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    • 9. 发明授权
    • Silicon optoelectronic device, manufacturing method thereof, and image input and/or output apparatus using the same
    • 硅光电子器件及其制造方法,以及使用其的图像输入和/或输出装置
    • US07670862B2
    • 2010-03-02
    • US11284107
    • 2005-11-22
    • In-jae SongByoung-Iyong Choi
    • In-jae SongByoung-Iyong Choi
    • H01L21/00
    • H01L31/1804H01L27/14621H01L27/14685H01L27/156H01L31/02162H01L31/0236H01L31/03529H01L31/1872H01L33/18Y02E10/547Y02P70/521
    • A method of manufacturing a silicon optoelectronic device, a silicon optoelectronic device manufactured by the method, and an image input and/or output apparatus having the silicon optoelectronic device are provided. The method includes: preparing an n-type or p-type silicon-based substrate; forming a polysilicon in one or more regions of the surface of the substrate; oxidizing the surface of the substrate where the polysilicon is formed, to form a silicon oxidation layer on the substrate, and forming a microdefect flection pattern at the interface between the substrate and the silicon oxidation layer, wherein the microdefect flection pattern is formed by the oxidation accelerated by oxygen traveling through boundaries of the grains in the polysilicon; exposing the microdefect flection pattern by etching the silicon oxidation layer; and forming a doping region by doping the exposed microdefect flection pattern with a dopant of the opposite type to the substrate.
    • 提供一种制造硅光电子器件的方法,通过该方法制造的硅光电子器件以及具有硅光电器件的图像输入和/或输出装置。 该方法包括:制备n型或p型硅基衬底; 在所述衬底的表面的一个或多个区域中形成多晶硅; 氧化形成多晶硅的基板的表面,在基板上形成硅氧化层,在基板与硅氧化层之间的界面处形成微缺陷弯曲图案,其中通过氧化形成微缺陷弯曲图案 通过在多晶硅中的晶粒的边界移动的氧加速; 通过蚀刻硅氧化层暴露微缺陷弯曲图案; 以及通过将与所述衬底相反类型的掺杂剂掺杂所述暴露的微缺陷弯曲图案来形成掺杂区域。