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    • 2. 发明授权
    • Method of controlling probe tip sanding in semiconductor device testing equipment
    • 半导体器件测试设备中探针尖端砂磨的控制方法
    • US07094615B2
    • 2006-08-22
    • US10649250
    • 2003-08-26
    • Kwang-Yung CheongJun-Sung KimByung-Wook Choi
    • Kwang-Yung CheongJun-Sung KimByung-Wook Choi
    • G01R31/26H01L21/66
    • G01R27/205G01R1/06711G01R3/00G01R35/00
    • In a method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment, resistance values of pads of a probed chip are measured and stored. If a maximum resistance value among the stored resistance values is greater than a contact resistance reference value, a consecutive fail counting value and an accumulated fail counting value are increased. An automatic sanding command is generated to activate automatic sanding of a probe tip, when at least one of the consecutive fail counting value and the accumulated fail counting value is greater than a respective counting reference value. In this manner, false negative readings in the testing of semiconductor devices as the result of increased contact resistance between a probe tip and a pad in an EDS test are reduced and therefore device yield is improved.
    • 在半导体器件测试设备中用于控制探针尖端砂磨的方法和装置中,测量和存储探测芯片的焊盘的电阻值。 如果所存储的电阻值中的最大电阻值大于接触电阻基准值,则连续的故障计数值和累计故障计数值增加。 当连续故障计数值和累积故障计数值中的至少一个大于相应的计数参考值时,产生自动打磨命令以激活探头尖端的自动打磨。 以这种方式,在EDS测试中由于探针尖端和焊盘之间的接触电阻增加而导致的半导体器件测试中的假阴性读数降低,因此器件产量提高。