专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06428300B2 Ultra mold for encapsulating very thin packages 失效
标题翻译：用于封装非常薄的包装的超模具
公开(公告)号：US06428300B2
公开(公告)日：2002-08-06
申请号：US09876582
申请日：2001-06-07
申请人： John J. Lajza, Jr. , Charles R. Ramsey , Robert M. Smith
发明人： John J. Lajza, Jr. , Charles R. Ramsey , Robert M. Smith
IPC分类号： B29C7072
CPC分类号： B29C43/36 , B29C33/20 , B29C37/005 , B29C43/18 , B29C43/34 , B29C45/14 , B29C45/561 , B29C2043/3444 , B29C2043/5883 , B29L2031/3061 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of encapsulating a workpiece, particularly a microelectronic device, to achieve a very thin encapsulating layer and reduce the finished device size. The method includes positioning the workpiece in the mold cavity of a mold capable of reducing its volume while the mold compound is in a liquid state from a first volume, where mold compound may be easily added without creating voids, to a second smaller volume which defines the finished workpiece size. The second volume is below the size which would permit the void-free encapsulation of the workpiece in a conventional thermosetting plastic transfer molding machine. The mold may be opened in two stages to prevent damage to thin molded microelectronic devices by opening the perimeter of the mold first while the molded device is still being supported by large molding surfaces. The invention also includes the mold used in the method.
摘要翻译：一种封装工件，特别是微电子器件的方法，以实现非常薄的封装层并降低成品的尺寸。该方法包括将模具定位在模具的模具腔中，该模具能够在模具化合物处于液态的情况下从第一体积（其中模制化合物可容易地添加而不产生空隙）缩小至限定成品工件尺寸。第二体积低于允许工件在常规热固性塑料传递模塑机中无空隙的封装的尺寸。模具可以分两个阶段打开，以防止在模制装置仍被大型模制表面支撑的同时首先打开模具的周边而损坏薄的模制微电子装置。本发明还包括该方法中使用的模具。

2. 发明授权

US06603195B1 Planarized plastic package modules for integrated circuits 有权
标题翻译：用于集成电路的平面化塑料封装模块
公开(公告)号：US06603195B1
公开(公告)日：2003-08-05
申请号：US09605173
申请日：2000-06-28
申请人： David V. Caletka , James L. Carper , John P. Cincotta , Kibby B. Horsford , Gary H. Irish , John J. Lajza, Jr. , Gordon C. Osborne, Jr. , Charles R. Ramsey , Robert M. Smith , Michael J. Vadnais
发明人： David V. Caletka , James L. Carper , John P. Cincotta , Kibby B. Horsford , Gary H. Irish , John J. Lajza, Jr. , Gordon C. Osborne, Jr. , Charles R. Ramsey , Robert M. Smith , Michael J. Vadnais
IPC分类号： H01L2350
CPC分类号： H01L23/16 , H01L23/4951 , H01L23/49551 , H01L24/48 , H01L2224/05599 , H01L2224/45015 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/85399 , H01L2924/00014 , H01L2924/01029 , H01L2924/10253 , H01L2924/14 , H01L2924/00 , H01L2924/20752 , H01L2924/207 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.
摘要翻译：半导体模块包括半导体芯片，具有引线指的引线框架和用于减少翘曲的密封剂内的向下固定构件，并且通过平衡引线指和密封剂之间的热应力来提供更平面的封装。下降组件可以是引线框架的弯曲部分。它也可以是单独的体，例如虚拟半导体芯片。

