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1. 发明授权

US08814418B2 Detachable LED module 有权
标题翻译：可拆卸LED模组
公开(公告)号：US08814418B2
公开(公告)日：2014-08-26
申请号：US13565692
申请日：2012-08-02
申请人： Cheng-Da Shaw , Ya-Hui Chiang , Hung-Lieh Hu , Hsin-Yun Tsai , Chun-Hsing Lee , Chao-Wei Li
发明人： Cheng-Da Shaw , Ya-Hui Chiang , Hung-Lieh Hu , Hsin-Yun Tsai , Chun-Hsing Lee , Chao-Wei Li
IPC分类号： F21V23/06 , G02B6/42 , F21V19/00 , A61B1/06
CPC分类号： F21V23/06 , A61B1/0661 , F21V19/003 , G02B6/4261 , G02B6/4269 , G02B6/4292
摘要： A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.
摘要翻译：模块化照明装置包括保持基座，照明模块和导光元件。保持基座包括弹性定位单元。照明模块可移除地设置在保持基座上，并且具有滑动槽和保持槽。光导元件设置在保持基座上并面向照明模块。当照明模块沿着插入方向安装到固定座时，弹性定位单元从滑动槽滑动到保持槽，以将照明模块保持在保持基座中。

2. 发明授权

US08692274B2 Light emitting diode package structure 有权
标题翻译：发光二极管封装结构
公开(公告)号：US08692274B2
公开(公告)日：2014-04-08
申请号：US13448413
申请日：2012-04-17
申请人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
发明人： Chao-Wei Li , Chen-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/648 , H01L33/642 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.
摘要翻译：提供了包括载体基板，至少一个LED芯片，光学元件和导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。导热透明液体填充密封空间。

3. 发明申请

US20120168801A1 LIGHT EMITTING DEVICE AND PACKAGE STRUCTURE THEREOF 审中-公开
标题翻译：发光装置及其包装结构
公开(公告)号：US20120168801A1
公开(公告)日：2012-07-05
申请号：US13383211
申请日：2009-07-10
申请人： Rong Xuan , Chao-Wei Li , Hung-Lieh Hu , Mu-Tao Chu , Chih-Hao Hsu , Jenq-Dar Tsay
发明人： Rong Xuan , Chao-Wei Li , Hung-Lieh Hu , Mu-Tao Chu , Chih-Hao Hsu , Jenq-Dar Tsay
IPC分类号： H01L33/58 , H01L29/20 , H01L33/42
CPC分类号： H01L33/02 , H01L33/38 , H01L33/60 , H01L2224/13 , H01L2224/48091 , H01L2224/48247 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device package structure includes a carrier, at least one light-emitting device and a magnetic element. The magnetic element aids in enhancing overall luminous output efficiency.
摘要翻译：发光器件封装结构包括载体，至少一个发光器件和磁性元件。磁性元件有助于提高整体的发光效率。

4. 发明申请

US20120099303A1 CCT MODULATING METHOD, LED LIGHT SOURCE MODULE, AND PACKAGE STRUCTURE THEREOF 审中-公开
标题翻译： CCT调制方法，LED光源模块及其包装结构
公开(公告)号：US20120099303A1
公开(公告)日：2012-04-26
申请号：US12980351
申请日：2010-12-29
申请人： Chao-Wei Li , Ai-Lien Chang , Hsiang-Chi Chung , Ji-Feng Chen , Hung-Lieh Hu
发明人： Chao-Wei Li , Ai-Lien Chang , Hsiang-Chi Chung , Ji-Feng Chen , Hung-Lieh Hu
IPC分类号： F21V9/00
CPC分类号： H05B33/086 , H01L25/0753 , H01L33/486 , H01L33/50 , H01L2924/0002 , H01L2924/00
摘要： A correlated color temperature (CCT) modulating method including following steps is provided. A white LED light source is modulated to emit a first white light. At least one LED light source is modulated to emit a second white light, wherein the second white light includes at least one broad-spectrum monochromatic light. The first white light and the second white light are mixed to produce a third white light. The color rendering index (CRI) of the third white light is greater than those of the first white light and the second white light, and the color coordinates of the first white light, the second white light, and the third white light are different from each other. Furthermore, an LED light source module and a package structure thereof are also provided.
摘要翻译：提供了包括以下步骤的相关色温（CCT）调制方法。白光LED光源被调制以发射第一白光。至少一个LED光源被调制以发射第二白光，其中第二白光包括至少一个广谱单色光。将第一白光和第二白光混合以产生第三白光。第三白光的显色指数（CRI）大于第一白光和第二白光的显色指数（CRI），第一白光，第二白光和第三白光的色坐标不同于彼此。此外，还提供了LED光源模块及其封装结构。

