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1. 发明授权

US4539621A Integrated circuit carrier and assembly 失效
标题翻译：集成电路载体和组件
公开(公告)号：US4539621A
公开(公告)日：1985-09-03
申请号：US450891
申请日：1982-12-20
申请人： David W. Currier
发明人： David W. Currier
IPC分类号： H01L23/32 , H01R33/76 , H01R33/945 , H05K7/10 , H05K7/20
CPC分类号： H05K7/103
摘要： An integrated circuit (IC) assembly 10 using an IC carrier is disclosed. An IC 15 and IC carrier together form a carrier subassembly 11 in which two parallel rows of IC leads 20 and 21 are received by carrier contacts 28 mounted in openings 27 in a horizontal portion 14 of a main carrier member 13. Extending pin portions 30 of the carrier contacts vertically extend from the horizontal portion openings into two carrier channels 31 and 32 wherein the extending pin portions and carrier channels are dimensioned so as to recess the pin portions and prevent finger access thereto. A socket subassembly 12 is provided comprising a main socket member 40 having two raised islands 44 and 45 each with a row of socket contacts 41 fixed therein. Each socket island is dimensioned for removably fitting within one of the carrier channels with the carrier pin portions mating with the socket contacts. The main carrier member is provided with a heat sink 25 on which the IC is mounted, and the horizontal portion 14, main carrier sidewalls 17 and a cover 16 form a main carrier cavity 18 in which the IC is mounted. The socket subassembly is mounted to a printed circuit board 49. The recessing of carrier pin portions in the carrier channels permits manually handling the carrier subassembly 11 without risking static electricity discharge damage to the IC or mechanical lead damage.
摘要翻译：公开了使用IC载体的集成电路（IC）组件10。 IC 15和IC载体一起形成载体子组件11，其中两个平行的IC引线20和21行被安装在主载体构件13的水平部分14中的开口27中的载体接触件28接收。将引脚部分30延伸载体触点从水平部分开口垂直延伸到两个载体通道31和32中，其中延伸的销部分和载体通道的尺寸被设计成使得销部分凹陷并防止手指进入其中。插座子组件12设置成包括具有两个凸起岛44和45的主插座构件40，每个凸起岛44和45各自具有固定在其中的一排插座触点41。每个插座岛的尺寸适于可拆卸地装配在一个承载通道内，承载销部分与插座触头相配合。主承载构件设置有散热器25，IC安装在散热器25上，水平部分14，主载体侧壁17和盖16形成安装有IC的主载体腔18。插座子组件安装到印刷电路板49.载体通道中承载销部分的凹陷允许手动处理载体子组件11，而不会对IC造成静电放电损坏或机械引线损坏。

2. 发明授权

US4811165A Assembly for circuit modules 失效
标题翻译：组装电路模块
公开(公告)号：US4811165A
公开(公告)日：1989-03-07
申请号：US129566
申请日：1987-12-07
申请人： David W. Currier , Pavel Pesek
发明人： David W. Currier , Pavel Pesek
IPC分类号： H05K1/02 , H05K1/05 , H05K1/11 , H05K1/18 , H05K3/00 , H05K5/00 , H05K7/14 , H05K7/20
CPC分类号： H05K7/20854 , H01R12/77 , H01R23/70 , H05K1/189 , H05K7/20409 , H01R12/712 , H05K1/05 , H05K1/118 , H05K2201/056 , H05K2201/09445 , H05K2201/10189 , H05K3/0058
摘要： The assembly includes a heat-conductive plate onto which a pair of circuit modules are mounted, one module on each side of the plate. A continuous piece of flexible material, such as polyimide, forms the substrate for one circuit module, passes around an edge of the plate, and connects to the other circuit module for which it also forms the substrate. Conductors carried by the flexible material interconnect the modules and also connect the modules to external devices via a connector.
摘要翻译：组件包括一个导热板，一对电路模块安装在该导热板上，一块在板的每一侧。连续的柔性材料如聚酰亚胺形成用于一个电路模块的基板，通过该板的边缘，并连接到其也形成基板的另一个电路模块。由柔性材料承载的导体互连模块，并通过连接器将模块连接到外部设备。

