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1. 发明授权

US5028984A Epoxy composition and use thereof 失效
标题翻译：环氧组合物及其用途
公开(公告)号：US5028984A
公开(公告)日：1991-07-02
申请号：US267406
申请日：1988-11-04
申请人： Joseph G. Ameen , Joseph Funari , Bahgat G. Sammakia , David W. Sissenstein, Jr. , Samuel L. Smey
发明人： Joseph G. Ameen , Joseph Funari , Bahgat G. Sammakia , David W. Sissenstein, Jr. , Samuel L. Smey
IPC分类号： C08G59/00 , C08K3/22 , C08L63/00 , H01B3/40 , H01L21/58 , H01L23/10 , H01L23/373
CPC分类号： C08L63/00 , C08K3/22 , H01B3/40 , H01L23/10 , H01L23/3737 , H01L24/29 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/8319 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01058 , H01L2924/01067 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315
摘要： A curable composition containing an epoxide component and zinc oxide and use thereof.

2. 发明授权

US4919729A Solder paste for use in a reducing atmosphere 失效
标题翻译：用于还原气氛的焊膏
公开(公告)号：US4919729A
公开(公告)日：1990-04-24
申请号：US346241
申请日：1989-05-02
申请人： Peter J. Elmgren , Alan J. Emerick , Dennis L. Rivenburg, Sr. , Mukund K. Saraiya , David W. Sissenstein, Jr.
发明人： Peter J. Elmgren , Alan J. Emerick , Dennis L. Rivenburg, Sr. , Mukund K. Saraiya , David W. Sissenstein, Jr.
IPC分类号： B23K35/22 , B23K35/26 , B23K35/36
CPC分类号： B23K35/3612 , B23K35/22 , B23K35/26
摘要： A solder paste for use in a reducing atmosphere is disclosed. The solder paste includes a solder powder and an alcohol binder. The reducing atmosphere serves as a flux, thereby eliminating flux residues and the problems associated therewith. Solder splattering is reduced by using a polyhydric alcoholic binder which vaporizes or decomposes before the solder liquifies during heating. The use of such a solder paste in a reducing atmosphere results in no hazardous chemical by-products and, because the solder is handled in the form of a paste, is compatible with electrical components requiring precise dimensional tolerances.
摘要翻译：公开了一种用于还原气氛的焊膏。焊膏包括焊料粉末和醇粘合剂。还原气氛用作助熔剂，从而消除助熔剂残余物和与之相关的问题。通过使用在加热期间焊料液化之前蒸发或分解的多元醇粘合剂来降低焊料飞溅。在还原气氛中使用这种焊膏导致没有有害的化学副产物，并且由于焊料以糊状的形式被处理，所以与需要精确的尺寸公差的电气部件兼容。

3. 发明授权

US5321884A Multilayered flexible circuit package 失效
标题翻译：多层柔性电路封装
公开(公告)号：US5321884A
公开(公告)日：1994-06-21
申请号：US065129
申请日：1993-05-20
申请人： Joseph G. Ameen , Joseph Funari , David W. Sissenstein, Jr.
发明人： Joseph G. Ameen , Joseph Funari , David W. Sissenstein, Jr.
IPC分类号： H01L23/50 , H01L23/498 , H01L23/538 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/14 , H05K1/18 , H05K3/36 , H05K3/46 , H05K7/02
CPC分类号： H05K7/023 , H01L23/4985 , H01L23/5384 , H01L23/5387 , H01L25/105 , H05K1/144 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , Y10T29/49126 , Y10T29/49829
摘要： An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g., printed circuit board), while also including an opposite end portion which projects from an opposite, upper surface of the first substrate. These upwardly projecting end portions are designed for accommodating, in stacked orientation, a plurality of thin film, flexible circuitized substrates thereon, each of these substrates being electrically coupled to a respective pin, if desired, using a solder composition. In one example of the invention, solder hierarchy for various solders is used, one solder being used to connect the substrates and respective pins, and a second solder (having a higher melting point and different composition from the first solder) used to connect the semiconductor devices (chips) of the flexible circuitized substrates to the conductive circuitry of the substrates. Hydrogen is preferably used to effect solder reflow for the solder which couples the flexible substrates to the respective pins. In an alternate embodiment, the flexible circuitized substrates may include at least two separate conductive layers as part thereof.
摘要翻译：一种电子封装，其包括具有间隔地位于其中的多个导电引脚的刚性第一基板（例如，陶瓷）。这些销各自包括在基板的下表面下方延伸的一个端部，用于在第二基板（例如，印刷电路板）内定位和电耦合，同时还包括从第一基板的相对的上表面突出的相对端部。这些向上突出的端部被设计成在堆叠的方向上容纳多个薄膜，柔性电路化基板，如果需要，这些基板中的每一个都使用焊料组合物电耦合到相应的销。在本发明的一个实例中，使用用于各种焊料的焊料层级，一个焊料用于连接基板和相应的引脚，以及用于连接半导体的第二焊料（具有较高熔点和与第一焊料不同的组成）柔性电路化基板的器件（芯片）到基板的导电电路。优选使用氢来实现将柔性基板耦合到各个销的焊料的回流焊。在替代实施例中，柔性电路化基板可以包括至少两个单独的导电层作为其一部分。