5. 发明申请

US20130176748A1 MODULARIZED SERVER 有权
标题翻译：模块化服务器
公开(公告)号：US20130176748A1
公开(公告)日：2013-07-11
申请号：US13565692
申请日：2012-08-02
申请人： CHENG-DA SHAW , YA-HUI CHIANG , HUNG-LIEH HU , HSIN-YUN TSAI , CHUN-HSING LEE , CHAO-WEI LI
发明人： CHENG-DA SHAW , YA-HUI CHIANG , HUNG-LIEH HU , HSIN-YUN TSAI , CHUN-HSING LEE , CHAO-WEI LI
IPC分类号： F21V8/00
CPC分类号： F21V23/06 , A61B1/0661 , F21V19/003 , G02B6/4261 , G02B6/4269 , G02B6/4292
摘要： A modularized illuminating device includes a retaining base, a lighting module, and a light guide element. The retaining base includes an elastic positioning unit. The lighting module is removably disposed on the retaining base, and has a sliding groove and a retaining groove. The light guide element is disposed on the retaining base and faces to the lighting module. When the lighting module is installed to the retaining base along a plugging direction, the elastic positioning unit slides from the sliding groove to the retaining groove to retain the lighting module in the retaining base.
摘要翻译：模块化照明装置包括保持基座，照明模块和导光元件。保持基座包括弹性定位单元。照明模块可移除地设置在保持基座上，并且具有滑动槽和保持槽。光导元件设置在保持基座上并面向照明模块。当照明模块沿着插入方向安装到固定座时，弹性定位单元从滑动槽滑动到保持槽，以将照明模块保持在保持基座中。

6. 发明申请

US20130168714A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE 审中-公开
标题翻译：发光二极管封装结构
公开(公告)号：US20130168714A1
公开(公告)日：2013-07-04
申请号：US13633878
申请日：2012-10-03
申请人： Chao-Wei Li , Hung-Lieh Hu
发明人： Chao-Wei Li , Hung-Lieh Hu
IPC分类号： H01L33/52 , H01L33/50
CPC分类号： H01L33/501 , H01L33/505 , H01L33/54 , H01L33/648
摘要： A light emitting diode package structure is provided, including a substrate, a seal assembly, an optical element, at least one light emitting diode chip, and a packaging material layer. The seal assembly is disposed on the substrate. The optical element is disposed on the seal assembly, and an enclosed space is formed between the optical element, the seal assembly, and the substrate. The light emitting diode chip is disposed on the substrate and located in the enclosed space. The packaging material layer is located in the enclosed space and at least disposed on an upper surface of the light emitting diode chip, wherein the packaging material layer includes a liquid with high viscosity and a plurality of solid particles, and the viscosity of the liquid with high viscosity is more than 3000 mPa·s.
摘要翻译：提供了一种发光二极管封装结构，包括基板，密封组件，光学元件，至少一个发光二极管芯片和封装材料层。密封组件设置在基板上。光学元件设置在密封组件上，并且在光学元件，密封组件和基板之间形成封闭空间。发光二极管芯片设置在基板上并位于封闭空间中。包装材料层位于封闭空间中，并且至少设置在发光二极管芯片的上表面上，其中包装材料层包括具有高粘度的液体和多个固体颗粒，并且具有高粘度大于3000mPa·s。

