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1. 发明授权

US06989593B2 Die-up ball grid array package with patterned stiffener opening 有权
公开(公告)号：US06989593B2
公开(公告)日：2006-01-24
申请号：US10201309
申请日：2002-07-24
申请人： Reza-ur Rahman Khan , Sam Ziqun Zhao , Brent Bacher
发明人： Reza-ur Rahman Khan , Sam Ziqun Zhao , Brent Bacher
IPC分类号： H01L23/10 , H01L23/34 , H01L23/48 , H01L23/52
CPC分类号： H01L23/34 , H01L23/3677 , H01L23/3735 , H01L23/4334 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5384 , H01L23/562 , H01L24/14 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665
摘要： An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.

2. 发明申请

US20050029657A1 Enhanced die-up ball grid array and method for making the same 审中-公开
标题翻译：增强的模压球栅阵列及其制作方法
公开(公告)号：US20050029657A1
公开(公告)日：2005-02-10
申请号：US10942031
申请日：2004-09-16
申请人： Reza-ur Khan , Sam Zhao , Brent Bacher
发明人： Reza-ur Khan , Sam Zhao , Brent Bacher
IPC分类号： H01L23/373 , H01L23/433 , H01L29/40 , H01L23/52
CPC分类号： H01L23/34 , H01L23/3677 , H01L23/3735 , H01L23/4334 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5384 , H01L23/562 , H01L24/14 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665
摘要： An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.
摘要翻译：描述了一种电和热增强的去卷带基板球栅阵列（BGA）封装和裸芯片塑料基板BGA封装。提供具有第一表面和第二表面的基底。加强件具有第一表面和第二表面。第二加强件表面附接到第一基板表面。 IC管芯具有第一表面和第二表面。第一IC模具表面安装到第一加强件表面。多个焊球被附接到第二基板表面。一方面，散热器安装到第二IC模具表面。在另一方面，加强件联接到地面以用作接地平面。在另一方面，衬底具有暴露第二加强件表面的一部分的窗口。第二加强件表面的暴露部分被配置为联接到印刷电路板（PCB）。在另一方面，金属环附接到第一加强件表面。在另一方面，加强件中的引线接合开口由一个或多个螺柱桥接。

3. 发明申请

US20090203172A1 Enhanced Die-Up Ball Grid Array and Method for Making the Same 审中-公开
标题翻译：增强失真球栅阵列及其制作方法
公开(公告)号：US20090203172A1
公开(公告)日：2009-08-13
申请号：US12424270
申请日：2009-04-15
申请人： Reza-ur Rahman Khan , Sam Ziqun Zhao , Brent Bacher
发明人： Reza-ur Rahman Khan , Sam Ziqun Zhao , Brent Bacher
IPC分类号： H01L21/60
CPC分类号： H01L23/34 , H01L23/3677 , H01L23/3735 , H01L23/4334 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5384 , H01L23/562 , H01L24/14 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665
摘要： Methods of assembling a ball grid array (BGA) package is provided. One method includes providing a tape substrate that has a first surface and a second surface, attaching a first surface of a stiffener to the first substrate surface, mounting an IC die to the second stiffener surface, mounting a heat spreader to the IC die, and attaching a plurality of solder balls to the second substrate surface.
摘要翻译：提供了组装球栅阵列（BGA）封装的方法。一种方法包括提供具有第一表面和第二表面的带基底，将加强件的第一表面附接到第一基底表面，将IC管芯安装到第二加强件表面，将散热器安装到IC管芯，以及将多个焊球附接到第二基板表面。

4. 发明授权

US07102225B2 Die-up ball grid array package with printed circuit board attachable heat spreader 有权
公开(公告)号：US07102225B2
公开(公告)日：2006-09-05
申请号：US10200336
申请日：2002-07-23
申请人： Reza-ur R Khan , Sam Z Zhao , Brent Bacher
发明人： Reza-ur R Khan , Sam Z Zhao , Brent Bacher
IPC分类号： H01L23/10 , H01L23/34 , H01L23/48 , H01L23/52
CPC分类号： H01L23/34 , H01L23/3677 , H01L23/3735 , H01L23/4334 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5384 , H01L23/562 , H01L24/14 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665
摘要： An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.

5. 发明授权

US07038312B2 Die-up ball grid array package with attached stiffener ring 有权
公开(公告)号：US07038312B2
公开(公告)日：2006-05-02
申请号：US10197438
申请日：2002-07-18
申请人： Reza-ur R Khan , Sam Z Zhao , Brent Bacher
发明人： Reza-ur R Khan , Sam Z Zhao , Brent Bacher
IPC分类号： H01L23/10 , H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/34 , H01L23/3677 , H01L23/3735 , H01L23/4334 , H01L23/49816 , H01L23/49838 , H01L23/50 , H01L23/5384 , H01L23/562 , H01L24/14 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/2929 , H01L2224/29339 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45144 , H01L2224/48227 , H01L2224/48228 , H01L2224/48237 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73215 , H01L2224/73265 , H01L2924/01013 , H01L2924/01029 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/0665
摘要： An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second surface is provided. The stiffener has a first surface and a second surface. The second stiffener surface is attached to the first substrate surface. An IC die has a first surface and a second surface. The first IC die surface is mounted to the first stiffener surface. A plurality of solder balls is attached to the second substrate surface. In one aspect, a heat spreader is mounted to the second IC die surface. In another aspect, the stiffener is coupled to ground to act as a ground plane. In another aspect, the substrate has a window opening that exposes a portion of the second stiffener surface. The exposed portion of the second stiffener surface is configured to be coupled to a printed circuit board (PCB). In another aspect, a metal ring is attached to the first stiffener surface. In another aspect, wire bond openings in the stiffener are bridged by one or more studs.

