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    • 2. 发明授权
    • Integrated low-power pw/cw transmitter
    • 集成低功率pw / cw变送器
    • US07588539B2
    • 2009-09-15
    • US11039006
    • 2005-01-19
    • David A. Petersen
    • David A. Petersen
    • A61B8/00
    • B06B1/0223B06B1/0215
    • Integrated circuit transmitters allow for ultrasound imaging with both pulsed and continuous waves. High voltage and low voltage switches are integrated onto a same semiconductor chip. The high voltage switches are used for pulsed wave operation, and the low voltage switches are used for continuous wave operation. Power dissipation may be reduced by using low voltage circuits for the continuous wave operation. Both the pulsed and continuous waveforms are output on a common output from the integrated circuit. For continuous wave operation, one or more of the high voltage switches is used to provide a low resistance path to the common output or ground. For pulsed wave operation, one or more of the low voltage switches is used to provide a low resistance path to a common output or ground. A switch used for generating waveforms is also used for forming a low resistance path.
    • 集成电路发射器允许脉冲和连续波的超声波成像。 高压和低压开关集成在同一个半导体芯片上。 高压开关用于脉冲波操作,低压开关用于连续波动操作。 通过使用低压电路进行连续波动操作可能会降低功耗。 脉冲和连续波形都在集成电路的公共输出上输出。 对于连续波操作,一个或多个高压开关用于向公共输出或接地提供低电阻路径。 对于脉冲波操作,一个或多个低压开关用于向公共输出或地提供低电阻路径。 用于产生波形的开关也用于形成低电阻路径。
    • 6. 发明授权
    • Ultrasound front-end circuit combining the transmitter and automatic
transmit/receiver switch
    • 超声波前端电路组合发射机和自动发射/接收开关
    • US6083164A
    • 2000-07-04
    • US116315
    • 1998-07-15
    • Ralph OppeltDavid A. Petersen
    • Ralph OppeltDavid A. Petersen
    • B06B1/02G01S7/524G01S7/526A61B8/00
    • B06B1/0215G01S7/524G01S7/526G01S7/5202
    • An ultrasound front end circuit (1000) according to the present invention includes a single transformer core which performs all of the pulse and transmit/receive switching functions. A transmit pulser (1102) is formed by a pair of transistor switches in combination with a transformer having first windings (N1, N2) driven by a DC source. A secondary winding (N3) provides a voltage step up for transmitted wave forms and a pair of anti-parallel shunt diodes (1014) on the receiver terminal direct the transmitted 0 waveform to the ultrasound transducer (1024). A floating third winding (N4) shunted by a current biased diode bridge (1002) provides an effective open circuit across the secondary winding while transmitting high amplitude signals. The third winding (N4) and diode bridge (1002) act to short circuit the secondary winding (N3) while receiving small amplitude signals, thus providing a direct connection between the transducer (1024) and receiver (1020).
    • 根据本发明的超声波前端电路(1000)包括执行所有脉冲和发送/接收切换功能的单个变压器铁芯。 发射脉冲发生器(1102)由一对晶体管开关与具有由DC源驱动的第一绕组(N1,N2)的变压器组合形成。 次级绕组(N3)为发射波形提供升压电压,并且接收器端子上的一对反并联分流二极管(1014)将发射的0波形引导到超声换能器(1024)。 由电流偏置二极管电桥(1002)分流的浮置第三绕组(N4)在传输高幅度信号的同时在次级绕组上提供有效开路。 第三绕组(N4)和二极管桥(1002)用于在接收小振幅信号的同时使次级绕组(N3)短路,从而在换能器(1024)和接收器(1020)之间提供直接连接。
    • 9. 发明授权
    • Modular array and circuits for ultrasound transducers
    • 超声换能器的模块化阵列和电路
    • US08754574B2
    • 2014-06-17
    • US13090941
    • 2011-04-20
    • Richard Lee MorrisDavid A. Petersen
    • Richard Lee MorrisDavid A. Petersen
    • B06B1/06
    • B06B1/0629A61B8/4483
    • Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.
    • 为多维阵列提供模块化电子设备。 电子设备垂直于模块中的阵列。 这些模块包括支撑电子设备的框架,并提供阵列与电子设备之间的电气连接。 这些框架包括导热材料以将热量从电子设备和阵列传送出去。 框架形成表面以支撑阵列的一部分和单层柔性电路材料,在表面上具有用于电连接的焊盘和迹线。 柔性电路材料允许以不同于阵列的间距的间距连接到电子器件。 这些模块允许与不同尺寸的阵列一起使用相同的电子部件。 柔性电路材料的迹线和焊盘可以改变为不同的阵列,而不必重新设计电子器件和/或模块。
    • 10. 发明申请
    • Modular Array and Circuits for Ultrasound Transducers
    • 用于超声波传感器的模块化阵列和电路
    • US20120267981A1
    • 2012-10-25
    • US13090941
    • 2011-04-20
    • Richard Lee MorrisDavid A. Petersen
    • Richard Lee MorrisDavid A. Petersen
    • H01L41/107H04R31/00
    • B06B1/0629A61B8/4483
    • Modular electronics are provided for a multi-dimensional array. The electronics are positioned perpendicular to the array in modules. The modules include frames to support the electronics and provide for electrical connection between the array and the electronics. The frames include thermally conductive material to transfer heat away from the electronics and the array. The frames form a surface to support part of the array and a single layer of flexible circuit material with pads and traces over the surface for electrical connection. The flexible circuit material allows connection to the electronics at a pitch different than the pitch of the array. The modules allow the same electronics parts to be used with different sized arrays. The traces and pads of the flexible circuit material may be changed for different arrays without having to redesign the electronics and/or modules.
    • 为多维阵列提供模块化电子设备。 电子设备垂直于模块中的阵列。 这些模块包括支撑电子设备的框架,并提供阵列与电子设备之间的电气连接。 这些框架包括导热材料以将热量从电子设备和阵列传送出去。 框架形成表面以支撑阵列的一部分和单层柔性电路材料,在表面上具有用于电连接的焊盘和迹线。 柔性电路材料允许以不同于阵列的间距的间距连接到电子器件。 这些模块允许与不同尺寸的阵列一起使用相同的电子部件。 柔性电路材料的迹线和焊盘可以改变为不同的阵列,而不必重新设计电子器件和/或模块。