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1. 发明授权

US08658937B2 Method and apparatus for processing substrate edges 有权
标题翻译：用于处理衬底边缘的方法和装置
公开(公告)号：US08658937B2
公开(公告)日：2014-02-25
申请号：US12986914
申请日：2011-01-07
申请人： Kenneth J. Harte , Ronald P. Millman, Jr. , Victoria M. Chaplick , David J. Elliott , Eugene O. Degenkolb , Murray L. Tardif
发明人： Kenneth J. Harte , Ronald P. Millman, Jr. , Victoria M. Chaplick , David J. Elliott , Eugene O. Degenkolb , Murray L. Tardif
IPC分类号： B23K26/36 , H01L21/00
CPC分类号： H01L21/268 , B23K26/0648 , B23K26/0665 , B23K26/0676 , B23K26/082 , B23K26/0823 , B23K26/123 , B23K26/142 , G03F7/2028 , H01L21/02087 , H01L21/6708
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck, in atmosphere. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Process by-products are removed via an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion zone, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing solvent and/or abrasive methods and thus will improve die yield.
摘要翻译：公开了用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光学系统，用于在大气中将辐射束引导到由卡盘支撑的旋转基板上。光学系统准确和精确地引导光束从衬底的顶部边缘，顶部斜面，顶点，底部斜面和底部边缘去除或转换有机或无机膜，膜堆，残余物或颗粒。可选的气体注入器系统将气体引导到衬底边缘以帮助反应。通过包围反应部位的排气管除去加工副产物。本发明允许对边缘排除区进行精确控制，导致晶片上可用的管芯数量的增加。用本发明的晶片边缘加工替代了现有的溶剂和/或研磨方法，从而提高了模具产量。

2. 发明授权

US08415587B2 Fiber-optic beam delivery system for wafer edge processing 有权
标题翻译：用于晶片边缘处理的光纤束传送系统
公开(公告)号：US08415587B2
公开(公告)日：2013-04-09
申请号：US13034202
申请日：2011-02-24
申请人： Ronald P. Millman, Jr. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott
发明人： Ronald P. Millman, Jr. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott
IPC分类号： B23K26/00
CPC分类号： B23K37/0426 , B23K26/0619 , B23K26/0622 , B23K26/0676 , B23K26/0823 , B23K26/103 , B23K26/142 , B23K26/16 , B23K26/361 , B23K26/40 , B23K37/047 , B23K2101/40 , B23K2103/50
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
摘要翻译：公开了用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光纤系统，用于将激光辐射引导到由卡盘支撑的旋转基底上。激光束被传送到一束光纤中，并且光纤精确地和精确地引导光束从大气中去除或转换有机或无机膜，膜堆，残余物或颗粒，从顶部边缘，顶部斜面，顶点，底部斜面和底部边缘，在单个工艺步骤中。通过包围反应部位的排气管除去反应副产物。本发明允许对边缘排除宽度的精确控制，导致晶片上可用的管芯数量的增加。本发明的晶圆边缘处理取代了现有的使用大量净化水和危险化学品（包括溶剂，酸，碱和专有剥离剂）的方法。

3. 发明申请

US20130048276A1 FRAC WATER BLENDING SYSTEM 审中-公开
标题翻译： FRAC水混合系统
公开(公告)号：US20130048276A1
公开(公告)日：2013-02-28
申请号：US13275797
申请日：2011-10-18
申请人： David J. Elliott
发明人： David J. Elliott
IPC分类号： E21B43/00 , E21B21/06
CPC分类号： E21B21/106 , E21B21/062 , E21B43/26
摘要： A water blending system and associated method for a gas shale well is provided, which includes a first inlet pipeline that receives water from a freshwater source. The first inlet pipeline has a first valve. A second inlet pipeline receives flow back water and has a second control valve. A third pipeline receives water flow from the first and second pipelines. The first pipeline has a salination level detector, the third pipeline flowing water into a tank; wherein the water flow of the first and second inlet pipelines is adjusted based on a salination level detected by the salination level detector.
摘要翻译：提供了一种用于气体页岩井的水分配系统和相关方法，其包括从淡水源接收水的第一入口管道。第一入口管道具有第一阀。第二入口管道接收回流水并具有第二控制阀。第三条管道从第一和第二管道接收水流。第一条管道有一个盐水位检测器，第三条管道将水流入水箱; 其中，基于由所述盐析液位检测器检测到的盐析水平来调节所述第一和第二入口管线的水流。

