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1. 发明授权

US08967963B2 Fan module 有权
标题翻译：风扇模块
公开(公告)号：US08967963B2
公开(公告)日：2015-03-03
申请号：US13283589
申请日：2011-10-28
申请人： Chih-Hua Chen
发明人： Chih-Hua Chen
IPC分类号： F01D25/28 , F04D19/00 , F04D29/60 , F04D29/66
CPC分类号： F04D19/007 , F04D29/601 , F04D29/668
摘要： A fan module includes a cooling fan, a supporting rack, and a number of fasteners sandwiched between the cooling fan and the supporting rack. The fasteners are made of vibration-resistant material. The supporting rack includes two opposite supporting walls. An installing portion protrudes out from a top of each supporting plate. Each fastener is sandwiched between the cooling fan and the corresponding installing portion. An extension portion extends from each fastener to resist against an outside surface of the cooling fan.
摘要翻译：风扇模块包括冷却风扇，支撑架和夹在冷却风扇和支撑架之间的多个紧固件。紧固件由抗振材料制成。支撑架包括两个相对的支撑壁。安装部从每个支撑板的顶部突出。每个紧固件夹在冷却风扇和相应的安装部分之间。延伸部分从每个紧固件延伸以抵抗冷却风扇的外表面。

2. 发明授权

US08765497B2 Packaging and function tests for package-on-package and system-in-package structures 有权
标题翻译：包装封装和系统级封装结构的封装和功能测试
公开(公告)号：US08765497B2
公开(公告)日：2014-07-01
申请号：US13225113
申请日：2011-09-02
申请人： Hao-Juin Liu , Chita Chuang , Ching-Wen Hsiao , Chen-Shien Chen , Chen-Cheng Kuo , Chih-Hua Chen
发明人： Hao-Juin Liu , Chita Chuang , Ching-Wen Hsiao , Chen-Shien Chen , Chen-Cheng Kuo , Chih-Hua Chen
IPC分类号： H01L21/66 , H01L23/00 , H01L23/48
CPC分类号： H01L22/20 , H01L22/14 , H01L23/3128 , H01L23/48 , H01L24/97 , H01L25/105 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/97 , H01L2225/1023 , H01L2225/1058 , H01L2924/15311 , H01L2924/15331 , H01L2224/81 , H01L2924/00012 , H01L2924/00
摘要： A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units includes a package substrate and a die bonded to the package substrate. A plurality of upper component stacks is placed onto the plurality of bottom units, wherein solder balls are located between the plurality of upper component and the plurality of bottom units. A reflow is performed to join the plurality of upper component stacks with respective ones of the plurality of bottom units through the solder balls.
摘要翻译：一种方法包括将多个底部单元放置在夹具上，其中多个底部单元没有锯切并形成一个集成部件。多个底部单元中的每一个包括封装基板和结合到封装基板的管芯。多个上部组件堆放在多个底部单元上，其中焊球位于多个上部组件和多个底部单元之间。执行回流以通过焊球将多个上部部件堆叠与多个底部单元中的相应的底部单元接合。

3. 发明申请

US20130140689A1 Bump-on-Trace Structures in Packaging 有权
标题翻译：包装中的凸起结构
公开(公告)号：US20130140689A1
公开(公告)日：2013-06-06
申请号：US13310459
申请日：2011-12-02
申请人： Chih-Hua Chen
发明人： Chih-Hua Chen
IPC分类号： H01L23/498
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L24/13 , H01L24/16 , H01L2224/13014 , H01L2224/13082 , H01L2224/131 , H01L2224/16013 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81385 , H01L2924/01322 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/00
摘要： A package component includes a metal trace on a top surface of the package component, and an anchor via underlying and in contact with the metal trace. The anchor via is configured not to conduct currents flowing through the metal trace.
摘要翻译：包装部件包括在包装部件的顶表面上的金属迹线，以及锚定器，其通过下面并与金属迹线接触。锚通孔被配置为不传导流过金属迹线的电流。

