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1. 发明申请

WO2006055145A3 CURRENT COLLIMATION FOR THIN SEED AND DIRECT PLATING 审中-公开
标题翻译：目前的种植和直接施肥
公开(公告)号：WO2006055145A3
公开(公告)日：2007-06-28
申请号：PCT/US2005037149
申请日：2005-10-14
申请人： APPLIED MATERIALS INC , HERCHEN HARALD , DUKOVIC JOHN O , PANG LILY
发明人： HERCHEN HARALD , DUKOVIC JOHN O , PANG LILY
IPC分类号： H01L21/288 , C25D7/12 , C25D17/10 , C25D17/12
CPC分类号： C25D17/008 , C25D7/123 , C25D17/001 , C25D17/007
摘要： A method and apparatus for plating a conductive material onto a substrate is provided. The apparatus includes a fluid processing cell having a fluid basin configured to contain an electrolyte solution and having an opening configured to receive a substrate for processing, an anode assembly positioned in the fluid basin, and a collimator positioned in the fluid basin between the anode assembly and the opening.
摘要翻译：提供了一种用于将导电材料电镀到基底上的方法和装置。该装置包括流体处理池，流体池被配置为容纳电解质溶液，并且具有构造成接收用于处理的基板的开口，定位在流体池中的阳极组件和位于阳极组件之间的流体池中的准直器和开幕。

2. 发明申请

WO2008070528A3 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：精密印刷通过太阳能电池基板上的电镀掩模进行电镀
公开(公告)号：WO2008070528A3
公开(公告)日：2008-07-24
申请号：PCT/US2007085963
申请日：2007-11-29
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
发明人： LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。本文描述的装置和方法消除了进行掩模准备和形成步骤（例如丝网印刷，平版印刷步骤和喷墨印刷步骤）经常昂贵的处理步骤以形成接触结构的需要。在太阳能电池装置中形成的互连电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

3. 发明申请

WO2007111676A3 METHOD OF DIRECT PLATING OF COPPER ON A SUBSTRATE STRUCTURE 审中-公开
标题翻译：在基板结构上直接镀铜的方法
公开(公告)号：WO2007111676A3
公开(公告)日：2007-12-27
申请号：PCT/US2006060072
申请日：2006-10-19
申请人： APPLIED MATERIALS INC , ROSENFELD ARON , HAFEZI HOOMAN , CHUNG HUA , DUKOVIC JOHN O , ZHU LEI , KOVARSKY NICOLAY , HE RENREN , SUN ZHI-WEN
发明人： ROSENFELD ARON , HAFEZI HOOMAN , CHUNG HUA , DUKOVIC JOHN O , ZHU LEI , KOVARSKY NICOLAY , HE RENREN , SUN ZHI-WEN
IPC分类号： C25D5/34
CPC分类号： C25D5/34 , C25D3/38 , C25D5/10 , C25D5/18 , C25D5/54 , H01L21/2885 , H01L21/76843 , H01L21/76846 , H01L21/76861 , H01L21/76862 , H01L21/76868 , H01L21/76873 , H01L21/76877 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： The present invention teaches a method for depositing a copper seed layer onto a substrate surface, generally onto a barrier layer. The barrier layer may include a refractory metal and/or a group 8, 9 or 10 metal. The method includes cathodically pre-treating the substrate in an acid-containing solution. The substrate is then placed into a copper solution that includes complexed copper ions and a current or bias is applied across the substrate surface. The complexed copper ions are reduced to deposit a copper seed layer onto the barrier layer. In one aspect, a complex alkaline bath is then used to electrochemically plate a gapfill layer on the substrate surface, followed by overfill in the same bath. In another aspect, an acidic bath ECP gapfill process and overfill process follow the alkaline seed layer process.
摘要翻译：本发明教导了一种用于将铜籽晶层沉积到衬底表面上的方法，通常在阻挡层上。阻挡层可以包括难熔金属和/或8,9或10族金属。该方法包括在含酸溶液中阴极预处理基材。然后将衬底放入包含复合铜离子的铜溶液中，并在衬底表面上施加电流或偏压。复合的铜离子被还原以在阻挡层上沉积铜晶种层。一方面，然后使用复杂的碱性电池在衬底表面上电化学沉积填隙层，然后在同一浴中过充。另一方面，酸性浴ECP间隙填充工艺和过度填充工艺遵循碱性种子层工艺。

4. 发明申请

WO2008070568A3 APPARATUS AND METHOD FOR ELECTROPLATING ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：用于电镀在太阳能电池基板上的装置和方法
公开(公告)号：WO2008070568A3
公开(公告)日：2008-09-12
申请号：PCT/US2007086145
申请日：2007-11-30
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
发明人： LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/34 , C23C28/36 , C25D5/022 , C25D5/08 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/06 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新颖的方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的具有选择性地形成的金属线的金属接触结构。本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

