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1. 发明申请

US20100178483A1 INSULATING FILM 有权
标题翻译：绝缘膜
公开(公告)号：US20100178483A1
公开(公告)日：2010-07-15
申请号：US12665618
申请日：2008-06-19
申请人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa
发明人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa
IPC分类号： B32B27/04 , B32B27/32 , B32B5/02
CPC分类号： H01G4/18 , C08J5/18 , C08J2325/06 , H01G4/224 , Y10S428/91 , Y10T428/25 , Y10T428/254 , Y10T428/259 , Y10T428/31855
摘要： An object of the present invention is to provide an insulating film having a high breakdown voltage and excellent heat resistance and handling properties.The present invention is a biaxially oriented insulating film which contains (i) a styrene-based polymer having a syndiotactic structure and (ii) particles and which has a refractive index in the thickness direction of 1.6050 to 1.6550.
摘要翻译：本发明的目的是提供具有高击穿电压和优异的耐热性和操作性能的绝缘膜。本发明是一种双轴取向绝缘膜，其包含（i）具有间同立构结构的苯乙烯类聚合物和（ii）粒子，其厚度方向的折射率为1.6050〜1.6550。

2. 发明授权

US07650692B2 Method for mounting electronic-component module 有权
标题翻译：电子元件模块的安装方法
公开(公告)号：US07650692B2
公开(公告)日：2010-01-26
申请号：US12052087
申请日：2008-03-20
申请人： Kunihiro Koyama , Muneyoshi Yamamoto , Takanori Uejima , Dai Nakagawa , Masaki Kimura
发明人： Kunihiro Koyama , Muneyoshi Yamamoto , Takanori Uejima , Dai Nakagawa , Masaki Kimura
IPC分类号： H05K3/30
CPC分类号： H01L25/165 , H01L23/3121 , H01L24/16 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/288 , H05K3/303 , H05K2201/0125 , H05K2203/0195 , H05K2203/082 , H05K2203/083 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T428/24917 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
摘要翻译：吸引面构件设置在电子部件模块上，该电子部件模块包括电子部件基板和安装在电子部件基板上的表面安装装置，以便在与基本上等于或高于作为最高的表面安装器件的晶体管的上端。吸头粘附到吸力表面以保持电子部件模块，电子部件模块安装在限定目标板的主板上。然后进行处理以防止吸附表面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。

3. 发明授权

US10438746B2 Insulating film 有权
公开(公告)号：US10438746B2
公开(公告)日：2019-10-08
申请号：US13512515
申请日：2010-11-26
申请人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa , Masanori Nishiyama
发明人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa , Masanori Nishiyama
IPC分类号： C08L71/12 , H01G4/18 , C08J5/18 , C08L25/06 , C08K5/00 , C08L83/04 , C08K3/013
摘要： Provided is a highly insulating film having excellent electrical characteristics (breakdown voltage), heat resistance, and handling properties such as windability and processability. The highly insulating film is a biaxially stretched film made of a styrene polymer having a syndiotactic structure as a main component. The highly insulating film contains specific inert fine particles A, antioxidant, and polymer Y having a glass transition temperature Tg by DSC of 130° C. or more each in a specific amount, and has a refractive index in the thickness direction of 1.5750 or more and 1.6350 or less.

4. 发明授权

US08859087B2 Insulating film 有权
标题翻译：绝缘膜
公开(公告)号：US08859087B2
公开(公告)日：2014-10-14
申请号：US12665618
申请日：2008-06-19
申请人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa
发明人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa
IPC分类号： C08J5/18 , H01G4/224 , B32B27/04 , B32B27/32 , H01G4/18
CPC分类号： H01G4/18 , C08J5/18 , C08J2325/06 , H01G4/224 , Y10S428/91 , Y10T428/25 , Y10T428/254 , Y10T428/259 , Y10T428/31855
摘要： The present invention is to provide an insulating film having a high breakdown voltage and excellent heat resistance and handling properties. The present invention is a biaxially oriented insulating film which contains (i) a styrene-based polymer having a syndiotactic structure and (ii) particles and which has a refractive index in the thickness direction of 1.6050 to 1.6550.
摘要翻译：本发明提供一种具有高击穿电压和优异的耐热性和操作性能的绝缘膜。本发明是一种双轴取向绝缘膜，其包含（i）具有间同立构结构的苯乙烯类聚合物和（ii）粒子，其厚度方向的折射率为1.6050〜1.6550。