3. 发明授权

US5244372A Molding and gauging system 失效
标题翻译：成型和计量系统
公开(公告)号：US5244372A
公开(公告)日：1993-09-14
申请号：US967293
申请日：1992-10-27
申请人： Charles R. Ramsey , Russell E. Holcomb , Jerry M. Fine , Leland K. Shirely
发明人： Charles R. Ramsey , Russell E. Holcomb , Jerry M. Fine , Leland K. Shirely
IPC分类号： B22D17/22 , B29C37/00 , B29C45/80 , G01B13/12
CPC分类号： B22D17/22 , B29C37/00 , B29C45/80 , G01B13/12 , B29C2037/90
摘要： A molding system including a mold and a molding machine has been adapted to monitor the position of mold element surfaces that move relative to each other to form a mold cavity. The system includes a source of gas under pressure and orifice-forming sensors on a first mold element to direct a flow of pressurized gas from the first mold element. A monitoring system monitors the condition of the gas remote from the first mold element to indicate the spacing between the first mold element and one or more adjacent mold elements as the mold elements move with respect to each other. The molding system can monitor the operation of large, complex die-casting molds that include a plurality of slides movable transversely to the movement of the molding machine and measures and indicates misalignment and warping of die elements, failure of the die elements to close and open properly, and other such irregularities in operation in the presence of the extremely high forces imposed upon the molds by the molding machine, high temperatures and hostile environment and to protect molds and molding machine parts from destructively high forces and to prevent or record manufacture of reject parts.
摘要翻译：包括模具和成型机的模制系统已被适用于监测相对于彼此移动的模具元件表面的位置以形成模腔。该系统包括在压力下的气体源和在第一模具元件上的孔口形成传感器，以引导来自第一模具元件的加压气体流。监测系统监测从第一模具元件远离的气体的状态，以指示当模具元件相对于彼此移动时第一模具元件与一个或多个相邻模具元件之间的间隔。成型系统可以监控大型复杂的压铸模具的操作，其中包括可横向于成型机运动的多个滑块，并测量和指示模具元件的未对准和翘曲，模具元件关闭和打开失败在造型机施加在模具上的极高的力量，高温和恶劣环境的存在下，以及保护模具和模制机器零件免受破坏性的大力并且防止或记录制造废品部分。

4. 发明授权

US07670437B2 Mask and substrate alignment for solder bump process 失效
标题翻译：焊料凸块工艺的掩模和衬底对准
公开(公告)号：US07670437B2
公开(公告)日：2010-03-02
申请号：US12117061
申请日：2008-05-08
申请人： Duane E. Allen , Brian K. Burnor , Thomas A. Dotolo , Leonard J. Gardecki , William L. Hammond , Kibby B. Horsford , Charles R. Ramsey
发明人： Duane E. Allen , Brian K. Burnor , Thomas A. Dotolo , Leonard J. Gardecki , William L. Hammond , Kibby B. Horsford , Charles R. Ramsey
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01L23/544 , H01L21/682 , H01L24/11 , H01L2223/54453 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01066 , H01L2924/01074 , H01L2924/014 , H01L2924/04953 , H01L2224/0401
摘要： A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the fixture, the means for holding fixedly mounted on a stage, the stage moveable in first and second directions and rotatable about an axis relative to the table; means for affixing the fixture containing the mask and the substrate to the table; means for controlling the means for temporarily affixing so as to generate a uniform force around a perimeter of the fixture to effectuate the temporarily affixing; means for aligning the mask to the substrate, the means for aligning controlling movement of the stage in the first and second directions and rotation about the axis; and means for fastening the fixture together.
摘要翻译：一种用于将掩模对准衬底的系统，包括：用于将掩模和衬底相对于彼此保持固定位置的固定件; 用于保持基板的装置，用于保持基板突出通过桌子和固定装置中的开口的装置，用于固定地安装在台架上的保持装置，台架能够在第一和第二方向上移动并且可相对于桌子绕轴线转动; 用于将含有掩模和基材的夹具固定在工作台上的装置; 用于控制用于临时固定的装置以便围绕固定装置的周边产生均匀的力以实现临时固定的装置; 用于将掩模对准基板的装置，用于对准控制台在第一和第二方向上的运动并围绕轴旋转的装置; 以及用于将固定装置固定在一起的装置。

