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1. 发明授权

US08108508B1 Web server chip for network manageability 失效
标题翻译： Web服务器芯片，用于网络管理
公开(公告)号：US08108508B1
公开(公告)日：2012-01-31
申请号：US09102207
申请日：1998-06-22
申请人： Dave Goh , Leena Sansguiri , Paul Chou , Nandakumar Natarajan , John A. Dilley , Marcos Frid , Robert H. Hyerle , Arne Luhrs , Chandrasekar Venkatraman
发明人： Dave Goh , Leena Sansguiri , Paul Chou , Nandakumar Natarajan , John A. Dilley , Marcos Frid , Robert H. Hyerle , Arne Luhrs , Chandrasekar Venkatraman
IPC分类号： G06F15/173
CPC分类号： G06F15/7842 , G06F11/3013 , G06F11/3058 , G06F11/3065 , G06F11/3409 , G06F11/3495 , H04L67/025 , H04L69/12
摘要： A network device includes a web server chip that is connectable to a computer network. The web server chip includes an embedded processor that is programmable to function as a manageability web server, obtain manageability information about the network device and send the manageability to a network manager. The web server chip further includes an interface for communicating with an I2C bus in the network device. The embedded processor is programmable to obtain manageability information about devices connected to the I2C bus. The embedded processor is also programmable to control fan controllers, power supply controllers and other controllers connected to the I2C bus. This, in turn, allows a network manager to command the web server chip to remotely power up and power down the network device. Thus, the web server chip can perform network management functions without burdening the host processor of the network device. If network communications are performed via HTTP, the embedded processor can be programmed to implement an HTTP server, and the network manger can use a web browser and HTML files to run network management software.
摘要翻译：网络设备包括可连接到计算机网络的网络服务器芯片。网络服务器芯片包括可编程以用作可管理性web服务器的嵌入式处理器，获得关于网络设备的可管理性信息并向网络管理器发送可管理性。网络服务器芯片还包括用于与网络设备中的I2C总线通信的接口。嵌入式处理器可编程，以获得有关连接到I2C总线的设备的可管理信息。嵌入式处理器也可编程控制风扇控制器，电源控制器和连接到I2C总线的其他控制器。这反过来又允许网络管理员命令网络服务器芯片远程加电并关闭网络设备。因此，网络服务器芯片可以执行网络管理功能，而不会加重网络设备的主机处理器。如果通过HTTP执行网络通信，则嵌入式处理器可以编程为实现HTTP服务器，网络管理员可以使用Web浏览器和HTML文件来运行网络管理软件。

2. 发明授权

US06373841B1 Integrated LAN controller and web server chip 失效
标题翻译：集成LAN控制器和Web服务器芯片
公开(公告)号：US06373841B1
公开(公告)日：2002-04-16
申请号：US09102205
申请日：1998-06-22
申请人： Dave Goh , Paul Chou , Leena Sansguiri , Ronald Kroesen , Nandakumar Natarajan , John A. Dilley , Marcos Frid , Robert H. Hyerle , Arne Luhrs , Chandrasekar Venkatraman
发明人： Dave Goh , Paul Chou , Leena Sansguiri , Ronald Kroesen , Nandakumar Natarajan , John A. Dilley , Marcos Frid , Robert H. Hyerle , Arne Luhrs , Chandrasekar Venkatraman
IPC分类号： H04J302
CPC分类号： H04L41/046 , H04L41/0893 , H04L41/22 , H04L67/02
摘要： A chip for a device such as a computer includes a media access controller and an embedded processor. The embedded processor is programmed to function as a web server and provide network manageability information to a network manager. The embedded processor is also programmed to function as a LAN controller. When a packet is received by the media access controller, the embedded processor examines a destination address of the packet and routes the packet to an appropriate end point. Packets having a first unique destination address are routed to a host interface (and eventually to a host processor), and packets having a second unique address are routed to the embedded processor-functioning-as-web server. Thus, the chip allows network management and local area network communications to be performed over a single physical interface.
摘要翻译：用于诸如计算机的设备的芯片包括媒体访问控制器和嵌入式处理器。嵌入式处理器被编程为用作Web服务器并向网络管理器提供网络管理信息。嵌入式处理器也被编程为作为LAN控制器。当媒体接入控制器接收到分组时，嵌入式处理器检查分组的目的地址并将分组路由到适当的终点。具有第一唯一目的地地址的分组被路由到主机接口（并且最终到主处理器），并且具有第二唯一地址的分组被路由到嵌入式处理器功能的web服务器。因此，芯片允许通过单个物理接口执行网络管理和局域网通信。

3. 发明授权

US08334704B2 Systems and methods for providing a system-on-a-substrate 有权
标题翻译：用于提供衬底上系统的系统和方法
公开(公告)号：US08334704B2
公开(公告)日：2012-12-18
申请号：US12565085
申请日：2009-09-23
申请人： Gloria Lin , Bryson Gardner, Jr. , Joseph Fisher, Jr. , Dave Goh , Barry Corlett , Dennis Pyper , Amir Salehi
发明人： Gloria Lin , Bryson Gardner, Jr. , Joseph Fisher, Jr. , Dave Goh , Barry Corlett , Dennis Pyper , Amir Salehi
IPC分类号： G01R31/20
CPC分类号： G06F1/16 , H05K1/147 , H05K1/189 , H05K2201/10159 , H05K2201/10515
摘要： This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.
摘要翻译：这涉及用于提供衬底上系统的系统和方法。在一些实施例中，整个系统（例如，处理器，存储器，加速度计，I / O电路或任何其它合适的部件）的必要组件可以在裸片形式的单个微芯片上制造。例如，管芯可以通过基板和柔性印刷电路板（挠性）耦合到合适的闪存。在一些实施例中，柔性件可以延伸经过衬底，管芯或两者，以允许附加的相对较大的部件联接到弯曲部。在一些实施例中，管芯可以通过弯曲而不与衬底耦合到闪存。在一些实施例中，组件测试点可以放置在衬底的闪存侧。

4. 发明申请

US20100213958A1 SYSTEMS AND METHODS FOR PROVIDING A SYSTEM-ON-A-SUBSTRATE 有权
标题翻译：用于提供基片系统的系统和方法
公开(公告)号：US20100213958A1
公开(公告)日：2010-08-26
申请号：US12565085
申请日：2009-09-23
申请人： Gloria Lin , Bryson Gardner, JR. , Joseph Fisher, JR. , Dave Goh , Barry Corlett , Dennis Pyper , Amir Salehi
发明人： Gloria Lin , Bryson Gardner, JR. , Joseph Fisher, JR. , Dave Goh , Barry Corlett , Dennis Pyper , Amir Salehi
IPC分类号： G01R31/02 , H05K1/00
CPC分类号： G06F1/16 , H05K1/147 , H05K1/189 , H05K2201/10159 , H05K2201/10515
摘要： This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.
摘要翻译：这涉及用于提供衬底上系统的系统和方法。在一些实施例中，整个系统（例如，处理器，存储器，加速度计，I / O电路或任何其它合适的部件）的必要组件可以以“裸模”形式制造在单个微芯片上。例如，管芯可以通过基板和柔性印刷电路板（“挠曲”）耦合到合适的闪存。在一些实施例中，柔性件可以延伸经过衬底，管芯或两者，以允许附加的相对较大的部件联接到弯曲部。在一些实施例中，管芯可以通过弯曲而不与衬底耦合到闪存。在一些实施例中，组件测试点可以放置在衬底的闪存侧。

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