5. 发明申请

WO2008070528A2 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：精密印刷通过太阳能电池基板上的电镀掩模进行电镀
公开(公告)号：WO2008070528A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/085963
申请日：2007-11-29
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , DUKOVIC, John O. , EAGLESHAM, David , KOVARSKY, Nicolay Y. , BACHRACH, Robert , BUSCH, John , GAY, Charles
发明人： LOPATIN, Sergey , DUKOVIC, John O. , EAGLESHAM, David , KOVARSKY, Nicolay Y. , BACHRACH, Robert , BUSCH, John , GAY, Charles
IPC分类号： B05C13/02 , H01L21/469
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.
摘要翻译：本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。本文描述的装置和方法不需要执行经常昂贵的处理步骤来执行掩模准备和形成步骤，例如丝网印刷，光刻步骤和喷墨印刷步骤，以形成接触结构。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。本发明的实施例可以提供一种形成在一个或多个电化学沉积步骤期间利用可重复使用的掩模装置的太阳能电池装置的装置和方法。

6. 发明申请

WO2008070290A1 PULSE PLATING OF A LOW STRESS FILM ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：在太阳能电池基板上的低应力膜的脉冲电镀
公开(公告)号：WO2008070290A1
公开(公告)日：2008-06-12
申请号：PCT/US2007/081530
申请日：2007-10-16
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , GAY, Charles , EAGLESHAM, David , DUKOVIC, John O. , KOVARSKY, Nicolay Y.
发明人： LOPATIN, Sergey , GAY, Charles , EAGLESHAM, David , DUKOVIC, John O. , KOVARSKY, Nicolay Y.
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L31/02245 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell metal contact structure that has improved electrical and mechanical properties through the use of an electrochemical plating process. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connections that is reliable and cost effective. One or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing common metal, such as copper. However, generally the electroplated portions of the interconnecting layer may contain a substantially pure metal or a metal alloy layer. Methods are discussed herein that are used to form a solar cell containing conductive metal interconnect layer(s) that have a low intrinsic stress.
摘要翻译：本发明的实施例考虑到通过使用电化学电镀工艺形成具有改善的电气和机械性能的低成本太阳能电池金属接触结构。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。使用本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。然而，通常互连层的电镀部分可以包含基本上纯的金属或金属合金层。本文讨论了用于形成含有具有低固有应力的导电金属互连层的太阳能电池的方法。

7. 发明申请

WO2008070568A2 APPARATUS AND METHOD FOR ELECTROPLATING ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：用于在太阳能电池基板上电镀的装置和方法
公开(公告)号：WO2008070568A2
公开(公告)日：2008-06-12
申请号：PCT/US2007/086145
申请日：2007-11-30
申请人： APPLIED MATERIALS, INC. , LOPATIN, Sergey , KOVARSKY, Nicolay Y. , EAGLESHAM, David , DUKOVIC, John O. , GAY, Charles
发明人： LOPATIN, Sergey , KOVARSKY, Nicolay Y. , EAGLESHAM, David , DUKOVIC, John O. , GAY, Charles
IPC分类号： C25D5/10 , C25D5/12 , H01L31/00
CPC分类号： H01L31/022425 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/34 , C23C28/36 , C25D5/022 , C25D5/08 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/06 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新颖的方法和设备形成使用电化学电镀工艺形成具有选择性形成的金属线的金属接触结构的低成本太阳能电池。本文描述的设备和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响了太阳能电池的效率。因此期望形成具有可靠且成本有效的低电阻连接的太阳能电池装置。因此，这里描述的本发明的一个或多个实施例适于使用包含诸如铜的常见金属的电化学电镀工艺形成低成本且可靠的互连层。

8. 发明申请

WO2006096418A3 PLATING OF A THIN METAL SEED LAYER 审中-公开
标题翻译：镀一层薄金属层
公开(公告)号：WO2006096418A3
公开(公告)日：2007-10-25
申请号：PCT/US2006007303
申请日：2006-03-01
申请人： APPLIED MATERIALS INC , KOVARSKY NICOLAY , WANG YOU , DUKOVIC JOHN O , RODRIGUEZ IVAN
发明人： KOVARSKY NICOLAY , WANG YOU , DUKOVIC JOHN O , RODRIGUEZ IVAN
IPC分类号： C25D5/18 , H01L21/44
CPC分类号： C25D17/10 , C25D5/18 , C25D7/123 , H01L21/2885 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： An apparatus and method for plating a metal layer onto a substrate is provided. A catholyte volume is positioned to receive a substrate for plating. An anolyte volume having one or more anode segments positioned therein is ionically separated from the catholyte volume. An auxiliary volume having an auxiliary electrode positioned therein is provided to be electrically isolated from the anolyte fluid volume and in ionic communication with the catholyte volume. A method of plating includes a first stage of plating a thin metal seed uniformly in the center and near the edges of the substrate by providing a current pulse from two power supplies which are in reverse electrical polarity with one anode segment and the auxiliary electrode. Thereafter, gap filling of features and bulk metal plating are performed by applying a second current pulse to all anode segments.
摘要翻译：提供了将金属层电镀到基板上的装置和方法。阴极电解液体积被定位成接收用于电镀的基底。具有位于其中的一个或多个阳极段的阳极电解液体与阴极电解液体积离子地分离。提供具有位于其中的辅助电极的辅助体积以与阳极电解液体积电离并与阴极电解液体积离子连通。电镀方法包括：通过从与一个阳极段和辅助电极反向电极性的两个电源提供电流脉冲，在第一阶段中均匀地在基板的中心和边缘处电镀薄金属种子。此后，通过向所有阳极段施加第二电流脉冲来执行特征和体金属电镀的间隙填充。