7. 发明申请

US20130010463A1 ILLUMINATION DEVICE 审中-公开
标题翻译：照明装置
公开(公告)号：US20130010463A1
公开(公告)日：2013-01-10
申请号：US13410306
申请日：2012-03-02
申请人： Chao-Wei Li , Cheng-Da Shaw , Hung-Lieh Hu , Yi-Jen Chan
发明人： Chao-Wei Li , Cheng-Da Shaw , Hung-Lieh Hu , Yi-Jen Chan
IPC分类号： F21V29/00 , F21V21/00 , F21V11/00
CPC分类号： F21K9/232 , F21V29/713 , F21V29/773 , F21V29/777 , F21V29/83 , F21Y2107/30 , F21Y2115/10 , Y10T29/49002
摘要： An illumination device including a base, a heat dissipation member, an FPC board and a plurality of light-emitting elements is provided. The heat dissipation member is disposed on the base. The heat dissipation member has a center axis and a curved surface. The center axis passes through the base and the curved surface surrounds the center axis. The FPC board is disposed on the curved surface. The light-emitting elements are disposed on the FPC board.
摘要翻译：提供一种包括基座，散热构件，FPC基板和多个发光元件的照明装置。散热构件设置在基座上。散热构件具有中心轴线和曲面。中心轴穿过基座，曲面围绕中心轴线。 FPC基板设置在曲面上。发光元件设置在FPC基板上。

8. 发明授权

US08178890B2 Light emitting diode package structure 有权
标题翻译：发光二极管封装结构
公开(公告)号：US08178890B2
公开(公告)日：2012-05-15
申请号：US12575470
申请日：2009-10-08
申请人： Chao-Wei Li , Chien-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
发明人： Chao-Wei Li , Chien-Peng Hsu , Yao-Jun Tsai , Hung-Lieh Hu
IPC分类号： H01L33/00
CPC分类号： H01L33/648 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/10155 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a highly thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The highly thermal-conductive transparent liquid fills up the sealed space.
摘要翻译：提供了包括载体基板，至少一个LED芯片，光学元件和高导热透明液体的发光二极管（LED）封装结构。 LED芯片设置在载体基板上并具有有源层。光学元件设置在基板上并与载体基板形成密封空间，并且LED芯片设置在密封空间中。高导热透明液体填充密封空间。

9. 发明申请

US20120012868A1 LIGHT EMITTING CHIP PACKAGE MODULE AND LIGHT EMITTING CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：发光芯片包装模块和发光芯片包装结构及其制造方法
公开(公告)号：US20120012868A1
公开(公告)日：2012-01-19
申请号：US12837513
申请日：2010-07-16
申请人： Hsueh-Chih Chang , Rong Xuan , Chao-Wei Li , Chih-Hao Hsu
发明人： Hsueh-Chih Chang , Rong Xuan , Chao-Wei Li , Chih-Hao Hsu
IPC分类号： H01L33/52 , H01L33/62 , H01L33/48
CPC分类号： H01L33/48 , H01L25/0753 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting chip package module includes a substrate, a light emitting chip package structure, and a magnetic device. The substrate has a surface. The light emitting chip package structure is disposed on the surface of the substrate. The light emitting chip package structure includes a carrier, a light emitting chip, and a sealant. The light emitting chip is disposed on and electrically connected to the carrier. The sealant is disposed on the carrier and covers the light emitting chip. The magnetic device is disposed next to the light emitting chip package structure to apply a magnetic field to the light emitting chip.
摘要翻译：发光芯片封装模块包括衬底，发光芯片封装结构和磁性器件。基板具有表面。发光芯片封装结构设置在基板的表面上。发光芯片封装结构包括载体，发光芯片和密封剂。发光芯片设置在载体上并与其电连接。密封剂设置在载体上并覆盖发光芯片。磁性装置设置在发光芯片封装结构的旁边，以向发光芯片施加磁场。

10. 发明申请

US20090230417A1 LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：发光二极管封装结构及其制造方法
公开(公告)号：US20090230417A1
公开(公告)日：2009-09-17
申请号：US12126935
申请日：2008-05-26
申请人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
发明人： Yao-Jun Tsai , Chen-Peng Hsu , Chao-Wei Li , Hung-Lieh Hu
IPC分类号： H01L33/00 , H01L21/02
CPC分类号： H01L33/486 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48247 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention discloses a light emitting diode (LED) package structure, which includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier, wherein the first protrusion is formed by a thermal conductive material. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
摘要翻译：本发明公开了一种包括载体，第一突起，LED芯片和粘附层的发光二极管（LED）封装结构。第一突起设置在载体上并且具有第一开口以暴露载体，其中第一突起由导热材料形成。 LED芯片设置在载体上的第一开口中，第一开口的宽度与LED芯片的宽度之比为1〜1.5。粘合层设置在LED芯片和载体之间，以将LED芯片接合到载体上。

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