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1. 发明授权

US5814196A Apparatus and method for high throughput sputtering 失效
标题翻译：高通量溅射的装置和方法
公开(公告)号：US5814196A
公开(公告)日：1998-09-29
申请号：US46215
申请日：1993-04-08
申请人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
发明人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
IPC分类号： C23C14/02 , C23C14/34 , C23C14/35 , C23C14/50 , C23C14/54 , C23C14/56 , G05B19/05 , G05B19/418 , G11B5/85 , G11B5/851 , H01L21/00 , H01L21/677 , C23C14/00
CPC分类号： H01L21/6776 , C23C14/02 , C23C14/028 , C23C14/34 , C23C14/35 , C23C14/352 , C23C14/50 , C23C14/54 , C23C14/541 , C23C14/568 , G05B19/052 , G05B19/4189 , G11B5/851 , H01J37/32733 , H01J37/3405 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H01L21/67213 , H01L21/67236 , H01L21/67253 , H01L21/67259 , H01L21/67276 , H01L21/67712 , H01L21/67721 , G05B2219/31225 , G05B2219/31237 , G05B2219/32413 , G05B2219/34029 , G05B2219/34279 , G05B2219/34287 , G05B2219/34304 , G05B2219/50363 , Y02P90/18 , Y02P90/28
摘要： An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.
摘要翻译：根据本发明的装置向多个基板的表面提供单层或多层涂层。该装置可以包括多个缓冲和溅射室，以及输入端和输出端，其中所述基板以不同的速度传送通过所述装置的所述室，使得托盘从所述输入端的速度对于所述多个托盘中的每一个，所述输出端为常数。根据本发明的具有多个整体匹配部件的高通量溅射装置还可以包括用于以可变速度输送多个基板通过所述溅射室的装置; 用于将所述溅射室内的环境压力降低至足以实现溅射操作的压力范围内的真空度的装置; 用于将所述多个基板加热到有助于在其上溅射所述涂层的温度的装置，所述用于加热的装置在所述基板的表面上提供基本均匀的温度分布; 以及控制装置，用于向所述溅射室提供控制信号并从其接收反馈输入，用于传送装置，减少装置和加热装置，所述控制装置可编程以允许控制所述溅射装置，减少和加热手段的手段。

2. 发明授权

US5683561A Apparatus and method for high throughput sputtering 失效
标题翻译：高通量溅射的装置和方法
公开(公告)号：US5683561A
公开(公告)日：1997-11-04
申请号：US552250
申请日：1995-11-02
申请人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne , Kenneth Lee , David B. Pearce
发明人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne , Kenneth Lee , David B. Pearce
IPC分类号： C23C14/02 , C23C14/34 , C23C14/35 , C23C14/50 , C23C14/54 , C23C14/56 , G05B19/05 , G05B19/418 , G11B5/85 , G11B5/851 , H01L21/00 , H01L21/677
CPC分类号： H01L21/6776 , C23C14/02 , C23C14/028 , C23C14/34 , C23C14/35 , C23C14/352 , C23C14/50 , C23C14/54 , C23C14/541 , C23C14/568 , G05B19/052 , G05B19/4189 , G11B5/851 , H01J37/32733 , H01J37/3405 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H01L21/67213 , H01L21/67236 , H01L21/67253 , H01L21/67259 , H01L21/67276 , H01L21/67712 , H01L21/67721 , G05B2219/31225 , G05B2219/31237 , G05B2219/32413 , G05B2219/34029 , G05B2219/34279 , G05B2219/34287 , G05B2219/34304 , G05B2219/50363 , Y02P90/18 , Y02P90/28
摘要： An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.
摘要翻译：根据本发明的装置向多个基板的表面提供单层或多层涂层。该装置可以包括多个缓冲和溅射室，以及输入端和输出端，其中所述基板以不同的速度传送通过所述装置的所述室，使得托盘从所述输入端的速度对于所述多个托盘中的每一个，所述输出端为常数。根据本发明的具有多个整体匹配部件的高通量溅射装置还可以包括用于以可变速度输送多个基板通过所述溅射室的装置; 用于将所述溅射室内的环境压力降低至足以实现溅射操作的压力范围内的真空度的装置; 用于将所述多个基板加热到有助于在其上溅射所述涂层的温度的装置，所述用于加热的装置在所述基板的表面上提供基本均匀的温度分布; 以及控制装置，用于向所述溅射室提供控制信号并从其接收反馈输入，用于传送装置，减少装置和加热装置，所述控制装置可编程以允许控制所述溅射装置，减少和加热手段的手段。

