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1. 发明申请

WO2013097135A1 A SILICON BASED MEMS MICROPHONE, A SYSTEM AND A PACKAGE WITH THE SAME 审中-公开
标题翻译：一种基于硅的MEMS麦克风，一个系统和一个包装
公开(公告)号：WO2013097135A1
公开(公告)日：2013-07-04
申请号：PCT/CN2011/084889
申请日：2011-12-29
申请人： GOERTEK INC. , WANG, Zhe , CAI, Mengjin
发明人： WANG, Zhe , CAI, Mengjin
IPC分类号： B81B7/00 , B81C1/00 , H04R19/04 , H04R7/00
CPC分类号： H04R1/02 , B81B7/0061 , B81B2201/0257 , H01L2924/1461 , H04R1/086 , H04R7/04 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2201/02 , H04R2207/00
摘要： A silicon based MEMS microphone comprises a silicon substrate (100) and an acoustic sensing part (11) supported on the silicon substrate, wherein a mesh-structured back hole (140) is formed in the substrate and aligned with the acoustic sensing part, the mesh-structured back hole includes a plurality of mesh beams (141) which are interconnected with each other and supported on the sidewall (142) of the mesh-structure back hole, the plurality of mesh beams and the side wall define a plurality of mesh holes (143) which all have a tapered profile and merge into one hole in the vicinity of the acoustic sensing part at the top side of the silicon substrate. The mesh-structured back hole can help to streamline the air pressure pulse caused, for example, in a drop test and thus reduce the impact on the acoustic sensing part of the microphone, and also serve as a protection filter to prevent alien substances such as particles entering the microphone.
摘要翻译：基于硅的MEMS麦克风包括硅衬底（100）和支撑在硅衬底上的声学感测部件（11），其中在衬底中形成网状结构的后孔（140）并与声学感测部件对准，网格结构的后孔包括彼此互连并支撑在网状结构后孔的侧壁（142）上的多个网格梁（141），多个网格梁和侧壁限定多个网格孔（143），其全部具有锥形轮廓并且在硅衬底的顶侧处合并到声学传感部分附近的一个孔中。网格结构的后孔可以帮助简化例如在跌落测试中引起的空气压力脉冲，从而减少对麦克风的声学传感部分的影响，并且还用作保护过滤器以防止外来物质例如颗粒进入麦克风。

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