5. 发明授权

US07410919B2 Mask and substrate alignment for solder bump process 失效
标题翻译：焊料凸块工艺的掩模和衬底对准
公开(公告)号：US07410919B2
公开(公告)日：2008-08-12
申请号：US10604142
申请日：2003-06-27
申请人： Duane E Allen , Brian K Burnor , Thomas A Dotolo , Leonard J Gardecki , William L Hammond , Kibby B Horsford , Charles R Ramsey
发明人： Duane E Allen , Brian K Burnor , Thomas A Dotolo , Leonard J Gardecki , William L Hammond , Kibby B Horsford , Charles R Ramsey
IPC分类号： H01L21/00
CPC分类号： H01L23/544 , H01L21/682 , H01L24/11 , H01L2223/54453 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01066 , H01L2924/01074 , H01L2924/014 , H01L2924/04953 , H01L2224/0401
摘要： A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the fixture, the means for holding fixedly mounted on a stage, the stage moveable in first and second directions and rotatable about an axis relative to the table; means for affixing the fixture containing the mask and the substrate to the table; means for controlling the means for temporarily affixing so as to generate a uniform force around a perimeter of the fixture to effectuate the temporarily affixing; means for aligning the mask to the substrate, the means for aligning controlling movement of the stage in the first and second directions and rotation about the axis; and means for fastening the fixture together.
摘要翻译：一种用于将掩模对准衬底的系统，包括：用于将掩模和衬底相对于彼此保持固定位置的固定件; 用于保持基板的装置，用于保持基板突出通过桌子和固定装置中的开口的装置，用于固定地安装在台架上的保持装置，台架能够在第一和第二方向上移动并且可相对于桌子绕轴线转动; 用于将含有掩模和基材的夹具固定在工作台上的装置; 用于控制用于临时固定的装置以便围绕固定装置的周边产生均匀的力以实现临时固定的装置; 用于将掩模对准基板的装置，用于对准控制台在第一和第二方向上的运动并围绕轴旋转的装置; 以及用于将固定装置固定在一起的装置。

6. 发明授权

US06306331B1 Ultra mold for encapsulating very thin packages 失效
标题翻译：用于封装非常薄的包装的超模具
公开(公告)号：US06306331B1
公开(公告)日：2001-10-23
申请号：US09275169
申请日：1999-03-24
申请人： John J. Lajza, Jr. , Charles R. Ramsey , Robert M. Smith
发明人： John J. Lajza, Jr. , Charles R. Ramsey , Robert M. Smith
IPC分类号： B29C7070
CPC分类号： B29C43/36 , B29C33/20 , B29C37/005 , B29C43/18 , B29C43/34 , B29C45/14 , B29C45/561 , B29C2043/3444 , B29C2043/5883 , B29L2031/3061 , H01L21/565 , H01L2924/0002 , H01L2924/00
摘要： A method of encapsulating a workpiece, particularly a microelectronic device, to achieve a very thin encapsulating layer and reduce the finished device size. The method includes positioning the workpiece in the mold cavity of a mold capable of reducing its volume while the mold compound is in a liquid state from a first volume, where mold compound may be easily added without creating voids, to a second smaller volume which defines the finished workpiece size. The second volume is below the size which would permit the void-free encapsulation of the workpiece in a conventional thermosetting plastic transfer molding machine. The mold may be opened in two stages to prevent damage to thin molded microelectronic devices by opening the perimeter of the mold first while the molded device is still being supported by large molding surfaces. The invention also includes the mold used in the method.
摘要翻译：一种封装工件，特别是微电子器件的方法，以实现非常薄的封装层并降低成品的尺寸。该方法包括将模具定位在模具的模具腔中，该模具能够在模具化合物处于液态的情况下从第一体积（其中模制化合物可容易地添加而不产生空隙）缩小至限定成品工件尺寸。第二体积低于允许工件在常规热固性塑料传递模塑机中无空隙的封装的尺寸。模具可以分两个阶段打开，以防止在模制装置仍被大型模制表面支撑的同时首先打开模具的周边而损坏薄的模制微电子装置。本发明还包括该方法中使用的模具。

