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1. 发明申请

US20060293498A1 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board 失效
标题翻译：聚酰胺酰亚胺树脂，柔性金属包覆层压板和柔性印刷线路板
公开(公告)号：US20060293498A1
公开(公告)日：2006-12-28
申请号：US11515234
申请日：2006-08-31
申请人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
发明人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
IPC分类号： C08G69/08
CPC分类号： C08G73/14 , B32B15/08 , C09D179/08 , H05K1/0346 , Y10T428/31725 , Y10T428/31765
摘要： The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month—initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate. Moreover, since the solder heat resistance and the insulation properties are not impaired even after humidification and since the heat resistant resin is soluble in organic solvents with high solution stability, the flexible metal-clad laminate of the invention can be inexpensively produced.
摘要翻译：本发明提供可溶于10％浓度的酰胺溶剂的无卤素聚酰胺酰亚胺树脂，所得清漆在5℃下储存1个月后，溶液粘度变化（（溶液粘度1 月初始溶液粘度）/初始溶液粘度（绝对值）为3.0以下，吸湿性（25℃，90％RH，24小时）的树脂为2.0％以下 ; 使用这种树脂的柔性金属包覆层压板; 以及通过电路形成由这种柔性覆金属层压板制备的柔性印刷线路板。本发明的柔性覆金属层压板在包括潮湿条件在内的任何条件下都不会卷曲，并且由于用作绝缘材料的耐热树脂具有低吸湿性和低热膨胀系数，并且内应力较小在柔性覆金属层压板中。此外，由于即使在加湿之后焊料耐热性和绝缘性也不受损害，并且由于耐热树脂可溶于高溶液稳定性的有机溶剂中，因此可以廉价地制造本发明的柔性覆金属层压板。

2. 发明授权

US07364799B2 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board 有权
标题翻译：聚酰胺酰亚胺树脂，柔性金属包覆层压板和柔性印刷线路板
公开(公告)号：US07364799B2
公开(公告)日：2008-04-29
申请号：US10505697
申请日：2003-02-26
申请人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
发明人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
IPC分类号： B32B27/34
CPC分类号： C08G73/14 , B32B15/08 , C09D179/08 , H05K1/0346 , Y10T428/31725 , Y10T428/31765
摘要： The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month−initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate. Moreover, since the solder heat resistance and the insulation properties are not impaired even after humidification and since the heat resistant resin is soluble in organic solvents with high solution stability, the flexible metal-clad laminate of the invention can be inexpensively produced.
摘要翻译：本发明提供可溶于10％浓度的酰胺溶剂的无卤素聚酰胺酰亚胺树脂，所得清漆在5℃下储存1个月后，溶液粘度变化（（溶液粘度1 月初始溶液粘度）/初始溶液粘度（绝对值）为3.0以下，吸湿性（25℃，90％RH，24小时）的树脂为2.0％以下 ; 使用这种树脂的柔性金属包覆层压板; 以及通过电路形成由这种柔性覆金属层压板制备的柔性印刷线路板。本发明的柔性覆金属层压板在包括潮湿条件在内的任何条件下都不会卷曲，并且由于用作绝缘材料的耐热树脂具有低吸湿性和低热膨胀系数，并且内应力较小在柔性覆金属层压板中。此外，由于即使在加湿之后焊料耐热性和绝缘性也不受损害，并且由于耐热树脂可溶于高溶液稳定性的有机溶剂中，因此可以廉价地制造本发明的柔性覆金属层压板。

3. 发明申请

US20070134484A1 Porous film, process for producing the same, and lithium-ion secondary cell made with the same 审中-公开
标题翻译：多孔膜，其制造方法以及由其制造的锂离子二次电池
公开(公告)号：US20070134484A1
公开(公告)日：2007-06-14
申请号：US10589762
申请日：2005-02-21
申请人： Jun Yamada , Masanori Nakamura , Cyuji Inukai , Atsushi Nakajima
发明人： Jun Yamada , Masanori Nakamura , Cyuji Inukai , Atsushi Nakajima
IPC分类号： B32B3/26
CPC分类号： H01M2/162 , C08J5/18 , C08J7/047 , C08J2323/02 , C08J2379/08 , C08J2477/00 , H01M2/145 , H01M2/1653 , H01M2/1686 , H01M10/0525 , Y10T428/249953
摘要： The present invention provides an inexpensive separator satisfactory in shutdown properties and meltdown properties and having excellent insulating properties. A porous film having a thickness of 5 to 100 μm, characterized by including a porous layer of a polyamide-imide resin which has a glass transition temperature of 70° C. or higher and an inherent viscosity of 0.5 dl/g or higher and containing a unit represented by the following structural formula (I), the amount of the unit being 20 mol % or more based on all repeating structural units. Also provided is the porous film which is characterized in that the porous polyamide-imide resin layer has an amide bond/imide bond ratio of from 10/90 to 45/55. Further more provided is a lithium-ion secondary cell which contains a positive electrode and a negative electrode which are capable of occluding/releasing lithium ions and either of the porous films disposed as a separator between the electrodes.
摘要翻译：本发明提供了一种廉价的隔膜，其具有良好的关闭性能和熔融性能，并具有优异的绝缘性能。一种厚度为5〜100μm的多孔膜，其特征在于，包括聚酰胺 - 酰亚胺树脂的多孔层，其玻璃化转变温度为70℃以上，特性粘度为0.5dl / g以上，含有由以下结构式（I）表示的单元，基于所有重复结构单元的单元量为20摩尔％以上。还提供了多孔膜，其特征在于多孔聚酰胺酰亚胺树脂层的酰胺键/酰亚胺键比为10/90〜45/55。进一步提供一种锂离子二次电池，其包含能够吸留/释放锂离子的正极和负极以及在电极之间作为隔膜设置的多孔膜之一。

