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1. 发明授权

US06344369B1 Method of protecting a bond pad structure, of a color image sensor cell, during a color filter fabrication process 有权
标题翻译：在滤色器制造过程中保护彩色图像传感器单元的接合焊盘结构的方法
公开(公告)号：US06344369B1
公开(公告)日：2002-02-05
申请号：US09609673
申请日：2000-07-03
申请人： Chia-Mei Huang , Chao-Yi Lan , Hsiao-Ping Chang , Chia-Kung Chang
发明人： Chia-Mei Huang , Chao-Yi Lan , Hsiao-Ping Chang , Chia-Kung Chang
IPC分类号： H01L2100
CPC分类号： H01L27/1462 , H01L24/11 , H01L27/14621 , H01L27/14627 , H01L27/1469 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01029
摘要： A process for forming a color image sensor cell, in which a bonding pad structure is protected from exposure to alkaline developer solution, used for definition of color filter elements, and also used to open a contact hole to the bonding pad structure, has been developed. The process features the use of a passivation layer, comprised of an overlying silicon nitride layer, and an underlying silicon oxide layer, located on the top surface of the bonding pad structure. The passivation layer protects the underlying bond pad structure from alkaline developer solutions used to define overlying color filter elements, of the color image sensor cell. After definition of the color filter elements the contact hole opening to the bond pad is finalized using a dry etching procedure, applied to the passivation layer. By use of this invention the bond pad structure is protected by the passivation layer during the color filter process, preventing stain and discolouring of the bond pad structure, by the alkaline developer solution used for definition of the color filter elements, thus resulting in improvements of the mechanical properties, as well as the bondabilty properties, of bond pad structure.
摘要翻译：已经开发了用于形成彩色图像传感器单元的方法，其中保护接合焊盘结构不被暴露于碱性显影剂溶液，用于定义滤色器元件，并且还用于打开到焊盘结构的接触孔。该工艺的特征在于使用由覆盖的氮化硅层构成的钝化层和位于焊盘结构的顶表面上的下面的氧化硅层。钝化层保护底层接合焊盘结构免受用于限定彩色图像传感器单元的覆盖滤色器元件的碱性显影剂溶液的影响。在定义滤色器元件之后，使用干式蚀刻工艺来确定接合焊盘开口的接触孔，施加到钝化层。通过使用本发明，在滤色器过程期间，焊盘结构被钝化层保护，通过用于定义滤色器元件的碱性显影剂溶液防止粘合垫结构的污染和变色，从而导致改进粘结垫结构的机械性能以及粘合性能。

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