7. 发明授权

US5333488A Gauging system with improved setup and operating method 失效
标题翻译：测量系统具有改进的设置和操作方法
公开(公告)号：US5333488A
公开(公告)日：1994-08-02
申请号：US869620
申请日：1992-04-16
申请人： Charles R. Ramsey , Russell E. Holcomb , Brian L. Backus
发明人： Charles R. Ramsey , Russell E. Holcomb , Brian L. Backus
IPC分类号： F16K1/04 , B29C45/80 , G01B13/12 , F15B5/00
CPC分类号： G01B13/12 , B29C45/80
摘要： A gauging system includes a source of pressurized fluid, one or more fluid outlet means, each including a fluid line connecting the source of pressurized fluid with a fluid orifice that is located to measure small gaps and distances between the elements of a machine or die, and one or more pressure transducers connected to measure the pressure in each fluid line. One or more adjustable valves are provided between the source of pressurized fluid and each fluid line. A computer measures the transducer output to determine the distance between mold elements. The valve or valves include a threaded male member having an inlet at one end and a frustoconical surface with openings passing through it at the other, and a threaded female member having a channel in one end and an outlet in the other joined by another frustoconical surface. The male member may be screwed into the channel of the female member to control the distance between the two frustoconical surfaces and thus the fluid flow from the inlet to the outlet through the openings. The system is calibrated by measuring the transducer output for a set of distances including the open mold distance, with an essentially infinite hose length. When the system is set up at the customer's location, with the shorter length of hose, the system is brought back into calibration by opening the mold and adjusting the valve until the transducer output is within specification for the mold open calibration point.
摘要翻译：测量系统包括加压流体源，一个或多个流体出口装置，每个流体出口装置包括将加压流体源连接到流体孔口的流体管线，流体孔口被定位成测量机器或模具的元件之间的小间隙和距离，以及一个或多个压力传感器，其连接以测量每个流体管线中的压力。在加压流体源和每个流体管线之间设置一个或多个可调节阀。计算机测量传感器输出以确定模具元件之间的距离。阀或阀包括螺纹凸形构件，其具有在一端的入口和具有穿过另一端的开口的截头圆锥形表面，以及螺纹阴构件，其在一端具有通道，而在另一端具有通道，另一端通过另一个截头圆锥形表面。阳构件可以旋入阴构件的通道中以控制两个截头圆锥形表面之间的距离，从而控制从入口到通过开口的出口的流体流动。通过测量换能器输出来校准系统，该距离包括开放模具距离，具有基本上无限长的软管长度。当系统在客户位置设置时，软管的长度较短，通过打开模具并调整阀门将系统恢复到校准状态，直到传感器输出在模具打开校准点的规格范围内。

8. 发明授权

US4156410A Internal combustion reciprocating engine 失效
标题翻译：内燃往复式发动机
公开(公告)号：US4156410A
公开(公告)日：1979-05-29
申请号：US816375
申请日：1977-07-18
申请人： Charles R. Ramsey
发明人： Charles R. Ramsey
IPC分类号： F01B9/02 , F01L11/02 , F02B75/24 , F02B75/32 , F02B59/00
CPC分类号： F02B75/246 , F01B9/026 , F01L11/02 , F02B75/32
摘要： An internal combustion engine having a housing defining a pair of axially aligned and opposing cylinders with a lubricant chamber therebetween, a stationary piston in the housing extending through the lubricant chamber and having opposite ends disposed within the aligned cylinders, and a hollow cylindrical piston slidably received within the housing and around the stationary piston for reciprocal movement thereby forming a pair of first variable volume chambers between it and the aligned cylinders and a pair of second variable volume chambers between it and the stationary piston. A carburetor communicates with the second chambers through longitudinal passageways in the stationary piston so as to admit a charge of combustible fuel therein which is compressed and then injected into the first chambers for recompression and subsequent combustion, the compression and combustion cycles for the chambers on opposite ends being 180.degree. out of phase. Lubrication for the sliding surfaces between the pistons and the moveable piston and cylinders is accomplished by means of ports which extend through the piston from the crankcase to the stationary piston.
摘要翻译：一种内燃机，其具有限定一对轴向对齐且相对的气缸的壳体，其间具有润滑剂室，所述壳体中的静止活塞延伸穿过所述润滑剂室并且具有设置在所述对准的气缸内的相对端，以及可滑动地接收的中空圆柱形活塞在壳体内并且围绕固定活塞用于往复运动，从而在其与对准的气缸之间形成一对第一可变容积室，以及在其与静止活塞之间的一对第二可变容积室。化油器通过静止活塞中的纵向通道与第二腔室连通，以允许其中的可燃燃料的电荷被压缩，然后被注入到第一腔室中用于再压缩和随后的燃烧，相反的腔室的压缩和燃烧循环结束180度异相。活塞和活动活塞和气缸之间的滑动表面的润滑通过从曲轴箱延伸穿过活塞到静止活塞的端口实现。

