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1. 发明授权

US07577537B2 Providing a dynamic sampling plan for integrated metrology 失效
标题翻译：提供综合计量学的动态抽样计划
公开(公告)号：US07577537B2
公开(公告)日：2009-08-18
申请号：US12050425
申请日：2008-03-18
申请人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
发明人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
IPC分类号： G06F15/00
CPC分类号： G05B19/41865 , G05B2219/31372 , G05B2219/32135 , G05B2219/32328 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/26
摘要： A computer program product and system of providing a dynamic sampling plan for integrated metrology is disclosed. The computer program product may include a computer readable medium that includes a computer readable program, wherein the computer readable program when executed on a computer causes the computer to: model a sampling plan for use with a factory level advanced processing control (FL-APC) system; receive a request for a sampling plan; and send a recommended sampling plan, based upon the request and the modeling. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.
摘要翻译：公开了一种提供综合测量动态采样计划的计算机程序产品和系统。计算机程序产品可以包括计算机可读介质，其包括计算机可读程序，其中当在计算机上执行时所述计算机可读程序使得所述计算机：对用于工厂级高级处理控制（FL-APC）的采样计划进行建模，系统; 收到抽样方案的请求; 并根据请求和建模发送推荐的抽样计划。推荐的采样计划可以发送到设备接口（EI），并发送到在制造环境中实现的工具。

2. 发明授权

US07509186B2 Method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process 失效
标题翻译：用于在半导体制造工艺中减少具有多个沉积路径的多个半导体晶片上的膜厚变化的方法和系统
公开(公告)号：US07509186B2
公开(公告)日：2009-03-24
申请号：US11557134
申请日：2006-11-07
申请人： Yue Li , Gary W. Behm , James V. Iannucci, Jr. , Derek C. Stoll
发明人： Yue Li , Gary W. Behm , James V. Iannucci, Jr. , Derek C. Stoll
IPC分类号： G06F19/00 , H01L21/66
CPC分类号： H01L22/12
摘要： A method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process is disclosed. A film of a varying input thickness is applied to semiconductor wafers moving through various film deposition paths. The deposition path of each of the semiconductor wafers is recorded. A subset of semiconductor wafers is measured and an average film input thickness corresponding to each of the film deposition paths is calculated. If semiconductor wafer in the specific film deposition path does not have measurement data, by default it uses historical measurement data. The average film input thickness of the deposition path corresponding to a given semiconductor wafer is then used to modify the recipe of a process tool, such as a Chemical Mechanical Planarization (CMP) Process Tool. An improved manufacturing process is achieved without the use of excess measurements.
摘要翻译：公开了一种用于在半导体制造工艺中减少具有多个沉积路径的多个半导体晶片上的膜厚变化的方法和系统。将具有变化的输入厚度的膜施加到通过各种膜沉积路径移动的半导体晶片。记录每个半导体晶片的沉积路径。测量半导体晶片的子集，并计算对应于每个膜沉积路径的平均膜输入厚度。如果特定成膜路径中的半导体晶片不具有测量数据，则默认使用历史测量数据。然后使用对应于给定半导体晶片的沉积路径的平均膜输入厚度来修改诸如化学机械平面化（CMP）工艺工具的处理工具的配方。在不使用过量测量的情况下实现改进的制造工艺。

3. 发明申请

US20080167830A1 PROVIDING A DYNAMIC SAMPLING PLAN FOR INTEGRATED METROLOGY 失效
标题翻译：提供一体化计量的动态采样计划
公开(公告)号：US20080167830A1
公开(公告)日：2008-07-10
申请号：US12050425
申请日：2008-03-18
申请人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
发明人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
IPC分类号： G06F19/00
CPC分类号： G05B19/41865 , G05B2219/31372 , G05B2219/32135 , G05B2219/32328 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/26
摘要： A computer program product and system of providing a dynamic sampling plan for integrated metrology is disclosed. The computer program product may include a computer readable medium that includes a computer readable program, wherein the computer readable program when executed on a computer causes the computer to: model a sampling plan for use with a factory level advanced processing control (FL-APC) system; receive a request for a sampling plan; and send a recommended sampling plan, based upon the request and the modeling. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.
摘要翻译：公开了一种提供综合测量动态采样计划的计算机程序产品和系统。计算机程序产品可以包括计算机可读介质，其包括计算机可读程序，其中当在计算机上执行时所述计算机可读程序使所述计算机模拟采样计划以用于工厂级高级处理控制（FL-APC）系统; 收到抽样方案的请求; 并根据请求和建模发送推荐的抽样计划。推荐的采样计划可以发送到设备接口（EI），并发送到在制造环境中实现的工具。

