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1. 发明申请

WO2012138476A1 METHOD AND SYSTEM FOR ENVIRONMENTAL VEHICULAR SAFETY 审中-公开
标题翻译：环境安全的方法和系统
公开(公告)号：WO2012138476A1
公开(公告)日：2012-10-11
申请号：PCT/US2012/029886
申请日：2012-03-21
申请人： MOTOROLA MOBILITY LLC , ROKUSEK, Daniel S., , CUTTS, Kevin M., , DING, Hai,
发明人： ROKUSEK, Daniel S., , CUTTS, Kevin M., , DING, Hai,
IPC分类号： H04N21/414 , H04N21/436 , H04N21/4223 , B60R1/12 , B60R25/00 , G01C21/36 , G07C5/08 , G07C9/00
CPC分类号： H04N21/41422 , G07C5/0866 , H04N21/41407 , H04N21/4223 , H04N21/436 , H04W4/046
摘要： A method is described for launching a vehicular camera application residing on a docked mobile communication device, such as a smartphone, tablet computer, or mp3 player, for example. A common feature for the many choices of a mobile communication device is that the mobile communication device comprises embedded data processing capability. The launching operation of the vehicular camera application includes detecting a communicative coupling of the mobile communication device with a docking device; and thereafter initiating the vehicular camera application that resides on the mobile communication device. Images are displayed on the mobile communication device that was captured by a vehicular camera or a camera integrated with the mobile communication device or communicatively coupled to the mobile communication device. The associated camera may be controlled by the vehicular camera application
摘要翻译：描述了用于启动驻留在例如智能电话，平板电脑或MP3播放器的对接的移动通信设备上的车载照相机应用的方法。移动通信设备的许多选择的共同特征是移动通信设备包括嵌入式数据处理能力。车载照相机应用的发射操作包括检测移动通信设备与对接设备的通信耦合; 之后启动位于移动通信设备上的车载照相机应用程序。由移动通信设备显示图像，该移动通信设备被车载照相机或者与移动通信设备集成的照相机或通信地耦合到移动通信设备的相机拍摄。相关联的摄像机可以由车载摄像机应用来控制

2. 发明申请

WO2008082939A1 METHOD OF OPERATING A WIRELESS HEADSET 审中-公开
标题翻译：操作无线耳机的方法
公开(公告)号：WO2008082939A1
公开(公告)日：2008-07-10
申请号：PCT/US2007/087781
申请日：2007-12-17
申请人： MOTOROLA INC. , ZHANG, Ling , DING, Hai Wei , ZHAN, Wei
发明人： ZHANG, Ling , DING, Hai Wei , ZHAN, Wei
IPC分类号： H04B1/38
CPC分类号： H04M1/6066 , H04M1/0258 , H04M1/6058 , H04M2250/02
摘要： A method of operating a wireless headset enables integrating the wireless headset with an electronic communication device. The method includes detecting a wired connection between the wireless headset and an electronic communication device, such as where the wireless headset is mounted in an interface of the electronic communication device. A wireless connection protocol is then disabled in response to detecting the wired connection (block 510). A disconnection of the wired connection is then detected, such as where the wireless headset is removed from the interface in the electronic communication device (block 515). The wireless connection protocol is then enabled in response to detecting the disconnection of the wired connection, and a wireless connection is thereby established between the wireless headset and the electronic communication device (block 520).
摘要翻译：操作无线耳机的方法使无线耳机与电子通信设备集成。该方法包括检测无线耳机与电子通信设备之间的有线连接，诸如无线耳机安装在电子通信设备的接口中的位置。响应于检测到有线连接，无线连接协议被禁用（框510）。然后检测有线连接的断开，例如无线耳机从电子通信设备中的接口移除的地方（框515）。响应于检测到有线连接的断开响应，启用无线连接协议，从而在无线耳机与电子通信设备之间建立无线连接（方框520）。

3. 发明申请

WO2012125384A3 A METHOD AND SYSTEM FOR RECORDING A GEOGRAPHICAL LOCATION FROM A MOBILE COMMUNICATION DEVICE 审中-公开
标题翻译：用于记录来自移动通信设备的地理位置的方法和系统
公开(公告)号：WO2012125384A3
公开(公告)日：2013-01-03
申请号：PCT/US2012028162
申请日：2012-03-08
申请人： MOTOROLA MOBILITY LLC , ROKUSEK DANIEL S , CUTTS KEVIN M , DING HAI , SHAW STEPHEN H
发明人： ROKUSEK DANIEL S , CUTTS KEVIN M , DING HAI , SHAW STEPHEN H
IPC分类号： G01S19/14 , G06F1/16
CPC分类号： G01S19/14
摘要： A method for recording a geographical location from a docked mobile communication device that includes detecting a mobile communication device communicatively coupled to a docking device; and detecting that the mobile communication device is communicatively uncoupled from the docking device. Afterwards, the geographical location of the mobile communication device is recorded and stored in memory upon detecting that the mobile communication device has communicatively uncoupled from the docking device.
摘要翻译：一种用于从对接的移动通信设备记录地理位置的方法，包括检测通信地耦合到对接设备的移动通信设备; 以及检测所述移动通信设备与所述对接设备通信地分离。之后，移动通信设备的地理位置在检测到移动通信设备已经从对接设备通信地分离时被记录并存储在存储器中。