4. 发明授权

US08315054B2 Rack server center 失效
标题翻译：机架服务器中心
公开(公告)号：US08315054B2
公开(公告)日：2012-11-20
申请号：US13041430
申请日：2011-03-06
申请人： Chih-Hua Chen
发明人： Chih-Hua Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： A rack server center includes servers, an air conditioning system for bringing cooling air to the rack server, and an air exhaust system located outside the rack server. The air exhaust system includes an exhaust fan, branch pipes, controlling valves, and a main pipe. Each branch pipe is connected with a corresponding server via a corresponding controlling valve. The branch pipes are connected with an inlet of the exhaust fan. The main pipe is connected with an outlet of the exhaust fan. The exhaust fan is configured for exhausting heated air generated by the servers out of the rack server via the branch pipes. Each server is configured for controlling the amount of the heated air entering a corresponding branch pipe by controlling the controlling valve connected with the corresponding branch pipe.
摘要翻译：机架服务器中心包括服务器，用于将冷却空气带到机架式服务器的空调系统，以及位于机架式服务器外部的排气系统。排气系统包括排风扇，分支管，控制阀和主管。每个分支管通过相应的控制阀与相应的服务器连接。分支管与排风扇的入口连接。主管与排风扇的出口连接。排风扇配置为经由分支管将由服务器产生的加热空气排出机架服务器。每个服务器被配置为通过控制与相应分支管连接的控制阀来控制进入相应分支管的加热空气的量。

5. 发明授权

US08259965B2 Loudspeaker device with sound enhancing structure 失效
标题翻译：具有声音增强结构的扬声器
公开(公告)号：US08259965B2
公开(公告)日：2012-09-04
申请号：US12843072
申请日：2010-07-26
申请人： Chih-Hua Chen
发明人： Chih-Hua Chen
IPC分类号： H04R1/02
CPC分类号： H04R1/345
摘要： A loudspeaker device comprising: a loudspeaker and a reflecting member positioned opposite to the loudspeaker, the loudspeaker comprising an electromagnet actuator, a dish-like frame and a vibrating drum, the electromagnetic actuator being attached on one side of the frame, the vibrating drum adhered to an inner side of the dish-like frame, the electromagnetic actuator being configured for driving the vibrating drum to vibrate, the vibrating drum being configured for generating sound of different frequencies and intensities; and the reflecting member shaped in a bowl configuration, comprising a concave shaped reflecting surface opposite to the vibrating drum; wherein the area of the reflecting surface is larger than an area of the vibrating drum.
摘要翻译：一种扬声器装置，包括：扬声器和与扬声器相对的反射构件，扬声器包括电磁致动器，碟形框架和振动鼓，电磁致动器附接在框架的一侧，振动鼓粘附所述电磁致动器被配置为驱动所述振动鼓振动，所述振动鼓被配置为产生不同频率和强度的声音; 以及反射部件，其形状为碗形结构，包括与所述振动鼓相对的凹形反射面; 其中所述反射表面的面积大于所述振动鼓的面积。

6. 发明申请

US20120162886A1 RACK SERVER CENTER 失效
标题翻译： RACK服务器中心
公开(公告)号：US20120162886A1
公开(公告)日：2012-06-28
申请号：US13041430
申请日：2011-03-06
申请人： CHIH-HUA CHEN
发明人： CHIH-HUA CHEN
IPC分类号： H05K7/20
CPC分类号： H05K7/20745
摘要： A rack server center includes servers, an air conditioning system for bringing cooling air to the rack server, and an air exhaust system located outside the rack server. The air exhaust system includes an exhaust fan, branch pipes, controlling valves, and a main pipe. Each branch pipe is connected with a corresponding server via a corresponding controlling valve. The branch pipes are connected with an inlet of the exhaust fan. The main pipe is connected with an outlet of the exhaust fan. The exhaust fan is configured for exhausting heated air generated by the servers out of the rack server via the branch pipes. Each server is configured for controlling the amount of the heated air entering a corresponding branch pipe by controlling the controlling valve connected with the corresponding branch pipe.
摘要翻译：机架服务器中心包括服务器，用于将冷却空气带到机架式服务器的空调系统，以及位于机架式服务器外部的排气系统。排气系统包括排风扇，分支管，控制阀和主管。每个分支管通过相应的控制阀与相应的服务器连接。分支管与排风扇的入口连接。主管与排风扇的出口连接。排风扇配置为经由分支管将由服务器产生的加热空气排出机架服务器。每个服务器被配置为通过控制与相应分支管连接的控制阀来控制进入相应分支管的加热空气的量。