5. 发明申请

US20140193537A1 DIE AND METHOD OF PRODUCING DIE 审中-公开
标题翻译： DIE的生产和制造方法
公开(公告)号：US20140193537A1
公开(公告)日：2014-07-10
申请号：US14237778
申请日：2011-08-11
申请人： Dai Nakagawa
发明人： Dai Nakagawa
IPC分类号： B29C47/00 , B23P15/24
CPC分类号： B29C48/11 , B23P15/24 , B23P15/243 , B28B3/269 , B29C48/022 , Y10T29/49826
摘要： Provided are a low-cost and highly-precise structure-molding die that only requires a short production time, and a method of producing the die.The die is characterized by including: a plate-like first member 10 that serves as a base; a second member 2 that has cells 2 of a shape matching a to-be-molded structure and is joined to the first member 10; molding grooves 7 that have a predetermined depth and are disposed between the cells 2; and a supply hole 6 that communicates with the first member 10 at a predetermined intersection of the molding grooves 7 from an opposite side from the cells 2 joined.
摘要翻译：提供了仅需要较短生产时间的低成本且高精度的结构成型模具，以及制造模具的方法。模具的特征在于包括：用作基座的板状第一构件10; 第二构件2，其具有与待模制结构匹配的形状的单元2并且接合到第一构件10; 具有预定深度并设置在单元2之间的成型槽7; 以及供给孔6，其与来自与所连接的电池2相反的一侧的成型槽7的预定交叉处与第一部件10连通。

6. 发明授权

US08179206B2 Low-voltage control high-frequency switch and composite high-frequency component 有权
标题翻译：低压控制高频开关和复合高频部件
公开(公告)号：US08179206B2
公开(公告)日：2012-05-15
申请号：US12203991
申请日：2008-09-04
申请人： Dai Nakagawa , Naoki Nakayama
发明人： Dai Nakagawa , Naoki Nakayama
IPC分类号： H01P1/15 , H04B1/44
CPC分类号： H01P1/15 , H01P1/2135 , H04B1/525
摘要： In a transmission/reception selection switch, a first diode is arranged in series with a transmission signal line and a second diode is arranged in shunt with a reception signal line. A first current route where a direct current passes through the first diode is connected in parallel to a second current route where a direct current passes through the second diode. When a predetermined positive voltage is applied to a control terminal, the diodes are turned ON and a direct current flows through, in order, the control terminal, a resistor, an inductor, the diode, a strip line, and an inductor), and a direct current flows through, in order, the control terminal, the resistor, the second diode, and the inductor.
摘要翻译：在发送/接收选择开关中，第一二极管与发送信号线串联布置，并且第二二极管被布置成与接收信号线分流。直流电流通过第一二极管的第一电流路径与直流通过第二二极管的第二电流路径并联连接。当将预定的正电压施加到控制端子时，二极管导通，并且直流电流按顺序流过控制端子，电阻器，电感器，二极管，带状线和电感器），以及直流电流依次流过控制端子，电阻器，第二二极管和电感器。

7. 发明申请

US20080192447A1 METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE 有权
标题翻译：用于安装电子元件模块的方法，使用其制造电子设备的方法和电子组件模块
公开(公告)号：US20080192447A1
公开(公告)日：2008-08-14
申请号：US12052087
申请日：2008-03-20
申请人： Kunihiro KOYAMA , Muneyoshi YAMAMOTO , Takanori UEJIMA , Dai NAKAGAWA , Masaki KIMURA
发明人： Kunihiro KOYAMA , Muneyoshi YAMAMOTO , Takanori UEJIMA , Dai NAKAGAWA , Masaki KIMURA
IPC分类号： H05K5/00 , H05K3/30
CPC分类号： H01L25/165 , H01L23/3121 , H01L24/16 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/288 , H05K3/303 , H05K2201/0125 , H05K2203/0195 , H05K2203/082 , H05K2203/083 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T428/24917 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
摘要翻译：吸引面构件设置在电子部件模块上，该电子部件模块包括电子部件基板和安装在电子部件基板上的表面安装装置，以便在与基本上等于或高于作为最高的表面安装器件的晶体管的上端。吸头粘附到吸力表面以保持电子部件模块，电子部件模块安装在限定目标板的主板上。然后进行处理以防止吸附表面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。