3. 发明授权

US06908583B2 System and method for bending a substantially rigid substrate 有权
标题翻译：用于弯曲基本刚性基底的系统和方法
公开(公告)号：US06908583B2
公开(公告)日：2005-06-21
申请号：US10389105
申请日：2003-03-14
申请人： David Fiedler , David W. Currier , Horace M. Long , James V. Lowery
发明人： David Fiedler , David W. Currier , Horace M. Long , James V. Lowery
IPC分类号： B29C53/04 , H05K1/03 , H05K1/18 , H05K3/00
CPC分类号： B29C53/04 , H05K1/0366 , H05K1/189 , H05K3/0014 , H05K3/0061 , H05K2201/2009 , H05K2203/0195 , H05K2203/1105 , H05K2203/302
摘要： A method and apparatus for bending a substantially rigid substrate (22) having first and second portions (28, 30) interconnected by a bend region (32). The apparatus comprises first and second heated die members (60, 80). The first heated die member (60) has a longitudinal body portion (62) and an outer edge portion (64) that extends along the longitudinal body portion (62) and is substantially rounded. The second heated die member (80) has a longitudinal body portion (82) and a groove (84) that extends along the longitudinal body portion (82). The first and second heated die members (60, 80) are configured to contact the substrate (22) and are capable of bending the substrate (22) in the bend region (32) when the outer edge portion (64) of the first heated die member (60) slides into the groove (84) of the second heated die member (80). There is also a method for bending the substantially rigid substrate (22).
摘要翻译：一种用于弯曲具有通过弯曲区域（32）互连的第一和第二部分（28,30）的基本上刚性的基底（22）的方法和装置。该装置包括第一和第二加热模具构件（60,80）。第一加热模具构件（60）具有纵向主体部分（62）和沿着纵向主体部分（62）延伸并且基本上圆形的外边缘部分（64）。第二加热模具构件（80）具有纵向主体部分（82）和沿着纵向主体部分（82）延伸的凹槽（84）。第一和第二加热模具构件（60,80）构造成与第一加热模具构件（60,80）的外边缘部分（64）接触，并且能够在弯曲区域（32）中弯曲基板（22）模具构件（60）滑入第二加热模具构件（80）的凹槽（84）中。还有一种用于弯曲基本上刚性的基底（22）的方法。

4. 发明授权

US5434362A Flexible circuit board assembly and method 失效
标题翻译：柔性电路板组装及方法
公开(公告)号：US5434362A
公开(公告)日：1995-07-18
申请号：US300762
申请日：1994-09-06
申请人： Tomasz L. Klosowiak , David W. Currier , Gary K. Mui
发明人： Tomasz L. Klosowiak , David W. Currier , Gary K. Mui
IPC分类号： H05K1/00 , H05K1/18 , H05K3/00 , H05K5/00 , H05K1/02
CPC分类号： H05K5/003 , H05K1/028 , H05K1/0281 , H05K1/189 , H05K2201/09063 , H05K2201/09109 , H05K2201/09745 , H05K2201/09781 , H05K2201/2009 , H05K3/0061
摘要： A flexible circuit board assembly (10) includes a flexible substrate (11) having first and second end portions (14,15) and an intermediate portion (16). Conductive metalization interconnect paths (17) extend between the substrate end portions (14, 15) and across the intermediate portion (16). The substrate first and second end portions are mounted to first and second end portions (21, 22) of a rigidizer plate (20). Stiffening material (35) is provided on the flexible substrate intermediate portion (16) to define stiff (36, 37, 38) and less stiff (39, 40) paths that extend across the interconnect paths (17) and the substrate intermediate portion (16) and define desired bend curvature characteristics for the flexible substrate intermediate portion (16). A method utilizes this structure to provide a flexible circuit board assembly (10), preferably with a bent rigidizer plate (20).
摘要翻译：柔性电路板组件（10）包括具有第一和第二端部（14,15）和中间部分（16）的柔性基板（11）。导电金属化互连路径（17）在基板端部（14,15）之间延伸并跨越中间部分（16）。衬底第一和第二端部安装到刚性化板（20）的第一和第二端部（21,22）上。硬化材料（35）设置在柔性基板中间部分（16）上，以限定穿过互连路径（17）和基板中间部分（16）延伸的刚性（36,37,38）和较小刚性（39,40） 16）并且限定用于柔性基板中间部分（16）的所需弯曲曲率特性。一种方法利用该结构来提供柔性电路板组件（10），优选地具有弯曲的刚性板（20）。