7. 发明授权

US08202800B2 Method of forming through silicon via with dummy structure 有权
标题翻译：通过具有虚拟结构的硅通孔形成方法
公开(公告)号：US08202800B2
公开(公告)日：2012-06-19
申请号：US13112347
申请日：2011-05-20
申请人： Chih-Hua Chen , Chen-Shien Chen , Chen-Cheng Kuo , Wen-Wei Shen
发明人： Chih-Hua Chen , Chen-Shien Chen , Chen-Cheng Kuo , Wen-Wei Shen
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A method of forming a through silicon via (TSV) structure includes forming an interconnect pad over a substrate. An under layer is formed over the interconnect pad. A vertical conductive post is formed at least partially through the substrate. At least one dummy structure is formed at least partially through the under layer. A top pad is formed over the dummy structure and the vertical conductive post. The top pad covers a wider area than a cross section of the vertical conductive post. The interconnect pad is electrically connected to the top pad. The dummy structure connects the top pad and the under layer thereby fastening the top pad and the interconnect pad.
摘要翻译：形成贯穿硅通孔（TSV）结构的方法包括在衬底上形成互连焊盘。在互连焊盘上形成下层。至少部分地穿过衬底形成垂直导电柱。至少部分地通过底层形成至少一个虚拟结构。顶部衬垫形成在虚拟结构和垂直导电柱上。顶部焊盘覆盖比垂直导电柱的横截面更宽的区域。互连焊盘电连接到顶部焊盘。虚拟结构连接顶部焊盘和下层，从而紧固顶部焊盘和互连焊盘。

8. 发明授权

US07557423B2 Semiconductor structure with a discontinuous material density for reducing eddy currents 有权
标题翻译：具有不连续材料密度的半导体结构，用于减少涡流
公开(公告)号：US07557423B2
公开(公告)日：2009-07-07
申请号：US11850647
申请日：2007-09-05
申请人： Kai-Ming Ching , Chen Chen-Shien , Han-Hsiang Huang , Chih-Hua Chen , Chen-Cheng Kuo
发明人： Kai-Ming Ching , Chen Chen-Shien , Han-Hsiang Huang , Chih-Hua Chen , Chen-Cheng Kuo
IPC分类号： H01L23/48
CPC分类号： H01L27/08 , H01L23/5227 , H01L28/10 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor structure includes an inductor; and a semiconductor substrate underlying the inductor, having a discontinuous material density across a plane underneath and in parallel with the inductor, thereby reducing eddy currents induced by an electrical current flowing through the inductor.
摘要翻译：半导体结构包括电感器; 以及位于电感器下方的半导体衬底，其具有在电感器下方并与电感平行的平面上的不连续材料密度，从而减少由流过电感器的电流引起的涡流。

9. 发明授权

US08703609B2 Through-substrate via for semiconductor device 有权
标题翻译：用于半导体器件的通孔基板通孔
公开(公告)号：US08703609B2
公开(公告)日：2014-04-22
申请号：US13175022
申请日：2011-07-01
申请人： Chen-Cheng Kuo , Chen Chen-Shien , Kai-Ming Ching , Chih-Hua Chen
发明人： Chen-Cheng Kuo , Chen Chen-Shien , Kai-Ming Ching , Chih-Hua Chen
IPC分类号： H01L21/44
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A method of fabricating a semiconductor device including providing a substrate having a front surface and a back surface. A masking element is formed on the front surface of the substrate. The masking element includes a first layer having a first opening and a second layer having a second opening of a greater width than the first opening. The second opening is a tapered opening. The method further includes etching a tapered profile via extending from the front surface to the back surface of the substrate using the formed masking element.
摘要翻译：一种制造半导体器件的方法，包括提供具有前表面和后表面的衬底。掩模元件形成在基板的前表面上。掩模元件包括具有第一开口的第一层和具有比第一开口更宽的第二开口的第二层。第二个开口是锥形开口。该方法还包括使用形成的遮蔽元件从基板的前表面延伸到背面来蚀刻锥形轮廓。

10. 发明申请

US20130028709A1 FAN MODULE 有权
标题翻译：风扇模块
公开(公告)号：US20130028709A1
公开(公告)日：2013-01-31
申请号：US13283589
申请日：2011-10-28
申请人： CHIH-HUA CHEN
发明人： CHIH-HUA CHEN
IPC分类号： F04D29/66
CPC分类号： F04D19/007 , F04D29/601 , F04D29/668
摘要： A fan module includes a cooling fan, a supporting rack, and a number of fasteners sandwiched between the cooling fan and the supporting rack. The fasteners are made of vibration-resistant material. The supporting rack includes two opposite supporting walls. An installing portion protrudes out from a top of each supporting plate. Each fastener is sandwiched between the cooling fan and the corresponding installing portion. An extension portion extends from each fastener to resist against an outside surface of the cooling fan.
摘要翻译：风扇模块包括冷却风扇，支撑架和夹在冷却风扇和支撑架之间的多个紧固件。紧固件由抗振材料制成。支撑架包括两个相对的支撑壁。安装部从每个支撑板的顶部突出。每个紧固件夹在冷却风扇和相应的安装部分之间。延伸部分从每个紧固件延伸以抵抗冷却风扇的外表面。

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