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    • 9. 发明授权
    • Apparatus and method for multi-target physical-vapor deposition of a multi-layer material structure
    • 多层材料结构的多目标物理气相沉积的装置和方法
    • US06905578B1
    • 2005-06-14
    • US09067143
    • 1998-04-27
    • Mehrdad M. MoslehiCecil J. DavisChristopher J. MannDwain R. JakubikAjit P. Paranjpe
    • Mehrdad M. MoslehiCecil J. DavisChristopher J. MannDwain R. JakubikAjit P. Paranjpe
    • C23C14/56C23C14/34C23C16/00
    • C23C14/568
    • An apparatus and method for depositing plural layers of materials on a substrate within a single vacuum chamber allows high-throughput deposition of structures such as these for GMR and MRAM application. An indexing mechanism aligns a substrate with each of plural targets according to the sequence of the layers in the structure. Each target deposits material using a static physical-vapor deposition technique. A shutter can be interposed between a target and a substrate to block the deposition process for improved deposition control. The shutter can also preclean a target or the substrate and can also be used for mechanical chopping of the deposition process. In alternative embodiments, plural substrates may be aligned sequentially with plural targets to allow simultaneous deposition of plural structures within the single vacuum chamber. A monitoring and control device can be wed to optimize equipment state, process state, and wafer state parameters by sensing each respective state during or after the deposition process.
    • 用于在单个真空室内的衬底上沉积多层材料的装置和方法允许诸如这些结构的高通量沉积用于GMR和MRAM应用。 分度机构根据结构中的层序列将衬底与多个靶中的每一个对准。 每个目标使用静态物理气相沉积技术沉积材料。 可以在目标和基板之间插入快门以阻止沉积工艺以改善沉积控制。 快门还可以预清洁目标物或基底,并且还可用于沉积过程的机械切割。 在替代实施例中,多个基板可以与多个靶顺序对准,以允许在单个真空室内同时沉积多个结构。 可以通过在沉积过程中或之后感测每个相应的状态来优化设备状态,过程状态和晶片状态参数的监控和控制设备。