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    • 2. 发明申请
    • System and Method for Manufacturing a Temperature Difference Sensor
    • 制造温差传感器的系统和方法
    • US20120175687A1
    • 2012-07-12
    • US13426530
    • 2012-03-21
    • Donald DibraChristoph KadowMarkus Zundel
    • Donald DibraChristoph KadowMarkus Zundel
    • H01L29/66H01L27/06H01L21/04
    • H01L35/32G01K1/08G01K7/02
    • An embodiment of the invention relates to a Seebeck temperature difference sensor that may be formed in a trench on a semiconductor device. A portion of the sensor may be substantially surrounded by an electrically conductive shield. A plurality of junctions may be included to provide a higher Seebeck sensor voltage. The shield may be electrically coupled to a local potential, or left electrically floating. A portion of the shield may be formed as a doped well in the semiconductor substrate on which the semiconductor device is formed, or as a metal layer substantially covering the sensor. The shield may be formed as a first oxide layer on a sensor trench wall with a conductive shield formed on the first oxide layer, and a second oxide layer formed on the conductive shield. An absolute temperature sensor may be coupled in series with the Seebeck temperature difference sensor.
    • 本发明的实施例涉及可以形成在半导体器件上的沟槽中的塞贝克温差传感器。 传感器的一部分可以被导电屏蔽件基本上包围。 可以包括多个连接点以提供更高的塞贝克传感器电压。 屏蔽可以电耦合到局部电位,或者电耦合到电浮置。 屏蔽的一部分可以形成为半导体器件形成的半导体衬底中的掺杂阱,或者形成为基本覆盖传感器的金属层。 屏蔽件可以形成为在传感器沟槽壁上的第一氧化物层,其中形成在第一氧化物层上的导电屏蔽层和形成在导电屏蔽上的第二氧化物层。 绝对温度传感器可以与塞贝克温差传感器串联耦合。
    • 3. 发明授权
    • System and method for constructing shielded seebeck temperature difference sensor
    • 屏蔽温差传感器的系统和方法
    • US08169045B2
    • 2012-05-01
    • US12431504
    • 2009-04-28
    • Donald DibraChristoph KadowMarkus Zundel
    • Donald DibraChristoph KadowMarkus Zundel
    • H01L35/28
    • H01L35/32G01K1/08G01K7/02
    • An embodiment of the invention relates to a Seebeck temperature difference sensor that may be formed in a trench on a semiconductor device. A portion of the sensor may be substantially surrounded by an electrically conductive shield. A plurality of junctions may be included to provide a higher Seebeck sensor voltage. The shield may be electrically coupled to a local potential, or left electrically floating. A portion of the shield may be formed as a doped well in the semiconductor substrate on which the semiconductor device is formed, or as a metal layer substantially covering the sensor. The shield may be formed as a first oxide layer on a sensor trench wall with a conductive shield formed on the first oxide layer, and a second oxide layer formed on the conductive shield. An absolute temperature sensor may be coupled in series with the Seebeck temperature difference sensor.
    • 本发明的实施例涉及可以形成在半导体器件上的沟槽中的塞贝克温差传感器。 传感器的一部分可以被导电屏蔽件基本上包围。 可以包括多个结以提供更高的塞贝克传感器电压。 屏蔽可以电耦合到局部电位,或者电耦合到电浮置。 屏蔽的一部分可以形成为半导体器件形成的半导体衬底中的掺杂阱,或者形成为基本覆盖传感器的金属层。 屏蔽件可以形成为在传感器沟槽壁上的第一氧化物层,其中形成在第一氧化物层上的导电屏蔽层和形成在导电屏蔽上的第二氧化物层。 绝对温度传感器可以与塞贝克温差传感器串联耦合。
    • 10. 发明申请
    • SEMICONDUCTOR ARRANGEMENT INCLUDING A LOAD TRANSISTOR AND SENSE TRANSISTOR
    • 半导体器件包括负载晶体管和感测晶体管
    • US20110037126A1
    • 2011-02-17
    • US12541635
    • 2009-08-14
    • Christoph KadowMarkus LeichtStefan Woehlert
    • Christoph KadowMarkus LeichtStefan Woehlert
    • H01L29/66H01L21/44
    • H01L29/7813H01L27/088H01L29/7815
    • A semiconductor arrangement including a load transistor and a sense transistor that are integrated in a semiconductor body. One embodiment provides a number of transistor cells integrated in the semiconductor body, each transistor cell including a first active transistor region. A number of first contact electrodes, each of the contact electrodes contacting the first active transistor regions through contact plugs. A second contact electrode contacts a first group of the first contact electrodes, but not contacting a second group of the first contact electrodes. The transistor cells being contacted by first contact electrodes of the first group form a load transistor, with the second electrode forming a load terminal of the load transistor. The transistor cells being contacted by first contact electrodes of the second group form a sense transistor.
    • 包括集成在半导体本体中的负载晶体管和读出晶体管的半导体装置。 一个实施例提供集成在半导体本体中的多个晶体管单元,每个晶体管单元包括第一有源晶体管区域。 多个第一接触电极,每个接触电极通过接触插塞接触第一有源晶体管区域。 第二接触电极接触第一组第一接触电极,但不接触第二组第一接触电极。 与第一组的第一接触电极接触的晶体管单元形成负载晶体管,第二电极形成负载晶体管的负载端子。 与第二组的第一接触电极接触的晶体管单元形成感测晶体管。