3. 发明授权

US4487061A Method and apparatus for detecting well pump-off 失效
标题翻译：检测井泵的方法和装置
公开(公告)号：US4487061A
公开(公告)日：1984-12-11
申请号：US450597
申请日：1982-12-17
申请人： Louis S. McTamaney , Allan B. Delfino , Delbert F. Waltrip , Thomas I. Kirkpatrick
发明人： Louis S. McTamaney , Allan B. Delfino , Delbert F. Waltrip , Thomas I. Kirkpatrick
IPC分类号： E21B47/00 , F04B49/00 , E21B44/00
CPC分类号： E21B47/0008 , Y10T74/18182
摘要： Methods and apparatus for detecting fluid pound in a sucker-rod oil well, using maximum and minimum values of sucker-rod position and of sucker-rod load to calculate a reference position and a selected load value. The apparatus automatically calculates the reference position and the selected load value according to the characteristics of the well and of the well pumping equipment. When the sucker-rod moves downward to the reference position, the actual load value is checked against the selected value and in one embodiment of the invention a warning signal develops when the amount of the load exceeds the previously selected load quantity. In another embodiment a warning signal develops when the rate of change of the load is at a maximum below the reference position. In a third embodiment a warning signal develops when a minimum rate of change of the load occurs below the reference position.
摘要翻译：使用抽油杆位置和抽油杆负载的最大值和最小值来检测抽油杆油井中的液磅的方法和装置，以计算参考位置和选定的载荷值。该装置根据井和井筒设备的特性自动计算参考位置和选定的载重值。当抽油杆向下移动到参考位置时，相对于所选值检查实际负载值，并且在本发明的一个实施例中，当负载量超过先前选择的负载量时，产生警告信号。在另一个实施例中，当负载的变化率处于比参考位置低的最大值时，产生警告信号。在第三实施例中，当负载的最小变化率发生在参考位置下方时，产生警告信号。

4. 发明授权

US6156171A Sputtering magnetron 失效
标题翻译：溅射磁控管
公开(公告)号：US6156171A
公开(公告)日：2000-12-05
申请号：US45989
申请日：1993-04-09
申请人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
发明人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
IPC分类号： C23C14/02 , C23C14/34 , C23C14/35 , C23C14/50 , C23C14/54 , C23C14/56 , G05B19/05 , G05B19/418 , G11B5/85 , G11B5/851 , H01L21/00 , H01L21/677
CPC分类号： H01L21/6776 , C23C14/02 , C23C14/028 , C23C14/34 , C23C14/35 , C23C14/352 , C23C14/50 , C23C14/54 , C23C14/541 , C23C14/568 , G05B19/052 , G05B19/4189 , G11B5/851 , H01J37/32733 , H01J37/3405 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H01L21/67213 , H01L21/67236 , H01L21/67253 , H01L21/67259 , H01L21/67276 , H01L21/67712 , H01L21/67721 , G05B2219/31225 , G05B2219/31237 , G05B2219/32413 , G05B2219/34029 , G05B2219/34279 , G05B2219/34287 , G05B2219/34304 , G05B2219/50363 , Y02P90/18 , Y02P90/28
摘要： An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.
摘要翻译：根据本发明的装置向多个基板的表面提供单层或多层涂层。该装置可以包括多个缓冲和溅射室，以及输入端和输出端，其中所述基板以不同的速度传送通过所述装置的所述室，使得托盘从所述输入端的速度对于所述多个托盘中的每一个，所述输出端为常数。根据本发明的具有多个整体匹配部件的高通量溅射装置还可以包括用于以可变速度输送多个基板通过所述溅射室的装置; 用于将所述溅射室内的环境压力降低至足以实现溅射操作的压力范围内的真空度的装置; 用于将所述多个基板加热到有助于在其上溅射所述涂层的温度的装置，所述用于加热的装置在所述基板的表面上提供基本均匀的温度分布; 以及控制装置，用于向所述溅射室提供控制信号并从其接收反馈输入，用于传送装置，减少装置和加热装置，所述控制装置可编程以允许控制所述溅射装置，减少和加热手段的手段。

