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1. 发明授权

US06226184B1 Enclosure mounted heat sink 失效
标题翻译：外壳安装散热器
公开(公告)号：US06226184B1
公开(公告)日：2001-05-01
申请号：US09427126
申请日：1999-10-22
申请人： Howard W. Stolz , Jay K. Osborn , Daniel B. Hruska
发明人： Howard W. Stolz , Jay K. Osborn , Daniel B. Hruska
IPC分类号： H05K720
CPC分类号： H05K7/2049 , G06F1/20 , H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A heat sink for a heat generating component of a computer system, such as a central processing unit (CPU), attaches to the computer system enclosure. The heat sink may be pressed against the component to establish thermal contact with the component. Because the heat sink attaches to the computer system enclosure and not the component, the component socket, or a circuit board; the heat sink may be unusually shaped and large, while still allowing easy access to the components mounted within the computer system enclosure. Removing the enclosure panel on which the sink is attached may allow easy access to the components within the computer enclosure. The heat sink may be particularly useful in computer systems that use only natural convection cooling.
摘要翻译：用于诸如中央处理单元（CPU）的计算机系统的发热部件的散热器附接到计算机系统外壳。可以将散热器压靠在部件上以与部件建立热接触。因为散热器连接到计算机系统机箱，而不是组件，组件插座或电路板; 散热器可能异常形状大，同时仍然允许容易地访问安装在计算机系统外壳内的组件。卸下连接水槽的外壳面板可以方便地访问计算机外壳内的组件。散热器可能在仅使用自然对流冷却的计算机系统中特别有用。

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