4. 发明授权

US07398172B2 Method and system of providing a dynamic sampling plan for integrated metrology 有权
标题翻译：提供综合计量的动态抽样计划的方法和系统
公开(公告)号：US07398172B2
公开(公告)日：2008-07-08
申请号：US11421082
申请日：2006-05-31
申请人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
发明人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
IPC分类号： G06F15/00
CPC分类号： G05B19/41865 , G05B2219/31372 , G05B2219/32135 , G05B2219/32328 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/26
摘要： A method and system of providing a dynamic sampling plan for integrated metrology is disclosed. The method may include modeling a sampling plan for use with a factory level advanced processing control (FL-APC) system and sending a recommended sampling plan, in response to receiving a request for a sampling plan, wherein the recommended sampling plan is based upon the modeling and the request. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.
摘要翻译：公开了一种提供综合计量学动态采样计划的方法和系统。该方法可以包括对采样计划建模以用于工厂级高级处理控制（FL-APC）系统，并响应于接收到采样计划的请求而发送推荐的采样计划，其中推荐的采样计划基于建模和请求。推荐的采样计划可以发送到设备接口（EI），并发送到在制造环境中实现的工具。

5. 发明申请

US20070282549A1 METHOD AND SYSTEM OF PROVIDING A DYNAMIC SAMPLING PLAN FOR INTEGRATED METROLOGY 有权
标题翻译：提供一体化计量的动态采样方案的方法和系统
公开(公告)号：US20070282549A1
公开(公告)日：2007-12-06
申请号：US11421082
申请日：2006-05-31
申请人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
发明人： Gary W. Behm , Emily M. Hwang , Yue J. Li , Teresita Q. Magtoto , Derek C. Stoll
IPC分类号： G06F19/00 , G06F17/40
CPC分类号： G05B19/41865 , G05B2219/31372 , G05B2219/32135 , G05B2219/32328 , G05B2219/45031 , Y02P90/12 , Y02P90/20 , Y02P90/26
摘要： A method and system of providing a dynamic sampling plan for integrated metrology is disclosed. The method may include modeling a sampling plan for use with a factory level advanced processing control (FL-APC) system and sending a recommended sampling plan, in response to receiving a request for a sampling plan, wherein the recommended sampling plan is based upon the modeling and the request. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.
摘要翻译：公开了一种提供综合计量学动态采样计划的方法和系统。该方法可以包括对采样计划建模以用于工厂级高级处理控制（FL-APC）系统，并响应于接收到采样计划的请求而发送推荐的采样计划，其中推荐的采样计划基于建模和请求。推荐的采样计划可以发送到设备接口（EI），并发送到在制造环境中实现的工具。

6. 发明申请

US20080124818A1 METHOD AND SYSTEM FOR REDUCING THE VARIATION IN FILM THICKNESS ON A PLURALITY OF SEMICONDUCTOR WAFERS HAVING MULTIPLE DEPOSITION PATHS IN A SEMICONDUCTOR MANUFACTURING PROCESS 失效
标题翻译：用于在半导体制造工艺中减少具有多个沉积块的多个半导体波长的膜厚度的变化的方法和系统
公开(公告)号：US20080124818A1
公开(公告)日：2008-05-29
申请号：US11557134
申请日：2006-11-07
申请人： Yue Li , Gary W. Behm , James V. Iannucci , Derek C. Stoll
发明人： Yue Li , Gary W. Behm , James V. Iannucci , Derek C. Stoll
IPC分类号： H01L21/66 , B05C11/00
CPC分类号： H01L22/12
摘要： A method and system for reducing the variation in film thickness on a plurality of semiconductor wafers having multiple deposition paths in a semiconductor manufacturing process is disclosed. A film of a varying input thickness is applied to semiconductor wafers moving through various film deposition paths. The deposition path of each of the semiconductor wafers is recorded. A subset of semiconductor wafers is measured and an average film input thickness corresponding to each of the film deposition paths is calculated. If semiconductor wafer in the specific film deposition path does not have measurement data, by default it uses historical measurement data. The average film input thickness of the deposition path corresponding to a given semiconductor wafer is then used to modify the recipe of a process tool, such as a Chemical Mechanical Planarization (CMP) Process Tool. An improved manufacturing process is achieved without the use of excess measurements.
摘要翻译：公开了一种用于在半导体制造工艺中减少具有多个沉积路径的多个半导体晶片上的膜厚变化的方法和系统。将具有变化的输入厚度的膜施加到通过各种膜沉积路径移动的半导体晶片。记录每个半导体晶片的沉积路径。测量半导体晶片的子集，并计算对应于每个膜沉积路径的平均膜输入厚度。如果特定成膜路径中的半导体晶片不具有测量数据，则默认使用历史测量数据。然后使用对应于给定半导体晶片的沉积路径的平均膜输入厚度来修改诸如化学机械平面化（CMP）工艺工具的处理工具的配方。在不使用过量测量的情况下实现改进的制造工艺。

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