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1. 发明授权

US11646531B2 Data signal transmission connector 有权
公开(公告)号：US11646531B2
公开(公告)日：2023-05-09
申请号：US17523356
申请日：2021-11-10
申请人： Jong Cheon Shin , Dong Ho Ha
发明人： Jong Cheon Shin , Dong Ho Ha
IPC分类号： H01R13/627 , H01R12/85 , H01R13/42 , H01R12/73
CPC分类号： H01R13/6275 , H01R12/73 , H01R12/85 , H01R13/42
摘要： Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

2. 发明申请

US20220252639A1 TEST SOCKET ASSEMBLY 有权
公开(公告)号：US20220252639A1
公开(公告)日：2022-08-11
申请号：US17614290
申请日：2020-12-24
申请人： Jong Choen Shin , Dong Ho Ha
发明人： Jong Choen Shin , Dong Ho Ha
IPC分类号： G01R1/04 , H01R13/73 , G01R31/28
摘要： A test socket assembly which can stably transmit a signal at high communication speed comprises: a test socket having a plurality of conductive parts for electrically connecting a device terminal of the device to be tested and a board terminal of the tester board; a guide housing including a housing body having a housing opening into which the device to be tested can be inserted, and a socket supporting section disposed beneath the housing opening so as to protrude from one surface of the housing body; and a socket frame including a frame body, which is coupled to the test socket so as to be secured to the socket supporting section so that the test socket is supported beneath the housing opening, and a frame wing which is bent from the frame body toward the housing body so as to be secured to the housing body.

3. 发明授权

US08648516B2 Elastomeric bridge bearings having a piezoelectric device 失效
标题翻译：具有压电装置的弹性桥梁轴承
公开(公告)号：US08648516B2
公开(公告)日：2014-02-11
申请号：US13496970
申请日：2009-11-30
申请人： Dong Ho Ha , Nam Seo Goo , Moon Sig Yoo
发明人： Dong Ho Ha , Nam Seo Goo , Moon Sig Yoo
IPC分类号： H02N2/00
CPC分类号： E01D19/041 , F03G7/08
摘要： A resilient support for a bridge includes: an upper plate fixedly installed on the undersurface of the bridge deck panel; a base plate fixedly installed on the top surface of the pier; an upper fixed panel and a lower fixed panel fastened and fixed by fastening bolts to the upper plate and to the base plate, respectively; and a rubber pad, the top and bottom surfaces of which are thermally bonded and fixed to the upper and lower fixed panels, respectively, and including a plurality of steel panels in a multi-stack configuration filled therein, wherein the resilient support is configured with a plurality of piezoelectric devices for converting vibrations transmitted from the bridge deck panels into electric energy, and the piezoelectric devices are stacked between each of the steel panels within the rubber pad.
摘要翻译：桥的弹性支撑件包括：固定地安装在桥面板的下表面上的上板; 固定在码头顶面的基板; 上固定板和下固定板分别通过紧固螺栓固定和固定到上板和底板上; 以及橡胶垫，其顶表面和底表面分别热粘合并固定到上固定板和下固定板，并且包括填充在其中的多堆叠构型的多个钢板，其中弹性支撑件配置有用于将从桥面板传递的振动转换为电能的多个压电装置，并且压电装置堆叠在橡胶垫内的每个钢板之间。

4. 发明申请

US20060055083A1 Method of fabricating nano composite material 审中-公开
标题翻译：制造纳米复合材料的方法
公开(公告)号：US20060055083A1
公开(公告)日：2006-03-16
申请号：US10995127
申请日：2004-11-24
申请人： Doo-Hyun Kim , Sang-Kwan Lee , Moon-Kwang Um , Young-Min Baik , In-Soo Kim , Seung-Zeon Han , Dong-Ho Ha
发明人： Doo-Hyun Kim , Sang-Kwan Lee , Moon-Kwang Um , Young-Min Baik , In-Soo Kim , Seung-Zeon Han , Dong-Ho Ha
IPC分类号： B29C43/02
CPC分类号： C22C47/06 , B22F2998/10 , B82Y30/00 , C22C47/14 , H01M4/583 , H01M4/96 , B22F3/1208 , B22F2201/20 , C22C47/08 , B22F3/15
摘要： A method of fabricating a nano composite material includes: forming an intermediate product by loading nano-sized reinforcing materials into an inside of a tube and arranging the nano-sized reinforcing materials in a linear direction; canning the intermediate material by inserting the intermediate material into an inside of a can and sealing the can; evacuating a gas contained in the can; melting the intermediate product in the can by heating the can; preheating a mold; and loading the can into the preheated mold and pressing the mold.
摘要翻译：制造纳米复合材料的方法包括：通过将纳米尺寸的增强材料加载到管的内部并将纳米尺寸的增强材料沿直线方向布置来形成中间产品; 通过将中间材料插入罐的内部并密封罐来罐装中间材料; 排出容纳在罐中的气体; 通过加热罐将罐中的中间产物熔化; 预热模具; 并将罐装入预热的模具中并按压模具。

