the antenna and the AFE through the switch operation.
摘要翻译： RFID标签包括：从读取器接收RF信号的天线; 使用RF信号产生电压的AFE（模拟前端）; 以及插入在天线和AFE之间的一个或多个开关，并且通过开关操作来控制天线和AFE之间的连接。

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