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    • 7. 发明授权
    • Highly luminous light emitting device
    • 高亮度发光装置
    • US06429460B1
    • 2002-08-06
    • US09675341
    • 2000-09-28
    • Tzer-Perng ChenChih-Sung ChangChih-Li Chiang
    • Tzer-Perng ChenChih-Sung ChangChih-Li Chiang
    • H01L2715
    • H01L33/22H01L33/0079H01L33/145
    • The present invention discloses a light emitting device which includes a substrate, a light emitting layer on the substrate, a current restriction layer on the light emitting layer, a current spreading layer on the current restriction layer, a dielectric layer on the current spreading layer defining an exposed area, a top ohmic contact metal layer on the exposed area, and a bottom ohmic contact metal layer under the substrate. The current spreading layer has a rough top surface. The current restriction layer includes a conductive layer that allows current to flow through, and an insulating layer around the conductive layer. The insulating layer prohibits the current from flowing through in a path between the top ohmic contact metal layer and the bottom ohmic contact metal layer. The substrate is partially removed to form a cavity for avoiding substrate absorption. A highly luminous light emitting device is obtained by introductions of the rough top surface of the current spreading layer, partial removal of the substrate, the current restriction layer, and optimal layouts of the top and bottom ohmic contact metal layers and the conductive layer.
    • 本发明公开了一种发光器件,其包括衬底,衬底上的发光层,发光层上的电流限制层,电流限制层上的电流扩展层,电流扩展层上的介电层,限定 暴露区域,暴露区域上的顶部欧姆接触金属层,以及底部下方的欧姆接触金属层。 电流扩散层具有粗糙的顶表面。 电流限制层包括允许电流流过的导电层和导电层周围的绝缘层。 绝缘层禁止电流在顶部欧姆接触金属层和底部欧姆接触金属层之间的路径中流过。 部分地去除衬底以形成用于避免衬底吸收的空腔。 通过引入电流扩展层的粗糙顶表面,部分去除衬底,电流限制层以及顶部和底部欧姆接触金属层和导电层的最佳布局来获得高度发光的发光器件。