4. 发明申请

US20110139757A1 METHOD AND APPARATUS FOR PROCESSING SUBSTRATE EDGES 有权
标题翻译：用于处理基板边的方法和装置
公开(公告)号：US20110139757A1
公开(公告)日：2011-06-16
申请号：US13034191
申请日：2011-02-24
申请人： Ronald P. Millman, JR. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott , Murray L. Tardif , Eugene O. Degenkolb
发明人： Ronald P. Millman, JR. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott , Murray L. Tardif , Eugene O. Degenkolb
IPC分类号： B23K26/38
CPC分类号： B23K37/0426 , B23K26/0619 , B23K26/0622 , B23K26/0676 , B23K26/0823 , B23K26/103 , B23K26/142 , B23K26/16 , B23K26/361 , B23K26/40 , B23K37/047 , B23K2101/40 , B23K2103/50
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and optical system to direct a beam of radiation onto a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. An optional gas injector system directs gas onto the substrate edge to aid in the reaction. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
摘要翻译：公开了用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光学系统，用于将辐射束引导到由卡盘支撑的旋转基底上。光学系统准确且精确地引导光束，以从空气的顶部边缘，顶部斜面，顶点，底部斜面和底部边缘中去除或转化有机或无机膜，膜堆，残余物或颗粒，单一工艺步骤可选的气体注入器系统将气体引导到衬底边缘以帮助反应。通过包围反应部位的排气管除去反应副产物。本发明允许对边缘排除宽度的精确控制，导致晶片上可用的管芯数量的增加。本发明的晶圆边缘处理取代了现有的使用大量净化水和危险化学品（包括溶剂，酸，碱和专有剥离剂）的方法。

5. 发明授权

US06559613B1 Method for operating an open end power wrench 有权
标题翻译：操作开式动力扳手的方法
公开(公告)号：US06559613B1
公开(公告)日：2003-05-06
申请号：US10055236
申请日：2001-10-25
申请人： David J. Elliott , Mark W. Lehnert
发明人： David J. Elliott , Mark W. Lehnert
IPC分类号： H02P700
CPC分类号： B25B21/002 , B25B23/14
摘要： An open end power wrench includes an operating scheme that identifies when the item within the drive socket is an item that should be rotated by the drive socket. The method for controlling the tube nut wrench includes the steps of operating the motor to generate an output torque. The method then measures an angle of rotation through which the drive socket rotates. The angle of rotation is then compared with an angle defined by the clearance opening. The output torque is limited to a minimal torque level when the angle of rotation of the drive socket is less than the angle defined by the clearance opening. The method then increases the output torque to an operating torque level when the angle of rotation of the drive socket exceeds the angle defined by the clearance opening.
摘要翻译：开放式电动扳手包括一种操作方案，用于识别驱动器插座内的物品何时是应由驱动器插座旋转的物品。用于控制管螺母扳手的方法包括操作马达以产生输出扭矩的步骤。然后，该方法测量驱动器插座旋转的旋转角度。然后将旋转角度与由间隙开口限定的角度进行比较。当驱动器插座的旋转角度小于由间隙开口限定的角度时，输出转矩被限制在最小扭矩水平。然后，当驱动器插座的旋转角度超过由间隙开口限定的角度时，该方法将输出扭矩增加到操作扭矩水平。