9. 发明申请

US20080202421A1 MASK AND SUBSTRATE ALIGNMENT FOR SOLDER BUMP PROCESS 失效
标题翻译：掩模和基板对齐焊接工艺
公开(公告)号：US20080202421A1
公开(公告)日：2008-08-28
申请号：US12117061
申请日：2008-05-08
申请人： Duane E. Allen , Brian K. Burnor , Thomas A. Dotolo , Leonard J. Gardecki , William L. Hammond , Kibby B. Horsford , Charles R. Ramsey
发明人： Duane E. Allen , Brian K. Burnor , Thomas A. Dotolo , Leonard J. Gardecki , William L. Hammond , Kibby B. Horsford , Charles R. Ramsey
IPC分类号： C23C16/44
CPC分类号： H01L23/544 , H01L21/682 , H01L24/11 , H01L2223/54453 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01066 , H01L2924/01074 , H01L2924/014 , H01L2924/04953 , H01L2224/0401
摘要： A system for of aligning a mask to a substrate comprising: a fixture for holding the mask and the substrate in fixed positions relative to each other; means for holding the substrate, the means for holding the substrate protruding through openings in a table and the fixture, the means for holding fixedly mounted on a stage, the stage moveable in first and second directions and rotatable about an axis relative to the table; means for affixing the fixture containing the mask and the substrate to the table; means for controlling the means for temporarily affixing so as to generate a uniform force around a perimeter of the fixture to effectuate the temporarily affixing; means for aligning the mask to the substrate, the means for aligning controlling movement of the stage in the first and second directions and rotation about the axis; and means for fastening the fixture together.
摘要翻译：一种用于将掩模对准衬底的系统，包括：用于将掩模和衬底相对于彼此保持固定位置的固定件; 用于保持基板的装置，用于保持基板突出通过桌子和固定装置中的开口的装置，用于固定地安装在台架上的保持装置，台架能够在第一和第二方向上移动并且可相对于桌子绕轴线转动; 用于将含有掩模和基材的夹具固定在工作台上的装置; 用于控制用于临时固定的装置以便围绕固定装置的周边产生均匀的力以实现临时固定的装置; 用于将掩模对准基板的装置，用于对准控制台在第一和第二方向上的运动并围绕轴旋转的装置; 以及用于将固定装置固定在一起的装置。

10. 发明授权

US5213726A Molding and gauging method 失效
标题翻译：成型和计量方法
公开(公告)号：US5213726A
公开(公告)日：1993-05-25
申请号：US727329
申请日：1991-07-03
申请人： Charles R. Ramsey , Jerry M. Fine , Russell E. Holcomb , Leland K. Shirely
发明人： Charles R. Ramsey , Jerry M. Fine , Russell E. Holcomb , Leland K. Shirely
IPC分类号： B22D17/22 , B29C37/00 , B29C45/80 , G01B13/12
CPC分类号： G01B13/12 , B22D17/22 , B29C37/00 , B29C45/80 , B29C2037/90
摘要： A molding system including a mold and a molding machine has been adapted to monitor the position of mold element surfaces that move relative to each other to form a mold cavity. The system includes a source of gas under pressure and orifice-forming sensors on a first mold element to direct a flow of pressurized gas from the first mold element. A monitoring system monitors the condition of the gas remote from the first mold element to indicate the spacing between the first mold element and one or more adjacent mold elements as the mold elements move with respect to each other. The molding system can monitor the operation of large, complex die-casting molds that include a plurality of slides movable transversely to the movement of the molding machine and measures and indicates misalignment and warping of die elements, failure of the die elements to close and open properly, and other such irregularities in operation in the presence of the extremely high forces imposed upon the molds by the molding machine, high temperatures and hostile environment and to protect molds and molding machine parts from destructively high forces and to prevent or record manufacture of reject parts.
摘要翻译：包括模具和成型机的模制系统已被适用于监测相对于彼此移动的模具元件表面的位置以形成模腔。该系统包括在压力下的气体源和在第一模具元件上的孔口形成传感器，以引导来自第一模具元件的加压气体流。监测系统监测从第一模具元件远离的气体的状态，以指示当模具元件相对于彼此移动时第一模具元件与一个或多个相邻模具元件之间的间隔。成型系统可以监控大型复杂的压铸模具的操作，其中包括可横向于成型机运动的多个滑块，并测量和指示模具元件的未对准和翘曲，模具元件关闭和打开失败在造型机施加在模具上的极高的力量，高温和恶劣环境的存在下，以及保护模具和模制机器零件免受破坏性的大力并且防止或记录制造废品部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式