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1. 发明申请

US20050287710A1 Leadless semiconductor package and method for manufacturing the same 有权
标题翻译：无铅半导体封装及其制造方法
公开(公告)号：US20050287710A1
公开(公告)日：2005-12-29
申请号：US11143676
申请日：2005-06-03
申请人： Yao-Ting Huang , Chih-Te Lin
发明人： Yao-Ting Huang , Chih-Te Lin
IPC分类号： H01L21/48 , H01L21/60 , H01L21/98 , H01L23/31 , H01L23/48 , H01L23/495 , H01L23/498 , H01L25/065
CPC分类号： H01L21/4846 , H01L21/4828 , H01L23/3121 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/50 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/10161 , H01L2924/10162 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A leadless semiconductor package mainly includes a plurality of inner leads, a chip pad, a semiconductor chip and a molding compound. A non-conductive ink is filled between every two of the inner leads, and couples the inner leads to the chip pad so as to be in replacement of the conventional tie bars. The semiconductor chip is disposed on the chip pad and electrically connected to the inner leads. Moreover, the molding compound is formed on the inner leads and the non-conductive ink for encapsulating the semiconductor chip. The non-conductive ink prevents the exposed bottom surfaces of the inner leads from contamination by the molding compound without attaching an external tape during molding. Also the inner leads can be in a multi-row arrangement and the chip pad can be disposed in an optional location.
摘要翻译：无引线半导体封装主要包括多个内引线，芯片焊盘，半导体芯片和模塑料。在每两个内引线之间填充非导电油墨，并且将内引线连接到芯片垫以便替代传统的连接杆。半导体芯片设置在芯片焊盘上并电连接到内引线。此外，在内引线和用于封装半导体芯片的非导电油墨上形成模塑料。非导电油墨防止内部引线的暴露的底部表面被模塑料污染，而不会在模制过程中附着外部胶带。内引线也可以是多列布置，并且芯片焊盘可以设置在可选的位置。

2. 发明授权

US08752476B2 Coffee maker enabling automated drip brewing 有权
标题翻译：咖啡机可实现自动滴灌
公开(公告)号：US08752476B2
公开(公告)日：2014-06-17
申请号：US13299352
申请日：2011-11-17
申请人： Chih-Te Lin
发明人： Chih-Te Lin
IPC分类号： A47J31/44 , A47J31/06 , A47J31/057 , A47J31/46
CPC分类号： A47J31/44
摘要： A coffee maker includes a water storage device having a water tank and a water outlet piping communicating with the water tank; a driving device having a driving motor and a driving shaft; and a swing device having a rotating mechanism mounted on the driving shaft and a shifting mechanism connected to the water outlet piping and moving along with the rotating mechanism when the latter rotates. The water outlet piping is brought by a horizontal rotational movement of the rotating mechanism and a linear movement of the shifting mechanism to swing and shift in a spiral rotational course from a center point to outer and inner areas of a filter in a reciprocating motion while pouring water at controlled volume and stability, enabling ground coffee beans on the filter to be quickly and evenly extracted by water to release aromatic smell and sweet flavor just like drip brewing manually.
摘要翻译：咖啡机包括具有水箱和与水箱连通的出水管道的储水装置; 具有驱动电机和驱动轴的驱动装置; 以及具有安装在所述驱动轴上的旋转机构的摆动装置和连接到所述出水管道的变速机构，并且在所述旋转机构旋转时与所述旋转机构一起移动。出水管道由旋转机构的水平旋转运动引起，并且移动机构的线性运动在倾倒期间以往复运动从中心点到过滤器的外部和内部区域以螺旋旋转进程摆动和移动水的控制体积和稳定性，使过滤器上的研磨咖啡豆能够快速均匀地被水提取，以便像手动滴水一样释放芳香气味和甜味。

3. 发明申请

US20130125759A1 COFFEE MAKER ENABLING AUTOMATED DRIP BREWING 有权
标题翻译：咖啡机启用自动滚筒式搅拌
公开(公告)号：US20130125759A1
公开(公告)日：2013-05-23
申请号：US13299352
申请日：2011-11-17
申请人： Chih-Te LIN
发明人： Chih-Te LIN
IPC分类号： A47J31/44
CPC分类号： A47J31/44
摘要： A coffee maker includes a water storage device having a water tank and a water outlet piping communicating with the water tank; a driving device having a driving motor and a driving shaft; and a swing device having a rotating mechanism mounted on the driving shaft and a shifting mechanism connected to the water outlet piping and moving along with the rotating mechanism when the latter rotates. The water outlet piping is brought by a horizontal rotational movement of the rotating mechanism and a linear movement of the shifting mechanism to swing and shift in a spiral rotational course from a center point to outer and inner areas of a filter in a reciprocating motion while pouring water at controlled volume and stability, enabling ground coffee beans on the filter to be quickly and evenly extracted by water to release aromatic smell and sweet flavor just like drip brewing manually.
摘要翻译：咖啡机包括具有水箱和与水箱连通的出水管道的储水装置; 具有驱动电机和驱动轴的驱动装置; 以及具有安装在所述驱动轴上的旋转机构的摆动装置和连接到所述出水管道的变速机构，并且在所述旋转机构旋转时与所述旋转机构一起移动。出水管道由旋转机构的水平旋转运动引起，并且移动机构的线性运动在倾倒期间以往复运动从中心点到过滤器的外部和内部区域以螺旋旋转进程摆动和移动水的控制体积和稳定性，使过滤器上的研磨咖啡豆能够快速均匀地被水提取，以便像手动滴水一样释放芳香气味和甜味。

4. 发明授权

US07575957B2 Leadless semiconductor package and method for manufacturing the same 有权
标题翻译：无铅半导体封装及其制造方法
公开(公告)号：US07575957B2
公开(公告)日：2009-08-18
申请号：US11143676
申请日：2005-06-03
申请人： Yao-Ting Huang , Chih-Te Lin
发明人： Yao-Ting Huang , Chih-Te Lin
IPC分类号： H01L21/00
CPC分类号： H01L21/4846 , H01L21/4828 , H01L23/3121 , H01L23/49541 , H01L23/49548 , H01L23/49558 , H01L23/49575 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/0655 , H01L25/50 , H01L2224/05554 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/10161 , H01L2924/10162 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： A leadless semiconductor package mainly includes a plurality of inner leads, a chip pad, a semiconductor chip and a molding compound. A non-conductive ink is filled between every two of the inner leads, and couples the inner leads to the chip pad so as to be in replacement of the conventional tie bars. The semiconductor chip is disposed on the chip pad and electrically connected to the inner leads. Moreover, the molding compound is formed on the inner leads and the non-conductive ink for encapsulating the semiconductor chip. The non-conductive ink prevents the exposed bottom surfaces of the inner leads from contamination by the molding compound without attaching an external tape during molding. Also the inner leads can be in a multi-row arrangement and the chip pad can be disposed in an optional location.
摘要翻译：无引线半导体封装主要包括多个内引线，芯片焊盘，半导体芯片和模塑料。在每两个内引线之间填充非导电油墨，并且将内引线连接到芯片垫以便替代传统的连接杆。半导体芯片设置在芯片焊盘上并电连接到内引线。此外，在内引线和用于封装半导体芯片的非导电油墨上形成模塑料。非导电油墨防止内部引线的暴露的底部表面被模塑料污染，而不会在模制过程中附着外部胶带。内引线也可以是多列布置，并且芯片焊盘可以设置在可选的位置。

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