5. 发明授权

US5386341A Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape 失效
标题翻译：柔性基板以U形折叠，其中刚性板位于U形凹口中
公开(公告)号：US5386341A
公开(公告)日：1995-01-31
申请号：US143594
申请日：1993-11-01
申请人： William L. Olson , David W. Currier , Tomasz L. Klosowiak , Mark Fulcher
发明人： William L. Olson , David W. Currier , Tomasz L. Klosowiak , Mark Fulcher
IPC分类号： H01L23/13 , H01L23/498 , H01L23/538 , H05K7/20 , H05K1/00
CPC分类号： H01L23/13 , H01L23/49816 , H01L23/5387 , H01L2224/16225 , H01L2224/16227 , H01L2924/09701 , H01L2924/15311
摘要： Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.
摘要翻译：半导体载体组件（10,40）使用柔性基板（11）连接至少一个半导体器件（19）。优选地，柔性基板（11）还连接到电路部件，优选地电路板（31）。柔性基板（11）构造成具有至少一个刚性化板（25; 41,42）的U形构造，该刚性板位于U形槽的凹口中。半导体器件（19）和柔性基板（11）之间的互连。，并且优选地，电路部件（31）由焊料连接（22,28）提供。优选地，具有不同温度膨胀系数的两个刚性板（41,42）位于柔性基板（11）的U形凹槽中，并且优选地在该组件中使用低模量粘合剂层（50,51,47）以最小化热应力。

6. 发明授权

US5101322A Arrangement for electronic circuit module 失效
标题翻译：电子电路模块安排
公开(公告)号：US5101322A
公开(公告)日：1992-03-31
申请号：US489576
申请日：1990-03-07
申请人： Sanjar Ghaem , David W. Currier
发明人： Sanjar Ghaem , David W. Currier
IPC分类号： H01R12/16 , H05K1/14 , H05K5/00 , H05K7/20
CPC分类号： H05K7/20854 , H05K1/144
摘要： Electronic circuit modules (10; 100; 400) have connector (11; 111; 411) with through pins (14, 114; 414) and a metal ground path (17) embedded therein which fit within a recess (24; 124; 424) formed by a heat sink (18; 118; 418) having a central plate portion (19) surrounded by metallic cooling fins (23). A polyimide insulating circuit base film (26; 126; 500) has conductor paths (27) and circuit components (30) on at least a top surface (28) thereof with a bottom surface (31) mounted to the top surface (21) of the heat sink plate portion (19). The connector through pins are electrically connected to the conductor paths on the polyimide base film and a cover (33;133) together with the heat sink forms an internal cavity (34; 134) for protection of the components. This structure provides a compact configuration and lower manufacturing costs for a circuit module, permits reducing RF radiation and absorption problems and permits reducing resistive connections between the through pins and the components. Also implemented are high frequency bypass capacitive networks (18, 222; 118, 325) associated with each of the conductive through pins.
摘要翻译：电子电路模块（10; 100; 400）具有连接器（11; 111; 411），其具有嵌入其中的通孔（14,114,414）和金属接地路径（17），该金属接地路径（17）装配在凹部（24; 124; 424 ）由具有由金属冷却翅片（23）包围的中心板部分（19）的散热器（18; 118; 418）形成。聚酰亚胺绝缘电路基膜（26; 126; 500）在至少其顶表面（28）上具有导体通路（27）和电路部件（30），其中安装在顶表面（21）上的底表面（31）的散热板部分（19）。通过引脚的连接器电连接到聚酰亚胺基膜上的导体路径，并且与散热器一起的盖（33; 133）形成用于保护部件的内部空腔（34; 134）。这种结构为电路模块提供了紧凑的配置和较低的制造成本，允许减少RF辐射和吸收问题，并且允许减小通孔和部件之间的电阻连接。还实现了与每个导电通孔相关联的高频旁路电容网络（18,222; 118,325）。