4. 发明授权

US5241454A Mutlilayered flexible circuit package 失效
标题翻译：多层柔性电路封装
公开(公告)号：US5241454A
公开(公告)日：1993-08-31
申请号：US823914
申请日：1992-01-22
申请人： Joseph G. Ameen , Joseph Funari , David W. Sissenstein, Jr.
发明人： Joseph G. Ameen , Joseph Funari , David W. Sissenstein, Jr.
IPC分类号： H01L23/50 , H01L23/498 , H01L23/538 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/14 , H05K1/18 , H05K3/36 , H05K3/46 , H05K7/02
CPC分类号： H05K7/023 , H01L23/4985 , H01L23/5384 , H01L23/5387 , H01L25/105 , H05K1/144 , H01L2224/16225 , H01L2225/1023 , H01L2225/1058 , Y10T29/49126 , Y10T29/49829
摘要： An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g., printed circuit board), while also including an opposite end portion which projects from an opposite, upper surface of the first substrate. These upwardly projecting end portions are designed for accommodating, in stacked orientation, a plurality of thin film, flexible circuitized substrates thereon, each of these substrates being electrically coupled to a respective pin, if desired, using a solder composition. In one example of the invention, solder hierarchy for various solders is used, one solder being used to connect the substrates and respective pins, and a second solder (having a higher melting point and different composition from the first solder) used to connect the semiconductor devices (chips) of the flexible circuitized substrates to the conductive circuitry of the substrates. Hydrogen is preferably used to effect solder reflow for the solder which couples the flexible substrates to the respective pins. In an alternate embodiment, the flexible circuitized substrates may include at least two separate conductive layers as part thereof.
摘要翻译：一种电子封装，其包括具有间隔地位于其中的多个导电引脚的刚性第一基板（例如，陶瓷）。这些销各自包括在基板的下表面下方延伸的一个端部，用于在第二基板（例如，印刷电路板）内定位和电耦合，同时还包括从第一基板的相对的上表面突出的相对端部。这些向上突出的端部被设计成在堆叠的方向上容纳多个薄膜，柔性电路化基板，如果需要，这些基板中的每一个都使用焊料组合物电耦合到相应的销。在本发明的一个实例中，使用用于各种焊料的焊料层级，一个焊料用于连接基板和相应的引脚，以及用于连接半导体的第二焊料（具有较高熔点和与第一焊料不同的组成）柔性电路化基板的器件（芯片）到基板的导电电路。优选使用氢来实现将柔性基板耦合到各个销的焊料的回流焊。在替代实施例中，柔性电路化基板可以包括至少两个单独的导电层作为其一部分。

