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    • 2. 发明授权
    • Optical element module with minimized parasitic loads
    • 具有最小化寄生负载的光学元件模块
    • US08351139B2
    • 2013-01-08
    • US12708034
    • 2010-02-18
    • Jens KuglerUlrich WeberDirk Schaffer
    • Jens KuglerUlrich WeberDirk Schaffer
    • G02B7/02
    • G02B7/02G02B7/021G03F7/70825
    • An optical element module is provided. The optical module includes an optical element unit that includes an optical element and a support structure that supports the optical element unit. The support structure includes a support device and a contact device mounted to the support device. The contact device exerts a force on the optical element unit in a first direction via a first contact surface of the contact device. The first contact surface contacts a second contact surface of the optical element unit. The contact device includes a first linking section and a second linking section extending along a second direction running transverse to the first direction and arranged kinematically in series between the first contact surface and the support device. The first linking section and the second linking section are elastically deformed in response to a bending moment resulting from the force. The first linking section and the second linking section are arranged on opposite sides of a reference plane. The reference plane includes the force and runs transverse to the second direction.
    • 提供了一种光学元件模块。 光学模块包括光学元件单元,其包括光学元件和支撑光学元件单元的支撑结构。 支撑结构包括支撑装置和安装到支撑装置的接触装置。 接触装置经由接触装置的第一接触面沿第一方向在光学元件单元上施加力。 第一接触表面接触光学元件单元的第二接触表面。 接触装置包括第一连接部分和第二连接部分,该第二连接部分沿着横向于第一方向的第二方向延伸并且在运动学上串联布置在第一接触表面和支撑装置之间。 第一连接部分和第二连接部分响应于由力产生的弯矩而弹性变形。 第一连接部分和第二连接部分布置在参考平面的相对侧上。 参考平面包括力并横向于第二方向延伸。
    • 4. 发明申请
    • METHOD FOR BONDING BODIES AND COMPOSITE BODY
    • 用于接合体和复合体的方法
    • US20120082823A1
    • 2012-04-05
    • US13248987
    • 2011-09-29
    • Hin Yiu Anthony CHUNGDirk SCHAFFER
    • Hin Yiu Anthony CHUNGDirk SCHAFFER
    • B32B3/00B32B37/14B32B37/12
    • C09J5/00B29C63/02B29C2063/485C09J2463/00F16B11/006G03F7/70716G03F7/7095Y10T156/10Y10T403/47Y10T403/473Y10T428/24752Y10T428/24777
    • A method for bonding a first body (2) to a second, panel-shaped body (3) at bonding surfaces (2a, 3a) lying opposite each other, the second body (3) projecting in at least one direction (X) beyond an edge (2′) of the first body (2). The method includes: producing a plurality of spacers (4a to 4e, 4a′ to 4e′) on at least one of the bonding surfaces (2a), applying adhesive (5) into intermediate spaces (6a to 6d) between the spacers beyond an outer spacer (4e, 4e′) as far as an adhesive periphery (5a), which is formed at an edge (2′) of the first body (2), and bonding the bodies (2, 3) by bringing the bonding surfaces (2a, 3a) into contact at the spacers (4a′ to 4e′). A prescribed distance (d) between the adhesive periphery (5a) and the outermost spacer (4e) is set to provide a desired state of deformation of the panel-shaped body (3) after a shrinkage of the applied adhesive (5) (e.g. minimized bending of the body.) In an associated composite body (1), the prescribed distance (d) lies between 20 μm and 250 μm, preferably between 30 μm and 200 μm, in particular between 40 μm and 150 μm.
    • 一种在彼此相对的接合表面(2a,3a)处将第一主体(2)接合到第二板状主体(3)的方法,所述第二主体(3)在至少一个方向(X)上突出超过 第一主体(2)的边缘(2')。 该方法包括:在至少一个接合表面(2a)上产生多个间隔物(4a至4e,4a'至4e'),将粘合剂(5)施加到隔离件之间的中间空间(6a至6d)中, 外部间隔件(4e,4e')直到形成在第一主体(2)的边缘(2')处的粘合周边(5a),并且通过使粘合表面 (2a,3a)在间隔件(4a'至4e')处接触。 在粘合剂周边(5a)和最外侧间隔物(4e)之间的规定距离(d)被设定为在所施加的粘合剂(5)收缩之后提供所述面板状体(3)的期望变形状态(例如, 最小化身体的弯曲。)在相关联的复合体(1)中,规定距离(d)在20μm和250μm之间,优选在30μm和200μm之间,特别是在40μm和150μm之间。
    • 5. 发明申请
    • OPTICAL ELEMENT FOR UV OR EUV LITHOGRAPHY
    • 用于UV或EUV光刻的光学元件
    • US20120044473A1
    • 2012-02-23
    • US13208823
    • 2011-08-12
    • Johannes LIPPERTDirk SCHAFFER
    • Johannes LIPPERTDirk SCHAFFER
    • G03B27/54G03B27/70F21V9/06
    • G02B1/10G03F7/7015G03F7/70316
    • To reduce deformations which may be caused by a functional coating on a substrate in an optical element for UV or EUV lithography, an optical element is suggested comprising a functional coating (46) on a first surface (42) of a substrate (41), wherein the substrate (41) comprises a second surface (43) having a common edge (45) with the first surface (42), and the second surface (43) also has a coating (47) and the thickness t2 and the stress σ2 of the coating (47) on the second surface (33, 43) are chosen such that, in combination with the thickness t1 and the stress σ1 of the functional coating (36, 46) on the first surface (32, 42), the condition t 1 · σ 1 t 2 · σ 2 = X is fulfilled, wherein X has a value between 0.8 and 5.0.
    • 为了减少可能由用于UV或EUV光刻的光学元件中的基底上的功能性涂层引起的变形,建议在基底(41)的第一表面(42)上包括功能性涂层(46)的光学元件, 其中所述基底(41)包括具有所述第一表面(42)的共同边缘(45)的第二表面(43),并且所述第二表面(43)还具有涂层(47),并且所述厚度t2和所述应力 选择第二表面(33,43)上的涂层(47)中的两个,使得与第一表面(32,41)上的功能涂层(36,46)的厚度t1和应力σ1结合, 42),条件t 1·&sgr; 1 t 2·&sgr 2 = X满足,其中X具有在0.8和5.0之间的值。