7. 发明授权

US4899255A Heat sink clip and assembly and method of manufacture 失效
标题翻译：散热片夹及组装及制造方法
公开(公告)号：US4899255A
公开(公告)日：1990-02-06
申请号：US223507
申请日：1988-07-25
申请人： Maxwell H. Case , Lawrence M. Hartzell , David W. Currier
发明人： Maxwell H. Case , Lawrence M. Hartzell , David W. Currier
IPC分类号： H01L23/40
CPC分类号： H01L23/4093 , H01L2924/0002
摘要： A through slot is provided in the central apex portion of a U-shaped heat sink clip and results in an advantageous assembly and method of manufacture. A heat sink and power transistor are clamped together by arm portions of the clip. The slot is used either to permit the passage of an insertion tool for holding the clip open during attachment of the clip to the heat sink and power transistor device or to permit passage of external leads of the power transistor. In either case, the resultant heat sink assembly does not require opening of the clip by providing access to ends or outer projections of the clip arm portions by mounting tools or by providing additional exterior clip projections. Thus a much more compact and readily manufacturable heat sink assembly is provided.
摘要翻译：通孔设置在U形散热片夹的中心顶部，并形成有利的组装和制造方法。散热器和功率晶体管由夹子的臂部分夹持在一起。插槽用于允许插入工具通过，以在将夹子附接到散热器和功率晶体管器件期间保持夹子打开，或允许功率晶体管的外部引线通过。在任一情况下，所得到的散热器组件不需要通过安装工具或通过提供额外的外部夹子突起来提供对夹臂部分的端部或外部突起的接近来打开夹子。因此，提供了一种更加紧凑且容易制造的散热器组件。

8. 发明授权

US4658091A Inductor housing 失效
标题翻译：电感器外壳
公开(公告)号：US4658091A
公开(公告)日：1987-04-14
申请号：US720122
申请日：1985-04-04
申请人： Christopher I. McCarthy , David W. Currier
发明人： Christopher I. McCarthy , David W. Currier
IPC分类号： H01F27/02 , H05K1/18 , H05K3/30 , H01F15/02 , H05K5/02
CPC分类号： H01F27/027 , H05K1/18 , H05K3/306 , H05K2201/0133 , H05K2201/1003 , H05K2201/10515 , H05K2201/10568 , H05K2201/2036
摘要： An inductor housing having a platform for supporting an inductor and a standoff unit for supporting the platform away from a conductor board such that various electrical components can be installed on the conductor board between the inductor platform and the conductor board surface. The inductor housing also has a hole disposed therethrough such that the inductor housing may serve as an insulating standoff support member for connecting a conductor board to a chassis.
摘要翻译：具有用于支撑电感器的平台的电感器壳体和用于将平台远离导体板支撑的支座单元，使得可以在电感器平台和导体板表面之间的导体板上安装各种电气部件。电感器壳体还具有穿过其设置的孔，使得电感器壳体可以用作用于将导体板连接到底架的绝缘支撑支撑构件。

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