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    • 4. 发明授权
    • Method for the controlled formation of voids in doped glass dielectric
films
    • 在掺杂的玻璃介电膜中控制形成空隙的方法
    • US5719084A
    • 1998-02-17
    • US564922
    • 1995-11-29
    • Thomas G. MallonChi-yi KaoWei-jen HsiaAtsushi Shimoda
    • Thomas G. MallonChi-yi KaoWei-jen HsiaAtsushi Shimoda
    • H01L21/31H01L21/3105H01L21/316H01L21/768H01L21/469
    • H01L21/31051H01L21/76819H01L21/7682
    • A method is provided for the controlled formation of voids in integrated circuit doped glass dielectric films. The film can be formed of borophosphosilica glass (BPSG) or other types of doped glass. The method involves the steps of providing a substrate on which conductors are formed, depositing a first layer of doped glass to a thickness in a predetermined ratio to the size of the space between conductors, reflowing the first doped glass layer, applying one or more additional doped glass layers to make up for any shortfall in desired total doped glass thickness, and performing a high temperature densification to smooth each additional layer. The method provides for increased integrated circuit speed by controlled formation of voids which have a low dielectric constant and therefore reduce capacitance between adjacent conductors. The method can be performed using existing doped glass deposition and reflow equipment.
    • 提供了一种用于在集成电路掺杂的玻璃介电膜中控制形成空隙的方法。 该膜可由硼磷石玻璃(BPSG)或其他类型的掺杂玻璃形成。 该方法包括以下步骤:提供其上形成有导体的基板,将第一掺杂玻璃层以与导体之间的空间的尺寸预定比例的厚度沉积,回流第一掺杂玻璃层,施加一个或多个附加 掺杂的玻璃层以弥补所需的总掺杂玻璃厚度的任何不足,并且执行高温致密化以平滑每个附加层。 该方法通过控制形成具有低介电常数并因此降低相邻导体之间的电容的空隙来提供增加的集成电路速度。 该方法可以使用现有的掺杂玻璃沉积和回流设备进行。
    • 7. 发明授权
    • Method for the controlled formation of voids in doped glass dielectric
films
    • 在掺杂的玻璃介电膜中控制形成空隙的方法
    • US5278103A
    • 1994-01-11
    • US23304
    • 1993-02-26
    • Thomas G. MallonChi-yi KaoWei-jen HsiaAtsushi Shimoda
    • Thomas G. MallonChi-yi KaoWei-jen HsiaAtsushi Shimoda
    • H01L21/31H01L21/3105H01L21/316H01L21/768H01L21/473
    • H01L21/31051H01L21/76819H01L21/7682
    • A method is provided for the controlled formation of voids in integrated circuit doped glass dielectric films. The film can be formed of borophosphosilica glass (BPSG) or other types of doped glass. The method involves the steps of providing a substrate on which conductors are formed, depositing a first layer of doped glass to a thickness in a predetermined ratio to the size of the space between conductors, reflowing the first doped glass layer, applying one or more additional doped glass layers to make up for any shortfall in desired total doped glass thickness, and performing a high temperature densification to smooth each additional layer. The method provides for increased integrated circuit speed by controlled formation of voids which have a low dielectric constant and therefore reduce capacitance between adjacent conductors. The method can be performed using existing doped glass deposition and reflow equipment.
    • 提供了一种用于在集成电路掺杂的玻璃介电膜中控制形成空隙的方法。 该膜可由硼磷石玻璃(BPSG)或其他类型的掺杂玻璃形成。 该方法包括以下步骤:提供其上形成有导体的基板,将第一掺杂玻璃层以与导体之间的空间的尺寸预定比例的厚度沉积,回流第一掺杂玻璃层,施加一个或多个附加 掺杂的玻璃层以弥补所需的总掺杂玻璃厚度的任何不足,并且执行高温致密化以平滑每个附加层。 该方法通过控制形成具有低介电常数并因此降低相邻导体之间的电容的空隙来提供增加的集成电路速度。 该方法可以使用现有的掺杂玻璃沉积和回流设备进行。