8. 发明授权

US09617407B2 Highly insulating film 有权
公开(公告)号：US09617407B2
公开(公告)日：2017-04-11
申请号：US14113485
申请日：2012-04-25
申请人： Takashi Nakahiro , Dai Nakagawa , Tetsuo Yoshida , Masanori Nishiyama
发明人： Takashi Nakahiro , Dai Nakagawa , Tetsuo Yoshida , Masanori Nishiyama
IPC分类号： C08L25/06 , C08J5/18 , B29C37/00 , B29C55/02 , B29C55/14 , H01B17/56 , B29K25/00 , B29K71/00
CPC分类号： C08L25/06 , B29C37/0025 , B29C55/026 , B29C55/143 , B29K2025/04 , B29K2071/12 , C08J5/18 , C08J2325/04 , C08J2471/12 , H01B17/56 , Y10T428/265 , Y10T428/31663 , Y10T428/31801 , Y10T428/31938
摘要： This invention is a highly insulating film, which is characterized by including a biaxially stretched film containing a styrene polymer having a syndiotactic structure as a main component, containing a thermoplastic amorphous resin Y having a glass transition temperature Tg by DSC of 130° C. or higher in an amount of 5% by mass or more and 48% by mass or less, and having a plane orientation coefficient (AP) represented by the following equation (1) of −0.027 or less: ΔP=(Nx+Ny)/2−Nz (1). In equation (1), Nx represents the minimum value of the refractive index in the plane direction of the film, Ny represents the refractive index in the direction perpendicular to Nx in the plane direction of the film, and Nz represents the refractive index in the thickness direction of the film.

9. 发明申请

US20120232209A1 HIGHLY INSULATING FILM 审中-公开
标题翻译：高绝缘膜
公开(公告)号：US20120232209A1
公开(公告)日：2012-09-13
申请号：US13512515
申请日：2010-11-26
申请人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa , Masanori Nishiyama
发明人： Shigeyoshi Masuda , Dai Nakagawa , Kinji Hasegawa , Masanori Nishiyama
IPC分类号： H01B3/42 , H01B3/46 , C08L83/00 , B32B5/16 , C08L71/12
CPC分类号： H01G4/18 , C08J5/18 , C08J2325/04 , C08K3/013 , C08K5/005 , C08L25/06 , C08L71/12 , C08L83/04 , C08L2205/03 , C08L2666/14 , C08L25/04
摘要： Provided is a highly insulating film having excellent electrical characteristics (breakdown voltage), heat resistance, and handling properties such as windability and processability. The highly insulating film is a biaxially stretched film made of a styrene polymer having a syndiotactic structure as a main component. The highly insulating film contains specific inert fine particles A, antioxidant, and polymer Y having a glass transition temperature Tg by DSC of 130° C. or more each in a specific amount, and has a refractive index in the thickness direction of 1.5750 or more and 1.6350 or less.
摘要翻译：提供了具有优异的电特性（击穿电压），耐热性和诸如缠绕性和加工性的处理性能的高绝缘膜。高绝缘膜是以间同立构结构为主要成分的苯乙烯聚合物制成的双轴拉伸膜。高绝缘膜含有特定的惰性微粒A，抗氧化剂和DSC，DSC为130℃以上，特定量的玻璃化转变温度Tg的聚合物Y，其厚度方向的折射率为1.5750以上和1.6350以下。

10. 发明申请

US20100085722A1 METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE 审中-公开
标题翻译：用于安装电子元件模块的方法，使用其制造电子设备的方法和电子组件模块
公开(公告)号：US20100085722A1
公开(公告)日：2010-04-08
申请号：US12631970
申请日：2009-12-07
申请人： Kunihiro KOYAMA , Muneyoshi YAMAMOTO , Takanori UEJIMA , Dai NAKAGAWA , Masaki KIMURA
发明人： Kunihiro KOYAMA , Muneyoshi YAMAMOTO , Takanori UEJIMA , Dai NAKAGAWA , Masaki KIMURA
IPC分类号： H05K7/02
CPC分类号： H01L25/165 , H01L23/3121 , H01L24/16 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01004 , H01L2924/16152 , H01L2924/19041 , H01L2924/19105 , H01L2924/3025 , H05K1/141 , H05K3/284 , H05K3/288 , H05K3/303 , H05K2201/0125 , H05K2203/0195 , H05K2203/082 , H05K2203/083 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49165 , Y10T428/24917 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.
摘要翻译：吸引面构件设置在电子部件模块上，该电子部件模块包括电子部件基板和安装在电子部件基板上的表面安装装置，以便在与基本上等于或高于作为最高的表面安装器件的晶体管的上端。吸头粘附到吸力表面以保持电子部件模块，电子部件模块安装在限定目标板的主板上。然后进行处理以防止吸附表面构件的上端高于安装在电子部件基板上的最高表面安装装置的上端的情况。

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