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1. 发明申请

US20060014550A1 Supporting idle mode of mobile station in wireless access system 有权
公开(公告)号：US20060014550A1
公开(公告)日：2006-01-19
申请号：US11146767
申请日：2005-06-06
申请人： Ki Ryu , Beum Kim
发明人： Ki Ryu , Beum Kim
IPC分类号： H04Q7/20
CPC分类号： H04W60/04 , H04W52/0216 , H04W68/00 , Y02D70/146
摘要： A method of supporting a mobile station that is in an idle mode in a wireless communication system using a paging controller comprises entering an idle mode by a mobile station, receiving a paging command from a base station in the same paging group, the paging command comprising a paging command action code associated with performing ranging while the mobile station is in the idle mode to verify availability of the mobile station with respect to at least one of the base stations in the paging group, wherein the paging command is generated from the base station in response to a paging announcement from the paging controller, and exiting the idle mode and establishing communication with one of the plurality of base stations, wherein the plurality of base stations in the same paging group receive an idle mode exist status from the paging controller.

2. 发明申请

US20140225236A1 SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE 审中-公开
标题翻译：半导体器件，半导体封装和电子器件
公开(公告)号：US20140225236A1
公开(公告)日：2014-08-14
申请号：US14254969
申请日：2014-04-17
申请人： Yong-Hoon KIM , In-Ho CHOI , Keung-Beum KIM
发明人： Yong-Hoon KIM , In-Ho CHOI , Keung-Beum KIM
IPC分类号： H01L23/552 , H01L21/48
CPC分类号： H01L23/552 , H01L21/4814 , H01L21/78 , H01L23/3121 , H01L23/3135 , H01L23/3192 , H01L23/49816 , H01L23/5225 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05548 , H01L2224/05567 , H01L2224/05571 , H01L2224/05572 , H01L2224/13021 , H01L2224/13022 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/9202 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01056 , H01L2924/01066 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.
摘要翻译：提供半导体器件，半导体封装和电子器件。电子设备包括设置在电路基板上的第一半导体封装。第二半导体封装设置在电路基板上并与第一半导体封装间隔开。绝缘电磁屏蔽结构设置在第一半导体封装的顶表面和侧表面上。导电电磁屏蔽结构设置在电路基板上以覆盖第一和第二半导体封装和绝缘电磁屏蔽结构。

3. 发明授权

US08736032B2 Semiconductor device, semiconductor package, and electronic device 有权
标题翻译：半导体器件，半导体封装和电子器件
公开(公告)号：US08736032B2
公开(公告)日：2014-05-27
申请号：US13437285
申请日：2012-04-02
申请人： Yong-Hoon Kim , In-Ho Choi , Keung-Beum Kim
发明人： Yong-Hoon Kim , In-Ho Choi , Keung-Beum Kim
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L21/4814 , H01L21/78 , H01L23/3121 , H01L23/3135 , H01L23/3192 , H01L23/49816 , H01L23/5225 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L2224/0401 , H01L2224/04042 , H01L2224/05548 , H01L2224/05567 , H01L2224/05571 , H01L2224/05572 , H01L2224/13021 , H01L2224/13022 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/9202 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06565 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01047 , H01L2924/01056 , H01L2924/01066 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/15174 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3025 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.
摘要翻译：提供半导体器件，半导体封装和电子器件。电子设备包括设置在电路基板上的第一半导体封装。第二半导体封装设置在电路基板上并与第一半导体封装间隔开。绝缘电磁屏蔽结构设置在第一半导体封装的顶表面和侧表面上。导电电磁屏蔽结构设置在电路基板上以覆盖第一和第二半导体封装和绝缘电磁屏蔽结构。

4. 发明申请

US20070124808A1 System and method for providing bi-directional communication service 审中-公开
标题翻译：用于提供双向通信服务的系统和方法
公开(公告)号：US20070124808A1
公开(公告)日：2007-05-31
申请号：US11289868
申请日：2005-11-29
申请人： Jeong-Woo Jwa , Choon-Sup Kim , Beum Kim
发明人： Jeong-Woo Jwa , Choon-Sup Kim , Beum Kim
IPC分类号： H04L9/32
CPC分类号： H04L51/14 , H04L51/38
摘要： A system for providing a bi-directional communication service is provided. The system includes a client terminal and a bi-directional communication service providing/managing server. The client terminal sends a short message after passing a user authentication and receives a short message from outside. The bi-directional communication service providing/managing server transmits the short message sent by the client terminal simultaneously to at least two other party client terminals after a user authentication process, or transmits a short message received from another party client terminal to the client terminal after a user authentication process.
摘要翻译：提供了一种用于提供双向通信服务的系统。该系统包括客户终端和双向通信服务提供/管理服务器。客户终端在通过用户认证后发送短消息，并从外部接收短消息。双向通信服务提供/管理服务器在用户认证处理之后将客户端终端发送的短消息同时发送给至少两个其他方客户终端，或者在经由客户端终端从另一方客户终端接收到的短消息发送到客户终端之后，用户认证过程。