5. 发明授权

US5190595A Ozone safe stripping solution for thermal grease 失效
标题翻译：用于导热油脂的臭氧安全剥离溶液
公开(公告)号：US5190595A
公开(公告)日：1993-03-02
申请号：US753471
申请日：1991-09-03
申请人： Joseph G. Ameen , Joseph Funari , Joseph D. Poole , David W. Sissenstein, Jr.
发明人： Joseph G. Ameen , Joseph Funari , Joseph D. Poole , David W. Sissenstein, Jr.
IPC分类号： B08B3/08 , B08B3/12 , C11D7/24 , C11D7/26 , C11D7/50 , C11D11/00 , C23G5/032 , H01L23/42
CPC分类号： C11D7/5022 , B08B3/08 , B08B3/12 , C11D11/0011 , C23G5/032 , H01L23/42 , C11D7/24 , C11D7/263 , C11D7/265 , H01L2224/16 , H01L2224/73253 , H01L2924/01014 , H01L2924/01019 , H01L2924/15312 , H01L2924/16152
摘要： An ozone safe method for stripping a silicone oil base grease from a part. The method includes the steps of providing a stripping composition of an alkylbenzene, a solution comprising a major portion of a propylene oxide derived glycol ether, and glacial acetic acid. The part to be stripped is immersed in the composition while ultrasonically agitating the composition.
摘要翻译：一种从零件上剥离硅油基润滑脂的臭氧安全方法。该方法包括提供烷基苯的汽提组合物，包含主要部分环氧丙烷衍生的二醇醚的溶液和冰醋酸的步骤。将被剥离的部分浸入组合物中，同时超声搅拌组合物。

6. 发明授权

US5145104A Substrate soldering in a reducing atmosphere 失效
标题翻译：基材在减少的大气中焊接
公开(公告)号：US5145104A
公开(公告)日：1992-09-08
申请号：US672804
申请日：1991-03-21
申请人： Joseph A. Apap , Mark A. Brown , Alan J. Emerick , Thomas L. Miller , James R. Murray , David W. Sissenstein, Jr.
发明人： Joseph A. Apap , Mark A. Brown , Alan J. Emerick , Thomas L. Miller , James R. Murray , David W. Sissenstein, Jr.
IPC分类号： H01L23/50 , H01L21/48 , H05K1/03 , H05K3/34
CPC分类号： H05K3/3478 , H01L21/4853 , H01L21/486 , H05K2201/10303 , H05K2203/0113 , H05K2203/0338 , H05K2203/041 , H05K2203/043 , H05K3/3447
摘要： An improved method and apparatus for making solder connections from input/output connecting pins to the circuitry on a pinned metallized ceramic substrate. A solder preform in the shape of a sphere provides the correct volume of solder. These spheres are held in position at each desired joint by a templet. The substrate, solder sphere and templet assembly is passed through a furnace in a reducing atmosphere and at a temperature to facilitate solder reflow and wetting, thus creating a sound mechanical and electrical connection between the pin and its portion of the circuitry. The method and apparatus of the invention provides joints have a high degree of reliability such that all connections are made to acceptable soldering standards, none lacking integrity. Only harmless by-products are produced in the practice of the invention, and no residue is produced which requires cleaning by means of chemical solvents and therefore is environmentally superior.

7. 发明授权

US4632295A Reduction atmosphere workpiece joining 失效
标题翻译：还原气氛工件接合
公开(公告)号：US4632295A
公开(公告)日：1986-12-30
申请号：US764710
申请日：1985-08-12
申请人： Vlasta A. Brusic , Peter J. Elmgren , Charles J. Owen , David W. Sissenstein, Jr. , Helen L. Yeh
发明人： Vlasta A. Brusic , Peter J. Elmgren , Charles J. Owen , David W. Sissenstein, Jr. , Helen L. Yeh
IPC分类号： B23K1/00 , B23K1/008 , B23K35/36 , B23K35/38 , B23K101/42 , H05K3/34
CPC分类号： B23K35/38 , B23K35/3612 , H05K3/3489
摘要： A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.
摘要翻译：工件通过使用焊料并将二醇和/或其多元醇和/或醚衍生物施加到基材上而与基板接合。将工件放置成与二醇和/或多元醇接触，并将所得组件在还原气氛中加热。

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