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    • 3. 发明授权
    • Structure and manufacturing method of an image TFT array
    • 图像TFT阵列的结构和制造方法
    • US07439544B2
    • 2008-10-21
    • US10907998
    • 2005-04-25
    • Chin-Mao LinKei-Hsiung YangChian-Chih Hsiao
    • Chin-Mao LinKei-Hsiung YangChian-Chih Hsiao
    • H01L27/14
    • H01L27/14692H01L27/1255H01L27/1288H01L27/14658
    • The present invention provides a manufacturing method of an image TFT array, which includes providing a substrate including a thin film transistor region, a storage capacitor region, a pad region, and a common electrode region, forming a photoresist layer on the substrate, and performing a photolithographic and etching process by utilizing a half-tone mask to pattern the photoresist layer to define a position of a through hole on the storage capacitor region and form the photoresist layer of a first thickness on the thin film transistor region and the photoresist layer of a second thickness on the region between the thin film transistor region and the storage capacitor region, wherein the first thickness is greater than the second thickness.
    • 本发明提供了一种图像TFT阵列的制造方法,其包括提供包括薄膜晶体管区域,保持电容器区域,焊盘区域和公共电极区域的衬底,在衬底上形成光致抗蚀剂层,并且执行 通过利用半色调掩模来对光致抗蚀剂层进行图案化以定义存储电容器区域上的通孔的位置并在薄膜晶体管区域和光致抗蚀剂层上形成第一厚度的光致抗蚀剂层的光刻和蚀刻工艺 在薄膜晶体管区域和存储电容器区域之间的区域上的第二厚度,其中第一厚度大于第二厚度。