6. 发明授权

US4605775A Synthesis of higher ketones 失效
标题翻译：合成高级酮
公开(公告)号：US4605775A
公开(公告)日：1986-08-12
申请号：US725843
申请日：1985-04-22
申请人： David J. Elliott
发明人： David J. Elliott
IPC分类号： C07C45/68 , C07C45/72
CPC分类号： C07C45/68 , C07C45/72
摘要： Higher ketones prepared by contacting under suitable reaction conditions a feed stream comprising (a) a lower ketone having 3-5 carbon atoms per molecule and (b) carbon monoxide with a catalyst composition comprising copper oxide, zinc oxide and, optionally, alumina. The formed higher ketones contain at least one carbon atom per molecule more than the lower feed ketone, preferably methyl ethyl ketone.
摘要翻译：通过在合适的反应条件下使包含（a）每分子具有3-5个碳原子的低级酮和（b）一氧化碳与包含氧化铜，氧化锌和任选的氧化铝的催化剂组合物的进料流接触而制备的高级酮。形成的较高酮每分子含有至少一个碳原子比较低的原料酮优选甲基乙基酮。

7. 发明申请

US20130061963A1 SYSTEM FOR DELIVERING FRAC WATER AT HIGH PRESSURE 有权
标题翻译：高压输送系统
公开(公告)号：US20130061963A1
公开(公告)日：2013-03-14
申请号：US13356539
申请日：2012-01-23
申请人： David J. Elliott
发明人： David J. Elliott
IPC分类号： B67D7/70
CPC分类号： E21B43/26 , Y10T137/86131 , Y10T137/86139 , Y10T137/86147 , Y10T137/86187 , Y10T137/8622
摘要： A system for delivering frac water at high pressure is provided, including a first pump positionable within a tank, the first pump configured to receive water from within the tank and output the water at pressure to a first pressure tank; a second pump positionable above the first pressure tank, the second pump configured to receive water from the first pressure tank and output the water at pressure to a second pressure tank; and a third pump positionable above the second pressure tank, the third pump configured to receive water from the second pressure tank and output pressurized water to a discharge piping, the discharge piping leading said pressurized water over a wall of said tank.
摘要翻译：提供了一种用于在高压下输送压裂水的系统，包括可在罐内定位的第一泵，所述第一泵构造成从罐内接收水并将压力的水输出到第一压力罐; 第二泵定位在第一压力罐上方，第二泵构造成从第一压力罐接收水并将压力的水输出到第二压力罐; 以及位于所述第二压力罐上方的第三泵，所述第三泵构造成从所述第二压力罐接收水并将加压水输出到排出管道，所述排出管道将所述加压水导引在所述罐的壁上。

8. 发明申请

US20110147350A1 MODULAR APPARATUS FOR WAFER EDGE PROCESSING 审中-公开
标题翻译： WAF边缘加工的模块化设备
公开(公告)号：US20110147350A1
公开(公告)日：2011-06-23
申请号：US13034352
申请日：2011-02-24
申请人： Ronald P. Millman, JR. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott , Eugene O. Degenkolb
发明人： Ronald P. Millman, JR. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott , Eugene O. Degenkolb
IPC分类号： B23K26/38
CPC分类号： B23K37/0426 , B23K26/0619 , B23K26/0622 , B23K26/0676 , B23K26/0823 , B23K26/103 , B23K26/142 , B23K26/16 , B23K26/361 , B23K26/40 , B23K37/047 , B23K2101/40 , B23K2103/50
摘要： A modular wafer edge processing apparatus is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The modular apparatus can be integrated into wafer tracks, cluster tools, and other volume manufacturing systems. The edge processing apparatus of this invention includes a laser that can either be contained inside the module, or mounted externally to feed multiple modules and thereby reduce system cost. The apparatus contains a beam delivery subsystem to direct a beam of radiation onto the edges of a rotating substrate supported by a chuck. The optical system accurately and precisely directs the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
摘要翻译：公开了一种克服了半导体制造中使用的常规边缘处理方法和系统的限制的模块化晶片边缘处理装置。模块化设备可以集成到晶片轨道，集群工具和其他体积制造系统中。本发明的边缘处理装置包括可以被包含在模块内部的激光器，或者外部安装用于馈送多个模块，从而降低系统成本。该装置包含用于将辐射束引导到由卡盘支撑的旋转基板的边缘上的光束传送子系统。光学系统准确且精确地引导光束，以从空气的顶部边缘，顶部斜面，顶点，底部斜面和底部边缘中去除或转化有机或无机膜，膜堆，残余物或颗粒，单一工艺步骤通过包围反应部位的排气管除去反应副产物。本发明允许对边缘排除宽度的精确控制，导致晶片上可用的管芯数量的增加。本发明的晶圆边缘处理取代了现有的使用大量净化水和危险化学品（包括溶剂，酸，碱和专有剥离剂）的方法。