4. 发明申请

US20090286147A1 Composite porous membrane, method of producing composite porous membrane, and battery separator, battery and capacitor using the same 审中-公开
标题翻译：复合多孔膜，复合多孔膜的制造方法以及电池隔膜，使用其的电池和电容器
公开(公告)号：US20090286147A1
公开(公告)日：2009-11-19
申请号：US12153323
申请日：2008-05-16
申请人： Atsushi Nakajima , Cyuji Inukai , Michihiko Irie , Masanori Nakamura , Jun Yamada
发明人： Atsushi Nakajima , Cyuji Inukai , Michihiko Irie , Masanori Nakamura , Jun Yamada
IPC分类号： H01M2/16 , B32B27/08 , B32B5/32 , C08J7/02
CPC分类号： H01M2/166 , H01G9/02 , H01M2/145 , H01M10/0525 , Y10T428/24998 , Y10T428/249981
摘要： The present invention provides a composite porous membrane suited for a separator for a battery having excellent ion permeability, low pore blocking temperature, and high membrane breakage temperature by compositing resin porous membranes having different melting points (or softening points) without using a termocompression bonding method or a method of directly applying a solution to the substrate by using a composite porous membrane containing a porous membrane A of a resin having a melting point of 150° C. or less and a porous membrane B of a resin having a glass transition temperature of more than 150° C. integrated with the porous membrane A, wherein both a superficial side of the porous membrane B and an interfacial side with the porous membrane A of the porous membrane B have a three-dimensional network structure.
摘要翻译：本发明提供一种适用于电池用隔膜的复合多孔膜，其通过使用不同熔点（或软化点）的不同熔点（或软化点）的树脂多孔膜复合而具有优异的离子渗透性，低孔阻塞温度和高膜断裂温度。或通过使用含有熔点为150℃以下的树脂的多孔膜A和玻璃化转变温度为40℃以下的树脂的多孔膜B的复合多孔膜，直接对基材施加溶液的方法与多孔膜A一体形成多于150℃，其中多孔膜B的表面侧和多孔膜B的多孔膜A的界面侧都具有三维网状结构。

5. 发明申请

US20050165209A1 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board 有权
标题翻译：聚酰胺酰亚胺树脂，柔性金属包覆层压板和柔性印刷线路板
公开(公告)号：US20050165209A1
公开(公告)日：2005-07-28
申请号：US10505697
申请日：2003-02-26
申请人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
发明人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
IPC分类号： B32B15/08 , C08G73/14 , C09D179/08 , H05K1/03 , C08G69/08
CPC分类号： C08G73/14 , B32B15/08 , C09D179/08 , H05K1/0346 , Y10T428/31725 , Y10T428/31765
摘要： The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month—initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate. Moreover, since the solder heat resistance and the insulation properties are not impaired even after humidification and since the heat resistant resin is soluble in organic solvents with high solution stability, the flexible metal-clad laminate of the invention can be inexpensively produced.
摘要翻译：本发明提供可溶于10％浓度的酰胺溶剂的无卤素聚酰胺酰亚胺树脂，所得清漆在5℃下储存1个月后，溶液粘度变化（（溶液粘度1 月初始溶液粘度）/初始溶液粘度（绝对值）为3.0以下，吸湿性（25℃，90％RH，24小时）的树脂为2.0％以下 ; 使用这种树脂的柔性金属包覆层压板; 以及通过电路形成由这种柔性覆金属层压板制备的柔性印刷线路板。本发明的柔性覆金属层压板在包括潮湿条件在内的任何条件下都不会卷曲，并且由于用作绝缘材料的耐热树脂具有低吸湿性和低热膨胀系数，并且内应力较小在柔性覆金属层压板中。此外，由于即使在加湿之后焊料耐热性和绝缘性也不受损害，并且由于耐热树脂可溶于高溶液稳定性的有机溶剂中，因此可以廉价地制造本发明的柔性覆金属层压板。