4. 发明申请

WO2012125384A2 A METHOD AND SYSTEM FOR RECORDING A GEOGRAPHICAL LOCATION FROM A MOBILE COMMUNICATION DEVICE 审中-公开
标题翻译：用于记录来自移动通信设备的地理位置的方法和系统
公开(公告)号：WO2012125384A2
公开(公告)日：2012-09-20
申请号：PCT/US2012/028162
申请日：2012-03-08
申请人： MOTOROLA MOBILITY LLC , ROKUSEK, Daniel S., , CUTTS, Kevin, M., , DING, Hai, , SHAW, Stephen H.,
发明人： ROKUSEK, Daniel S., , CUTTS, Kevin, M., , DING, Hai, , SHAW, Stephen H.,
IPC分类号： G01S19/14 , G06F1/16
CPC分类号： G01S19/14
摘要： A method for recording a geographical location from a docked mobile communication device that includes detecting a mobile communication device communicatively coupled to a docking device; and detecting that the mobile communication device is communicatively uncoupled from the docking device. Afterwards, the geographical location of the mobile communication device is recorded and stored in memory upon detecting that the mobile communication device has communicatively uncoupled from the docking device.
摘要翻译：一种用于从对接的移动通信设备记录地理位置的方法，包括检测通信地耦合到对接设备的移动通信设备; 以及检测所述移动通信设备与所述对接设备通信地分离。之后，移动通信设备的地理位置在检测到移动通信设备已经从对接设备通信地分离时被记录并存储在存储器中。

5. 发明授权

US07989916B2 Integrated capacitors in package-level structures, processes of making same, and systems containing same 有权
标题翻译：封装级结构中的集成电容器，制造相同的工艺，以及含有其的系统
公开(公告)号：US07989916B2
公开(公告)日：2011-08-02
申请号：US12590547
申请日：2009-11-10
申请人： John J. Tang , Xiang Yin Zeng , Jiangqi He , Ding Hai
发明人： John J. Tang , Xiang Yin Zeng , Jiangqi He , Ding Hai
IPC分类号： H01L21/02
CPC分类号： H01L21/4857 , H01L23/49822 , H01L23/50 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/48472 , H01L2224/49 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/85 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K1/111 , H05K1/113 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/09436 , H05K2201/09763 , H05K2201/10674 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.
摘要翻译：一种物品包括埋在焊接掩模中的顶部电极。一种物品包括在核心结构上的顶部电极。形成顶部电极的工艺包括减小焊接掩模厚度并在厚度较薄的焊接掩模上形成顶部电极。形成顶部电极的工艺包括在位于芯结构的图案化部分中的高K电介质上形成顶部电极。

6. 发明申请

US20100059858A1 Integrated capacitors in package-level structures, processes of making same, and systems containing same 有权
公开(公告)号：US20100059858A1
公开(公告)日：2010-03-11
申请号：US12590547
申请日：2009-11-10
申请人： John J. Tang , Xiang Yin Zeng , Jiangqi He , Ding Hai
发明人： John J. Tang , Xiang Yin Zeng , Jiangqi He , Ding Hai
IPC分类号： H01L29/92
CPC分类号： H01L21/4857 , H01L23/49822 , H01L23/50 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/48472 , H01L2224/49 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/85 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K1/111 , H05K1/113 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/09436 , H05K2201/09763 , H05K2201/10674 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.

7. 发明授权

US07670919B2 Integrated capacitors in package-level structures, processes of making same, and systems containing same 有权
标题翻译：封装级结构中的集成电容器，制造相同的工艺，以及含有其的系统
公开(公告)号：US07670919B2
公开(公告)日：2010-03-02
申请号：US11323312
申请日：2005-12-30
申请人： John J. Tang , Xiang Yin Zeng , Jiangqi He , Ding Hai
发明人： John J. Tang , Xiang Yin Zeng , Jiangqi He , Ding Hai
IPC分类号： H01L21/20
CPC分类号： H01L21/4857 , H01L23/49822 , H01L23/50 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/48472 , H01L2224/49 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/85 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K1/111 , H05K1/113 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/09436 , H05K2201/09763 , H05K2201/10674 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.
摘要翻译：一种物品包括埋在焊接掩模中的顶部电极。一种物品包括在核心结构上的顶部电极。形成顶部电极的工艺包括减小焊接掩模厚度并在厚度较薄的焊接掩模上形成顶部电极。形成顶部电极的工艺包括在位于芯结构的图案化部分中的高K电介质上形成顶部电极。

8. 发明申请

US20070158818A1 Integrated capacitors in package-level structures, processes of making same, and systems containing same 有权
标题翻译：封装级结构中的集成电容器，制造相同的工艺，以及含有其的系统
公开(公告)号：US20070158818A1
公开(公告)日：2007-07-12
申请号：US11323312
申请日：2005-12-30
申请人： John Tang , Xiang Zeng , Jiangqi He , Ding Hai
发明人： John Tang , Xiang Zeng , Jiangqi He , Ding Hai
IPC分类号： H01L23/52
CPC分类号： H01L21/4857 , H01L23/49822 , H01L23/50 , H01L24/48 , H01L24/49 , H01L24/81 , H01L24/85 , H01L2224/05553 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16237 , H01L2224/32225 , H01L2224/48472 , H01L2224/49 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/85 , H01L2224/92125 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H05K1/111 , H05K1/113 , H05K1/162 , H05K3/28 , H05K2201/0187 , H05K2201/09436 , H05K2201/09763 , H05K2201/10674 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： An article includes a top electrode that is embedded in a solder mask. An article includes a top electrode that is on a core structure. A process of forming the top electrode includes reducing the solder mask thickness and forming the top electrode on the reduced-thickness solder mask. A process of forming the top electrode includes forming the top electrode over a high-K dielectric that is in a patterned portion of the core structure.
摘要翻译：一种物品包括埋在焊接掩模中的顶部电极。一种物品包括在核心结构上的顶部电极。形成顶部电极的工艺包括减小焊接掩模厚度并在厚度较薄的焊接掩模上形成顶部电极。形成顶部电极的工艺包括在位于芯结构的图案化部分中的高K电介质上形成顶部电极。

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