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1. 发明授权

US09029127B2 Method of degrading TBP using a photosynthetic bacterial strain 有权
标题翻译：使用光合细菌菌株降解TBP的方法
公开(公告)号：US09029127B2
公开(公告)日：2015-05-12
申请号：US10556324
申请日：2004-05-13
申请人： Daniel Garcia , Cécile Berne
发明人： Daniel Garcia , Cécile Berne
IPC分类号： B08B3/00 , B01D15/00 , C09D189/00 , C02F3/34 , C12N1/21 , A01N25/10 , A01N37/46 , A01N63/02 , C07K14/80
CPC分类号： C02F3/34 , A01N25/10 , A01N37/46 , A01N63/02 , C07K14/80
摘要： The invention relates to: a method of treating liquid waste (liquid agricultural or industrial effluents or aquatic sites) which is loaded or polluted with tributyl phosphate (TBP), modified bacterial strains which can be used in the aforementioned treatment method, a method for monitoring changes in TBP pollution, and the device which is used to perform said treatment method. According to the invention, the liquid waste-treatment or -purification method essentially comprises: steps (1) consisting in bringing said liquid waste into contact with at least one non-sulphur purple photosynthetic bacterial strain which is resistant to TBP and which is selected from the group containing Rhodopseudomonas palustris (Rp. palustris), Rhodospirillum rubrum (Rs. rubrum), Rhodobacter capsulatus (Rb. capsulatus) or Rhodobacter sphaeroides (Rb. Sphaeroides) as well as the aforementioned modified bacterial strains in order to overexpress cytochrome P450 in conditions that enable the degradation of the TBP present in said waste, regardless of the initial TBP concentration; and (2) the recovery of the purified liquid effluents.
摘要翻译：本发明涉及一种处理用磷酸三丁酯（TBP）负载或污染的废液（液体农业或工业废水或水域）的方法，可用于上述处理方法的改良细菌菌株，监测方法 TBP污染的变化以及用于执行所述处理方法的装置。根据本发明，液体废物处理或纯化方法基本上包括：步骤（1），其使所述废液与至少一种对TBP有抗性的非硫紫色光合细菌菌株接触，并且选自该组包含红假单胞菌（Rop palustris），红紫苏（Rhodospirillum rubrum）（红霉素），红长棍菌（Rb.s capsulatus）或罗红假单胞菌（Rb.Sphaeroides））以及上述修饰的细菌菌株，以在条件中过表达细胞色素P450 使得能够降低存在于所述废物中的TBP，而不管初始TBP浓度如何; 和（2）净化液体流出物的回收。

2. 发明授权

US07406994B2 Substrate layer cutting device and method 有权
标题翻译：基材层切割装置及方法
公开(公告)号：US07406994B2
公开(公告)日：2008-08-05
申请号：US11668799
申请日：2007-01-30
申请人： Muriel Martinez , Thierry Barge , Alain Soubie , Chrystelle Lagahe-Blanchard , Cécile Berne , Olivier Rayssac
发明人： Muriel Martinez , Thierry Barge , Alain Soubie , Chrystelle Lagahe-Blanchard , Cécile Berne , Olivier Rayssac
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0023 , B28D5/0064 , B28D5/0082 , Y10S156/921 , Y10T83/7607 , Y10T83/7667 , Y10T156/1142 , Y10T156/1179 , Y10T156/1967 , Y10T156/1983
摘要： An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral annular notch located below the weakened area. The positioning member maintains the position of the substrate on a moveable support. A cutting mechanism having at least one blade is provided for contacting the substrate and inducing a cleaving wave therein. The cutting mechanism is operatively associated with the positioning member so that the as at least one blade contacts the annular notch, the positioning member prevents movement of the substrate and the moveable support moves away from the substrate to allow the cleaving wave to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area.
摘要翻译：一种用于从半导体衬底分离层的自动高精度层切割装置。该装置包括用于接收其中具有弱化区域的半导体衬底的至少一部分和位于弱化区域下方的周边环形凹口的固定定位构件。定位构件将基板的位置保持在可移动支撑件上。提供具有至少一个叶片的切割机构用于接触基底并在其中引入切割波。切割机构与定位构件可操作地相关联，使得至少一个叶片接触环形凹口，定位构件防止基底移动，并且可移动支撑件远离基底移动，以允许分裂波将基底在切口处形成第一和第二部分，并且沿着弱化区域从基板分离层。

3. 发明授权

US07189304B2 Substrate layer cutting device and method 有权
标题翻译：基材层切割装置及方法
公开(公告)号：US07189304B2
公开(公告)日：2007-03-13
申请号：US10681566
申请日：2003-10-07
申请人： Muriel Martinez , Thierry Barge , Alain Soubie , Chrystelle Lagahe-Blanchard , Cécile Berne , Olivier Rayssac
发明人： Muriel Martinez , Thierry Barge , Alain Soubie , Chrystelle Lagahe-Blanchard , Cécile Berne , Olivier Rayssac
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , B28D5/0011 , B28D5/0023 , B28D5/0064 , B28D5/0082 , Y10S156/921 , Y10T83/7607 , Y10T83/7667 , Y10T156/1142 , Y10T156/1179 , Y10T156/1967 , Y10T156/1983
摘要： An automatic high-precision layer cutting device for separating a layer from a semiconductor substrate. The cutting device includes a fixed positioning member for receiving at least a portion of a semiconductor substrate that has a weakened area therein and a peripheral annular notch that is located below the weakened area. The positioning member maintains a predetermined position of the substrate on a support. The device also includes cutting means having at least one blade for contacting the substrate and for inducing a cleaving wave into the substrate. The cutting means is operatively associated with the positioning member so that the at least one blade contacts the annular notch and the positioning member prevents movement of the substrate. The at least one blade induces a cleaving wave of sufficient intensity to both divide the substrate at the notch into first and second parts and detach the layer from the substrate along the weakened area.
摘要翻译：一种用于从半导体衬底分离层的自动高精度层切割装置。切割装置包括用于接收其中具有弱化区域的半导体衬底的至少一部分和位于弱化区域下方的周边环形凹口的固定定位构件。定位构件将基板的预定位置保持在支撑件上。该装置还包括切割装置，该切割装置具有至少一个叶片，用于接触基底并用于将基本的分裂波引入基片。切割装置与定位构件可操作地相关联，使得至少一个叶片接触环形凹口，并且定位构件防止基底移动。所述至少一个叶片产生足够强度的分裂波，以将所述切口处的所述基底分成第一和第二部分，并且沿着所述弱化区域从所述基底分离所述层。

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