6. 发明授权

US07728102B2 Polyamide-imide resin, flexible metal-clad laminate, and flexible printed wiring board 失效
标题翻译：聚酰胺酰亚胺树脂，柔性金属包覆层压板和柔性印刷线路板
公开(公告)号：US07728102B2
公开(公告)日：2010-06-01
申请号：US11515234
申请日：2006-08-31
申请人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
发明人： Tomoharu Kurita , Shinji Suzuki , Cyuji Inukai
IPC分类号： C08G69/08
CPC分类号： C08G73/14 , B32B15/08 , C09D179/08 , H05K1/0346 , Y10T428/31725 , Y10T428/31765
摘要： The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month−initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate. Moreover, since the solder heat resistance and the insulation properties are not impaired even after humidification and since the heat resistant resin is soluble in organic solvents with high solution stability, the flexible metal-clad laminate of the invention can be inexpensively produced.
摘要翻译：本发明提供可溶于10％浓度的酰胺溶剂的无卤素聚酰胺酰亚胺树脂，所得清漆在5℃下储存1个月后，溶液粘度变化（（溶液粘度1 月初始溶液粘度）/初始溶液粘度（绝对值）为3.0以下，吸湿性（25℃，90％RH，24小时）的树脂为2.0％以下 ; 使用这种树脂的柔性金属包覆层压板; 以及通过电路形成由这种柔性覆金属层压板制备的柔性印刷线路板。本发明的柔性覆金属层压板在包括潮湿条件在内的任何条件下都不会卷曲，并且由于用作绝缘材料的耐热树脂具有低吸湿性和低热膨胀系数，并且内应力较小在柔性覆金属层压板中。此外，由于即使在加湿之后焊料耐热性和绝缘性也不受损害，并且由于耐热树脂可溶于高溶液稳定性的有机溶剂中，因此可以廉价地制造本发明的柔性覆金属层压板。

7. 发明申请

US20060138042A1 Heat-resistant film and composite ion-exchange membrane 审中-公开
标题翻译：耐热膜和复合离子交换膜
公开(公告)号：US20060138042A1
公开(公告)日：2006-06-29
申请号：US10532428
申请日：2003-10-23
申请人： Kazutake Okamoto , Hisato Kobayashi , Keizo Kawahara , Shiro Hamamoto , Satoshi Takase , Yoshimitsu Sakaguchi , Cyuji Inukai , Jun Yamada , Daisuke Sakura , Muneatsu Nakamura
发明人： Kazutake Okamoto , Hisato Kobayashi , Keizo Kawahara , Shiro Hamamoto , Satoshi Takase , Yoshimitsu Sakaguchi , Cyuji Inukai , Jun Yamada , Daisuke Sakura , Muneatsu Nakamura
IPC分类号： B01D71/06
CPC分类号： B01D67/0013 , B01D67/0016 , B01D69/12 , B01D71/56 , B01D71/62 , B01D71/64 , B01D2323/46 , B01D2325/22 , B01D2325/24 , B01D2325/42 , B29C41/24 , B29D7/01 , B29K2077/10 , B29K2079/00 , B29K2079/085 , B29K2105/0079 , C08J5/18 , C08J9/26 , C08J2379/04 , H01B1/122 , H01M8/0289 , H01M8/1027 , H01M8/103 , H01M8/1081 , H01M2300/0082 , H01M2300/0094 , Y02P70/56 , Y10T428/249953
摘要： The present invention is a heat-resistant film comprising at least any one of a polybenzazole, aramid and polyamideimide produced by introducing a thin film made by a roll, slit or press from a polymer solution sandwiched between at least two supports into a coagulating bath and peeling the supports off in the coagulating bath to effect the coagulation, and a composite ion-exchange membrane having a surface layer consisting of an ion-exchange resin excluding a porous film on the both side of a composite layer formed by impregnating said film with the ion-exchange resin. A heat-resistant film having a combination of excellent heat resistance, mechanical strength, smoothness and interlaminar peeling resistance, especially a microporous heat-resistant film, and a composite ion-exchange membrane employing the same which has an excellent ion conductivity are provided.
摘要翻译：本发明是一种耐热薄膜，其包含聚吲哚，芳族聚酰胺和聚酰胺酰亚胺中的至少一种，其通过将夹在至少两个载体之间的聚合物溶液引入由辊，狭缝或压制物制成的薄膜而制成凝固浴，在凝固浴中剥离载体以进行凝固;以及复合离子交换膜，其具有由除了多孔膜之外的离子交换树脂组成的表面层，所述表面层通过将所述膜浸渍在所述复合层的两面上而形成离子交换树脂。提供具有优异的耐热性，机械强度，平滑度和层间剥离性的组合的耐热膜，特别是微孔耐热膜，以及具有优异离子传导性的复合离子交换膜。

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