5. 发明授权

US11940462B2 Test socket assembly 有权
公开(公告)号：US11940462B2
公开(公告)日：2024-03-26
申请号：US17614290
申请日：2020-12-24
申请人： Jong Choen Shin , Dong Ho Ha
发明人： Jong Choen Shin , Dong Ho Ha
IPC分类号： G01R1/04 , G01R31/28 , H01R13/73
CPC分类号： G01R1/0416 , G01R31/2851 , H01R13/73
摘要： A test socket assembly which can stably transmit a signal at high communication speed comprises: a test socket having a plurality of conductive parts for electrically connecting a device terminal of the device to be tested and a board terminal of the tester board; a guide housing including a housing body having a housing opening into which the device to be tested can be inserted, and a socket supporting section disposed beneath the housing opening so as to protrude from one surface of the housing body; and a socket frame including a frame body, which is coupled to the test socket so as to be secured to the socket supporting section so that the test socket is supported beneath the housing opening, and a frame wing which is bent from the frame body toward the housing body so as to be secured to the housing body.

6. 发明申请

US20220158386A1 DATA SIGNAL TRANSMISSION CONNECTOR 有权
公开(公告)号：US20220158386A1
公开(公告)日：2022-05-19
申请号：US17523356
申请日：2021-11-10
申请人： Jong Cheon Shin , Dong Ho Ha
发明人： Jong Cheon Shin , Dong Ho Ha
IPC分类号： H01R13/627 , H01R12/85
摘要： Provided is a data signal transmission connector configured to electrically connect a first electronic component and a second electronic component includes a first base frame and a second base frame having a structure which are mirror-symmetrical, the first base frame and the second base frame being disposed to face each other and to be spaced apart from each other.

7. 发明授权

US09823299B2 Socket for semiconductor chip test and method of manufacturing the same 有权
公开(公告)号：US09823299B2
公开(公告)日：2017-11-21
申请号：US14784071
申请日：2014-02-11
申请人： Jong Cheon Shin , Dong Ho Ha
发明人： Jong Cheon Shin , Dong Ho Ha
IPC分类号： G01R31/28 , G01R1/04 , G01R3/00
CPC分类号： G01R31/2884 , G01R1/0433 , G01R3/00
摘要： Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.

8. 发明申请

US20120176003A1 RESILIENT BRIDGE SUPPORT HAVING A PIEZOELECTRIC DEVICE 失效
标题翻译：具有压电装置的耐用桥梁支撑
公开(公告)号：US20120176003A1
公开(公告)日：2012-07-12
申请号：US13496970
申请日：2009-11-30
申请人： Dong Ho Ha , Nam Seo Goo , Moon Sig Yoo
发明人： Dong Ho Ha , Nam Seo Goo , Moon Sig Yoo
IPC分类号： H02N2/00
CPC分类号： E01D19/041 , F03G7/08
摘要： A resilient support for a bridge includes: an upper plate fixedly installed on the undersurface of the bridge deck panel; a base plate fixedly installed on the top surface of the pier; an upper fixed panel and a lower fixed panel fastened and fixed by fastening bolts to the upper plate and to the base plate, respectively; and a rubber pad, the top and bottom surfaces of which are thermally bonded and fixed to the upper and lower fixed panels, respectively, and including a plurality of steel panels in a multi-stack configuration filled therein, wherein the resilient support is configured with a plurality of piezoelectric devices for converting vibrations transmitted from the bridge deck panels into electric energy, and the piezoelectric devices are stacked between each of the steel panels within the rubber pad.
摘要翻译：桥梁的弹性支撑件包括：固定地安装在桥面板的下表面上的上板; 固定在码头顶面的基板; 上固定板和下固定板分别通过紧固螺栓固定和固定到上板和底板上; 以及橡胶垫，其顶表面和底表面分别热粘合并固定到上固定板和下固定板，并且包括填充在其中的多堆叠构型的多个钢板，其中弹性支撑件配置有用于将从桥面板传递的振动转换为电能的多个压电装置，并且压电装置堆叠在橡胶垫内的每个钢板之间。

9. 发明申请

US20160054384A1 SOCKET FOR SEMICONDUCTOR CHIP TEST AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：用于半导体芯片测试的插座及其制造方法
公开(公告)号：US20160054384A1
公开(公告)日：2016-02-25
申请号：US14784071
申请日：2014-02-11
申请人： Jong Cheon SHIN , Dong Ho HA
发明人： Jong Cheon SHIN , Dong Ho HA
IPC分类号： G01R31/28 , G01R3/00
CPC分类号： G01R31/2884 , G01R1/0433 , G01R3/00
摘要： Provided are a socket for a semiconductor chip test, and a method of manufacturing the same, the socket for the semiconductor chip test including: a film layer; a semiconductor chip test terminal disposed on the film layer and connected to a terminal of a semiconductor chip; and a conductive elastic pad disposed on the film layer and connected to a ground terminal of the semiconductor chip.
摘要翻译：提供一种用于半导体芯片测试的插座及其制造方法，用于半导体芯片测试的插座包括：薄膜层; 半导体芯片测试端子，设置在膜层上并连接到半导体芯片的端子; 以及设置在所述膜层上并连接到所述半导体芯片的接地端子的导电弹性垫。

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