6. 发明授权

US6069027A Fixture for lid-attachment for encapsulated packages 失效
标题翻译：用于密封包装的盖子附件的夹具
公开(公告)号：US6069027A
公开(公告)日：2000-05-30
申请号：US859751
申请日：1997-05-21
申请人： Atila Mertol , Brent Bacher
发明人： Atila Mertol , Brent Bacher
IPC分类号： H01L21/50 , H01L23/04 , H01L21/44 , H01L21/48
CPC分类号： H01L21/50 , H01L23/04 , H01L2224/05599 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/85399 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/181
摘要： An electronic semiconductor device package, the package having: a substrate having a top and bottom surface and having traces; a die attached to the top surface of the substrate; first level interconnects of the die to the traces of the substrate; encapsulant which covers the die and first level interconnects; and a lid attached to the encapsulant, wherein the lid comprises at least one lid support which extends from the lid to the substrate. A fixture for attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the fixture having: an interior opening for receiving the lid and package, wherein the interior opening comprises first and second walls, wherein the first wall of the interior opening corresponds to an outside dimension of the substrate and wherein the second wall corresponds to an outside dimension of the lid. A method of attaching a lid to an electronic semiconductor device package, the package having: a substrate having a top surface and a bottom surface and having traces, a die attached to the top surface of the substrate, first level interconnects of the die to the traces of the substrate, and the method having: inserting a lid into a fixture, wherein the fixture comprises an interior opening for receiving the lid and package wherein the interior opening has a first wall corresponding to a dimension of the substrate and a second wall corresponding to a dimension of the lid; applying adhesive between the lid and package; and inserting a package into the fixture.
摘要翻译：一种电子半导体器件封装，所述封装具有：具有顶表面和底表面并具有迹线的衬底; 附着在基板顶表面上的模具; 芯片的第一级互连与衬底的迹线; 覆盖芯片和第一级互连的密封剂; 以及附接到所述密封剂的盖子，其中所述盖子包括从所述盖子延伸到所述基底的至少一个盖子支撑件。一种用于将盖子附接到电子半导体器件封装的固定器，所述封装具有：具有顶表面和底表面并具有迹线的衬底，附接到所述衬底的顶表面的管芯，所述管芯的所述第一级互连衬底的迹线和固定装置具有：用于容纳盖和封装件的内部开口，其中内部开口包括第一和第二壁，其中内部开口的第一壁对应于衬底的外部尺寸，并且其中第二个壁对应于盖的外部尺寸。一种将盖子附接到电子半导体器件封装的方法，封装具有：具有顶表面和底表面并具有迹线的衬底，附接到衬底顶表面的管芯，将管芯的第一级互连衬底的痕迹，并且该方法具有：将盖子插入固定装置中，其中固定装置包括用于容纳盖子和包装的内部开口，其中内部开口具有对应于衬底的尺寸的第一壁和对应于衬底的第二壁到盖的尺寸; 在盖和包装之间施加粘合剂; 并将包装插入夹具。

7. 发明授权

US5972738A PBGA stiffener package 失效
标题翻译： PBGA加强筋包装
公开(公告)号：US5972738A
公开(公告)日：1999-10-26
申请号：US852597
申请日：1997-05-07
申请人： Sutee Vongfuangfoo , Brent Bacher , Felipe Sumagaysay
发明人： Sutee Vongfuangfoo , Brent Bacher , Felipe Sumagaysay
IPC分类号： H01L23/24 , H01L21/52 , H01L21/58 , H01L21/60
CPC分类号： H01L23/24 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , Y10T29/41
摘要： A PBGA package includes PBGA member, a stiffener ring, and a stiffener fixture which includes a retaining recess having a floor for receiving the stiffener ring and includes a ledge positioned above the recess floor for receiving the PBGA member. An adhesive layer is applied to the stiffener ring, which is adhered to the PBGA member. The stiffener ring and PBGA member are essentially coplanar to less than 8 mils. A top plate is placed on top of the PBGA member and the ring and member are secured together tightly.
摘要翻译： PBGA封装包括PBGA构件，加强环和加强件固定件，其包括具有用于容纳加强环的底板的保持凹部，并且包括位于凹部底部上方用于接收PBGA构件的凸缘。将粘合层施加到加强环上，该加强环粘附到PBGA构件上。加强环和PBGA构件基本上共面至小于8密耳。将顶板放置在PBGA构件的顶部上，并将环和构件紧固在一起。

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