9. 发明申请

US20110139759A1 FIBER-OPTIC BEAM DELIVERY SYSTEM FOR WAFER EDGE PROCESSING 有权
标题翻译：用于波浪边缘处理的光纤光束传送系统
公开(公告)号：US20110139759A1
公开(公告)日：2011-06-16
申请号：US13034202
申请日：2011-02-24
申请人： Ronald P. Millman, JR. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott
发明人： Ronald P. Millman, JR. , Kenneth J. Harte , Victoria M. Chaplick , David J. Elliott
IPC分类号： B23K26/06
CPC分类号： B23K37/0426 , B23K26/0619 , B23K26/0622 , B23K26/0676 , B23K26/0823 , B23K26/103 , B23K26/142 , B23K26/16 , B23K26/361 , B23K26/40 , B23K37/047 , B23K2101/40 , B23K2103/50
摘要： A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer. Wafer edge processing with this invention replaces existing methods that use large volumes of purified water and hazardous chemicals including solvents, acids, alkalis, and proprietary strippers.
摘要翻译：公开了用于处理衬底边缘的方法和装置，其克服了半导体制造中使用的常规边缘处理方法和系统的限制。本发明的边缘处理方法和装置包括激光和光纤系统，用于将激光辐射引导到由卡盘支撑的旋转基底上。激光束被传送到一束光纤中，并且光纤精确地和精确地引导光束从大气中去除或转换有机或无机膜，膜堆，残余物或颗粒，从顶部边缘，顶部斜面，顶点，底部斜面和底部边缘，在单个工艺步骤中。通过包围反应部位的排气管除去反应副产物。本发明允许对边缘排除宽度的精确控制，导致晶片上可用的管芯数量的增加。本发明的晶圆边缘处理取代了现有的使用大量净化水和危险化学品（包括溶剂，酸，碱和专有剥离剂）的方法。

10. 发明授权

US07514015B2 Method for surface cleaning 失效
标题翻译：表面清洗方法
公开(公告)号：US07514015B2
公开(公告)日：2009-04-07
申请号：US10998465
申请日：2004-11-29
申请人： David J. Elliott , Ronald P. Millman, Jr. , Murray Tardif , Krista Aiello
发明人： David J. Elliott , Ronald P. Millman, Jr. , Murray Tardif , Krista Aiello
IPC分类号： H01L21/00 , C23C14/00 , C23C16/00
CPC分类号： B08B7/0042 , G03F7/427 , H01L21/31138 , H01L21/67005
摘要： A system for removing photoresist from semiconductor wafers is disclosed. The system utilizes a solid-state laser having wavelengths in the near-visible and visible portions of the electromagnetic spectrum to remove photoresist without requiring hazardous gases or wet solutions. In addition, the system does not damage the substrate being cleaned, nor leave a carbon residue requiring further processing to remove. The system uses photon energy, oxygen, water vapor and ozone to interact with contaminants on a surface, forming a gas reaction zone (GRZ). The GRZ reacts and completely removes the photoresist or other unwanted contamination.
摘要翻译：公开了一种用于从半导体晶片去除光致抗蚀剂的系统。该系统利用在电磁光谱的近可见和可见部分中具有波长的固态激光去除光致抗蚀剂而不需要有害气体或湿溶液。此外，该系统不会损坏被清洁的基板，也不会留下需要进一步处理以除去的碳残留物。该系统使用光子能量，氧气，水蒸汽和臭氧与表面上的污染物相互作用，形成气体反应区（GRZ）。 GRZ反应并完全去除光致抗蚀剂或其他不需要的污染物。

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