9. 发明申请

WO2006012112A3 ELECTROCHEMICAL PLATING CELL WITH AN AUXILIARY ELECTRODE IN AN ISOLATED ANOLYTE COMPARTMENT 审中-公开
标题翻译：电化学镀膜电池与分离电极在独立的分离室
公开(公告)号：WO2006012112A3
公开(公告)日：2006-06-22
申请号：PCT/US2005021894
申请日：2005-06-20
申请人： APPLIED MATERIALS INC , KOVARSKY NICOLAY , CHANG ANZHONG , SINGH SARAVJEET , WANG YOU , DUKOVIC JOHN O
发明人： KOVARSKY NICOLAY , CHANG ANZHONG , SINGH SARAVJEET , WANG YOU , DUKOVIC JOHN O
IPC分类号： C25D7/12 , C25B9/08 , C25D17/00 , C25D19/00 , H01L21/288 , H01L21/768
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/22 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： An apparatus and method for plating a metal layer onto a substrate is provided. A catholyte volume is positioned to receive a substrate for plating. An anolyte volume having one or more anode segments positioned therein is ionically separated from the catholyte volume. An auxiliary volume having an auxiliary electrode positioned therein is provided to be electrically isolated from the anolyte fluid volume and in ionic communication with the catholyte volume. A method of plating includes a first stage of plating a thin metal seed uniformly in the center and near the edges of the substrate by providing a current pulse from two power supplies which are in reverse electrical polarity with one anode segment and the auxiliary electrode. Thereafter, gap filling of features and bulk metal plating are performed by applying a second current pulse to all anode segments.
摘要翻译：提供了将金属层电镀到基板上的装置和方法。阴极电解液体积被定位成接收用于电镀的基底。具有位于其中的一个或多个阳极段的阳极电解液体与阴极电解液体积离子地分离。提供具有位于其中的辅助电极的辅助体积以与阳极电解液体积电离并与阴极电解液体积离子连通。电镀方法包括：通过从与一个阳极段和辅助电极反向电极性的两个电源提供电流脉冲，在第一阶段中均匀地在基板的中心和边缘处电镀薄金属种子。此后，通过向所有阳极段施加第二电流脉冲来执行特征和体金属电镀的间隙填充。

10. 发明申请

WO2006012112A2 ELECTROCHEMICAL PLATING CELL WITH AN AUXILIARY ELECTRODE IN AN ISOLATED ANOLYTE COMPARTMENT 审中-公开
标题翻译：在隔离型电解质隔室中配有辅助电极的电化学电镀
公开(公告)号：WO2006012112A2
公开(公告)日：2006-02-02
申请号：PCT/US2005/021894
申请日：2005-06-20
申请人： APPLIED MATERIALS, INC. , KOVARSKY, Nicolay , CHANG, Anzhong , SINGH, Saravjeet , WANG, You , DUKOVIC, John, O.
发明人： KOVARSKY, Nicolay , CHANG, Anzhong , SINGH, Saravjeet , WANG, You , DUKOVIC, John, O.
IPC分类号： C25D7/12 , C25D19/00 , H01L21/768
CPC分类号： H01L21/2885 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/22 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： An apparatus and method for plating a metal layer onto a substrate is provided. A catholyte volume is positioned to receive a substrate for plating. An anolyte volume having one or more anode segments positioned therein is ionically separated from the catholyte volume. An auxiliary volume having an auxiliary electrode positioned therein is provided to be electrically isolated from the anolyte fluid volume and in ionic communication with the catholyte volume. A method of plating includes a first stage of plating a thin metal seed uniformly in the center and near the edges of the substrate by providing a current pulse from two power supplies which are in reverse electrical polarity with one anode segment and the auxiliary electrode. Thereafter, gap filling of features and bulk metal plating are performed by applying a second current pulse to all anode segments.
摘要翻译：提供了一种用于将金属层电镀到衬底上的设备和方法。阴极电解液体积被定位以接收用于电镀的衬底。具有位于其中的一个或多个阳极片段的阳极电解液体积与阴极电解液体积离子分离。提供具有位于其中的辅助电极的辅助体积，以与阳极电解液流体体积电绝缘并且与阴极电解液体积离子连通。一种电镀方法包括通过提供来自两个电源的电流脉冲在中心和靠近衬底边缘均匀地电镀薄金属种子的第一阶段，所述电源与一个阳极段和辅助电极反向电极性。之后，通过向所有阳极段施加第二电流脉冲来执行特征和大块金属镀层的间隙填充。

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