5. 发明授权

US09557616B2 Source driver, an image display assembly and an image display apparatus 有权
标题翻译：源驱动器，图像显示组件和图像显示装置
公开(公告)号：US09557616B2
公开(公告)日：2017-01-31
申请号：US13242394
申请日：2011-09-23
申请人： Ye-Chung Chung , Hee-seok Lee , Yun-Seok Choi , Keung-Beum Kim
发明人： Ye-Chung Chung , Hee-seok Lee , Yun-Seok Choi , Keung-Beum Kim
IPC分类号： G06F3/038 , H03K3/00 , G02F1/1345
CPC分类号： H01L27/1244 , G02F1/13452 , G09G3/20 , G09G2300/0426 , G09G2310/08 , G09G2330/021 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/105 , H01L2224/13124 , H01L2224/13639 , H01L2224/16225 , H01L2224/73204 , H01L2924/1426 , H05K1/148
摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.
摘要翻译：图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素。栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

6. 发明申请

US20160181195A1 SUBSTRATE STRIP AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME 审中-公开
标题翻译：基片和使用该半导体器件的半导体器件的制造方法
公开(公告)号：US20160181195A1
公开(公告)日：2016-06-23
申请号：US14972341
申请日：2015-12-17
申请人： KEUNG BEUM KIM , WONCHUL LIM , DONGSUK KIM , YONGHOON KIM
发明人： KEUNG BEUM KIM , WONCHUL LIM , DONGSUK KIM , YONGHOON KIM
IPC分类号： H01L23/498 , H01L23/31
摘要： A substrate includes a substrate body including a plurality of chip mounting regions and a peripheral region surrounding the plurality of chip mounting regions, each of the chip mounting regions including a conductive plane. The substrate further includes a conductive support structure located in the peripheral region, first conductive lines connected between the conductive planes of adjacent chip mounting regions, and second conductive lines connected between the conductive support structure and the conductive planes of chip mounting regions located adjacent the peripheral region.
摘要翻译：基板包括：基板主体，包括多个芯片安装区域和围绕多个芯片安装区域的周边区域，每个芯片安装区域包括导电平面。基板还包括位于周边区域中的导电支撑结构，连接在相邻芯片安装区域的导电平面之间的第一导电线和连接在导电支撑结构与位于周边的芯片安装区域的导电平面之间的第二导线地区。

7. 发明申请

US20140246788A1 STACK-TYPE SEMICONDUCTOR PACKAGE 有权
标题翻译：堆叠型半导体封装
公开(公告)号：US20140246788A1
公开(公告)日：2014-09-04
申请号：US14099860
申请日：2013-12-06
申请人： YONGHOON KIM , KEUNG BEUM KIM , INHO CHOI
发明人： YONGHOON KIM , KEUNG BEUM KIM , INHO CHOI
IPC分类号： H01L25/065
CPC分类号： H01L25/0657 , G11C5/025 , H01L25/0652 , H01L25/105 , H01L25/18 , H01L2224/16145 , H01L2224/16225 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/45139 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/1023 , H01L2225/1058 , H01L2924/15174 , H01L2924/15192 , H01L2924/15311 , H01L2924/00014 , H01L2924/00
摘要： Provided is a stack-type semiconductor package comprising a first semiconductor package with a first package substrate and a logic chip mounted thereon, a second semiconductor package including a second package substrate disposed on the first semiconductor package and first and second memory chips stacked on the second package substrate, and connection pads disposed between the first and second package substrates to connect the first and second semiconductor packages electrically to each other. The first package substrate has first and second edges that are substantially perpendicular to each other. The first package substrate may include first DQ connection pads electrically connected to the first memory chip, and second DQ connection pads electrically connected to the second memory chip. The first DQ connection pads may be arranged adjacent to the first edge and the second DQ connection pads may be arranged adjacent to the second edge.
摘要翻译：提供了一种堆叠型半导体封装，其包括具有第一封装衬底和安装在其上的逻辑芯片的第一半导体封装，第二半导体封装，包括设置在第一半导体封装上的第二封装衬底和堆叠在第二半导体封装上的第一和第二存储器芯片封装衬底和设置在第一和第二封装衬底之间的连接焊盘，以将第一和第二半导体封装彼此电连接。第一封装衬底具有基本上彼此垂直的第一和第二边缘。第一封装衬底可以包括电连接到第一存储器芯片的第一DQ连接焊盘和电连接到第二存储器芯片的第二DQ连接焊盘。第一DQ连接焊盘可以布置成与第一边缘相邻，并且第二DQ连接焊盘可以布置成与第二边缘相邻。

