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1. 发明授权

US06582175B2 Robot for handling semiconductor wafers 有权
标题翻译：用于处理半导体晶片的机器人
公开(公告)号：US06582175B2
公开(公告)日：2003-06-24
申请号：US10135261
申请日：2002-04-29
申请人： Damon Cox , Martin R. Elliott , Chris Pencis , Jeffrey C. Hudgens , Michael Robert Rice
发明人： Damon Cox , Martin R. Elliott , Chris Pencis , Jeffrey C. Hudgens , Michael Robert Rice
IPC分类号： B65G100
CPC分类号： H01L21/68707 , H01L21/67742
摘要： A multi-set robot is provided that includes a first robot set having a first motor coupled to a first rotatable member that is rotatable about an axis; a second motor coupled to a second rotatable member that is rotatable about the axis; a first plurality of blades vertically spaced from one another; and a first linkage adapted to enable coordinated movement of the blades on rotation of the first and second rotatable members. The robot also includes a second robot set positioned above the first robot set having a third motor coupled to a third rotatable member that is rotatable about the axis; a fourth motor coupled to a fourth rotatable member that is rotatable about the axis; a second plurality of blades vertically spaced from one another; and a second linkage adapted to enable coordinated movement of the blades on rotation of the third and fourth rotatable members. Other aspects are provided.
摘要翻译：提供了一种多组机器人，其包括第一机器人组，其具有联接到可围绕轴线旋转的第一可旋转构件的第一电动机; 耦合到可围绕所述轴线旋转的第二可旋转构件的第二马达; 彼此垂直间隔开的第一组多个叶片; 以及第一连杆，其适于使所述叶片在所述第一和第二可旋转构件的旋转时能够协调地运动。所述机器人还包括位于所述第一机器人组件上方的第二机器人组件，所述第二机器人组具有联接到可围绕所述轴线旋转的第三可旋转构件的第三耦合到可围绕所述轴线旋转的第四可旋转构件的第四电动机; 第二多个叶片，彼此垂直间隔开; 以及第二联动装置，其适于在第三和第四可旋转构件旋转时实现叶片的协调运动。提供其他方面。

2. 发明授权

US06379095B1 Robot for handling semiconductor wafers 有权
标题翻译：用于处理半导体晶片的机器人
公开(公告)号：US06379095B1
公开(公告)日：2002-04-30
申请号：US09549777
申请日：2000-04-14
申请人： Martin R. Elliott , Jeffrey C. Hudgens , Chris Pencis , Damon Cox
发明人： Martin R. Elliott , Jeffrey C. Hudgens , Chris Pencis , Damon Cox
IPC分类号： B65H160
CPC分类号： H01L21/68707 , H01L21/67742
摘要： An apparatus for processing semiconductor wafers has an automatic robot for independently and simultaneously handling two wafers (W) at the same time on two separate transfer planes. The robot comprises a first arm assembly having a left and a right arm each mounted at one end for independent rotation in a first horizontal plane about a center vertical axis, the other ends of the arms being movably joined together and holding a blade on which a wafer can be carried, the arms being horizontally bendable near their centers so they can be folded to retract the blade toward the center axis and rotated to a desired angular position, the arms being extendable along a radius from the center axis by moving the arms together near their centers to bring the arms nearly parallel to each other and to extend the blade from the center axis by a maximum amount; and a second arm assembly substantially identical to the first assembly and rotatable in a second horizontal plane closely spaced above the first plane, the operation of the second assembly being substantially identical to that of the first assembly but independent thereof.
摘要翻译：用于处理半导体晶片的设备具有自动机器人，用于在两个分开的转移平面上同时处理两个晶片（W）。机器人包括第一臂组件，其具有左臂和右臂，每个臂在一端安装在围绕中心垂直轴线的第一水平平面中独立旋转，臂的另一端可移动地接合在一起，可以承载晶片，臂可以在其中心附近水平弯曲，使得它们可以被折叠以使叶片朝向中心轴线缩回并且旋转到期望的角位置，臂可以通过将臂移动在一起而从中心轴线的半径延伸靠近它们的中心以使臂几乎彼此平行，并且使叶片从中心轴线延伸最大量; 以及第二臂组件，其基本上与第一组件相同，并且可在紧邻第一平面的第二水平面中旋转，第二组件的操作基本上与第一组件的操作相同，但与之独立。

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