5. 发明授权

US5972184A Heating system for high throughput sputtering 失效
标题翻译：用于高通量溅射的加热系统
公开(公告)号：US5972184A
公开(公告)日：1999-10-26
申请号：US45975
申请日：1993-04-09
申请人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
发明人： Dennis R. Hollars , Delbert F. Waltrip , Robert B. Zubeck , Josef Bonigut , Robert M. Smith , Gary L. Payne
IPC分类号： C23C14/02 , C23C14/34 , C23C14/35 , C23C14/50 , C23C14/54 , C23C14/56 , G05B19/05 , G05B19/418 , G11B5/85 , G11B5/851 , H01L21/00 , H01L21/677
CPC分类号： H01L21/6776 , C23C14/02 , C23C14/028 , C23C14/34 , C23C14/35 , C23C14/352 , C23C14/50 , C23C14/54 , C23C14/541 , C23C14/568 , G05B19/052 , G05B19/4189 , G11B5/851 , H01J37/32733 , H01J37/3405 , H01L21/6715 , H01L21/67173 , H01L21/67207 , H01L21/67213 , H01L21/67236 , H01L21/67253 , H01L21/67259 , H01L21/67276 , H01L21/67712 , H01L21/67721 , G05B2219/31225 , G05B2219/31237 , G05B2219/32413 , G05B2219/34029 , G05B2219/34279 , G05B2219/34287 , G05B2219/34304 , G05B2219/50363 , Y02P90/18 , Y02P90/28
摘要： A high throughput sputtering apparatus which provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus comprises a plurality of buffer and sputtering chambers which include an input end and an output end. The substrates are transported through the chambers at varying rates of speed such that the rate of speed of a pallet from the input end to the output end is a constant for each of the pallets. The high throughput sputtering apparatus also includes a transport system which transports the substrates through the sputtering chambers at variable velocities, a high capacity vacuum pump system which evacuates the ambient pressure within the sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation, a substrate heating system which heats the substrates to a temperature conducive to sputtering the coatings thereon and provides a substantially uniform temperature profile over the surface of the substrates; and an electronic control system which provides control signals to and for receiving feedback input from other components of the apparatus. The electronic control system is programmable to control the sputtering chambers, the transport system, the vacuum pump system, and the substrate heating system. The substrate heating system efficiently maintains a desired substrate temperature by minimizing radiative heat losses as the substrates proceed through the sputtering apparatus. The high throughput sputtering apparatus provides substrates to be sputtered in a rapid and uniform heating process to optimize film integrity during the sputtering steps, provides successive layers of thin films on the substrates, and removes the sputtered substrates without contaminating the environment.
摘要翻译：一种高通量溅射装置，其向多个基板的表面提供单层或多层涂层。该装置包括多个缓冲和溅射室，其包括输入端和输出端。基板以不同的速度传送通过室，使得托盘从输入端到输出端的速度速率对于每个托盘是恒定的。高通量溅射装置还包括以可变速度输送基板通过溅射室的输送系统，将真空室内的环境压力排出到足以实现溅射操作的压力范围内的真空度的高容量真空泵系统衬底加热系统，其将衬底加热到有利于溅射其上的涂层的温度，并在衬底的表面上提供基本均匀的温度分布; 以及电子控制系统，其向控制信号提供控制信号并从该设备的其他部件接收反馈输入。电子控制系统可编程控制溅射室，输送系统，真空泵系统和基板加热系统。当衬底通过溅射装置进行时，衬底加热系统通过最小化辐射热损失来有效地保持期望的衬底温度。高通量溅射装置提供在快速且均匀的加热过程中溅射的基板，以在溅射步骤期间优化膜的完整性，在基板上提供连续的薄膜层，并且在不污染环境的情况下去除溅射的基板。

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