8. 发明申请

US20130062102A1 DOUBLE-SIDED FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：双面柔性印刷电路板及其制造方法
公开(公告)号：US20130062102A1
公开(公告)日：2013-03-14
申请号：US13697246
申请日：2010-07-19
申请人： Sung Won Lee , Jae Beum Kim , Hwa Jin Kim
发明人： Sung Won Lee , Jae Beum Kim , Hwa Jin Kim
IPC分类号： H05K1/03 , H05K3/06
CPC分类号： H05K3/427 , H05K1/0393 , H05K3/108 , H05K2201/0154
摘要： The present invention relates to a double-sided flexible printed circuit board in which circuit patterns are formed, including an insulating substrate, conduction layers sputtered on both sides of the insulating substrate, a through hole formed to connect circuits formed in the both sides, seed layers formed on the conduction layers of the both sides, and pattern plating layers formed on an inner wall of the through hole and on the respective seed layers, and a method of manufacturing the same. Accordingly, the loss of a circuit width can be minimized because a sputtering-type material not an adhesive is used between the insulating substrate and the thin copper (Cu) layer. Further, productivity can be improved because a roll-to-roll process can be used. In addition, the thickness of a circuit can be controlled and micro circuit patterns can be formed because a semi-additive method is used.
摘要翻译：本发明涉及一种双面柔性印刷电路板，其中形成有电路图案，包括绝缘基板，溅射在绝缘基板的两侧的导电层，形成为连接形成在两侧的电路的通孔，种子形成在两侧的导电层上的层以及形成在通孔的内壁上和各个种子层上的图案镀层及其制造方法。因此，在绝缘基板和薄铜（Cu）层之间使用不是粘合剂的溅射型材料，可以使电路宽度的损失最小化。此外，可以提高生产率，因为可以使用卷对卷工艺。此外，可以控制电路的厚度，并且可以形成微电路图案，因为使用半添加方法。

9. 发明申请

US20120075268A1 Source Driver, An Image Display Assembly And An Image Display Apparatus 有权
标题翻译：源驱动器，图像显示装置和图像显示装置
公开(公告)号：US20120075268A1
公开(公告)日：2012-03-29
申请号：US13242394
申请日：2011-09-23
申请人： Ye-Chung Chung , Hee-seok Lee , Yun-Seok Choi , Keung-Beum Kim
发明人： Ye-Chung Chung , Hee-seok Lee , Yun-Seok Choi , Keung-Beum Kim
IPC分类号： G09G5/00 , H03L5/00
CPC分类号： H01L27/1244 , G02F1/13452 , G09G3/20 , G09G2300/0426 , G09G2310/08 , G09G2330/021 , H01L24/13 , H01L24/16 , H01L24/73 , H01L25/105 , H01L2224/13124 , H01L2224/13639 , H01L2224/16225 , H01L2224/73204 , H01L2924/1426 , H05K1/148
摘要： An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.
摘要翻译：图像显示面板组件包括柔性印刷电路（FPC），图像显示面板，栅极驱动器集成电路（IC）封装以及源极驱动器IC封装。 FPC被配置为接收门和源驱动信号。图像显示面板电连接到FPC，并且包括沿着图像显示面板的第一边缘的栅极驱动信号传递图案，沿着与第一端相邻的第二边缘的源极驱动信号传递图案，以及多个像素。栅极驱动器集成电路（IC）封装被配置为通过栅极驱动信号传输图案接收栅极驱动信号，并将栅极驱动信号提供给多个像素。源极驱动器IC封装被配置为通过源极驱动信号传输图案接收源极驱动信号，并将源极驱动信号提供给多个像素。

10. 发明授权

US10553514B2 Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the same 有权
公开(公告)号：US10553514B2
公开(公告)日：2020-02-04
申请号：US14972341
申请日：2015-12-17
申请人： Keung Beum Kim , Wonchul Lim , Dongsuk Kim , Yonghoon Kim
发明人： Keung Beum Kim , Wonchul Lim , Dongsuk Kim , Yonghoon Kim
IPC分类号： H01L23/495 , H01L23/48 , H01L23/52 , H01L23/31 , H01L23/498
摘要： A substrate includes a substrate body including a plurality of chip mounting regions and a peripheral region surrounding the plurality of chip mounting regions, each of the chip mounting regions including a conductive plane. The substrate further includes a conductive support structure located in the peripheral region, first conductive lines connected between the conductive planes of adjacent chip mounting regions, and second conductive lines connected between the conductive support structure and the conductive planes of chip mounting regions located adjacent the peripheral region.

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