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1. 发明申请

US20090056980A1 Printed Circuit Board 有权
标题翻译：印刷电路板
公开(公告)号：US20090056980A1
公开(公告)日：2009-03-05
申请号：US11918585
申请日：2006-05-12
申请人： Ferdinand Friedrich , Hubert Trageser , Bernhard Schuch , Friedrich Nehmeier
发明人： Ferdinand Friedrich , Hubert Trageser , Bernhard Schuch , Friedrich Nehmeier
IPC分类号： H05K1/00
CPC分类号： H05K1/0206 , H05K3/341 , H05K3/3452 , H05K2201/099 , H05K2201/10166
摘要： Disclosed is a printed circuit board (1) comprising a top face (2) for positioning an electronic component. A bottom face (4) of the circuit board (1) is used as a support on a heat-dissipating base. A plurality of heat transfer holes (12) create heat transfer from the top face (2) to the bottom face (4). Said heat transfer holes (12) are irregularly distributed on the top face (2) in such a way that the top face (2) is provided with several free sectors (14) which are free from heat transfer holes (12) in order to connect the electronic component to the circuit board (1). The free sectors (14) are arranged in columns or lines. A plurality of heat transfer holes (12) are placed at least along the long sides of the free sectors (14). The inventive circuit board is provided with low thermal resistance between the electronic component and the heat-dissipating base.
摘要翻译：公开了一种印刷电路板（1），其包括用于定位电子部件的顶面（2）。电路板（1）的底面（4）用作散热基座上的支架。多个传热孔（12）产生从顶面（2）到底面（4）的热传递。所述传热孔（12）不规则地分布在顶面（2）上，使得顶面（2）设有若干自由扇区（14），其中没有传热孔（12），以便将电子部件连接到电路板（1）。自由扇区（14）以列或线排列。至少沿自由扇区（14）的长边放置多个传热孔（12）。本发明的电路板在电子部件和散热基座之间具有低热阻。

2. 发明授权

US09497875B2 Control device with a getter layer for use in a motor vehicle 有权
标题翻译：具有用于机动车辆的吸气剂层的控制装置
公开(公告)号：US09497875B2
公开(公告)日：2016-11-15
申请号：US14116411
申请日：2012-05-08
申请人： Juergen Henniger , Matthias Wieczorek , Thomas Urbanek , Marion Gebhardt , Bernhard Schuch , Andreas Reif , Stefan Gottschling
发明人： Juergen Henniger , Matthias Wieczorek , Thomas Urbanek , Marion Gebhardt , Bernhard Schuch , Andreas Reif , Stefan Gottschling
IPC分类号： H01L21/00 , H05K5/06 , H01L23/055 , H01L23/10 , H01L23/26 , H05K3/30
CPC分类号： H05K5/069 , H01L23/055 , H01L23/10 , H01L23/26 , H01L2224/48091 , H01L2224/48228 , H01L2224/49175 , H01L2924/16152 , H05K3/306 , Y10T29/49139 , H01L2924/00014
摘要： A control device for a motor vehicle includes a housing having a housing cover and a housing base, a sealing device between the housing cover and the housing base, at least one circuit carrier having electrically conductive tracks, and at least one electronic component disposed on the circuit carrier. The control device further includes at least one conductor structure extending out of the interior of the housing, and at least one electrically conductive connecting line which connects the electronic component to the conductor structure. A getter layer is thermally sprayed on the inner face of the housing to protect the metal parts, which transmit current or data in the interior of the control device, against corrosive gases. The getter layer has a high specific surface area.
摘要翻译：用于机动车辆的控制装置包括具有壳体盖和壳体基座的壳体，壳体盖和壳体基座之间的密封装置，至少一个具有导电轨道的电路载体，以及至少一个电子部件，电路载体。控制装置还包括至少一个延伸出壳体内部的导体结构，以及将电子部件连接到导体结构的至少一个导电连接线。吸气剂层被热喷涂在壳体的内表面上，以保护将控制装置内部的电流或数据传输到腐蚀性气体的金属部件。吸气剂层具有高比表面积。

3. 发明申请

US20140111947A1 Control Device With a Getter Layer For Use in a Motor Vehicle 有权
标题翻译：带有吸气剂层的控制装置用于机动车辆
公开(公告)号：US20140111947A1
公开(公告)日：2014-04-24
申请号：US14116411
申请日：2012-05-08
申请人： Juergen Henniger , Matthias Wieczorek , Thomas Urbanek , Marion Gebhardt , Bernhard Schuch , Andreas Reif , Stefan Gottschling
发明人： Juergen Henniger , Matthias Wieczorek , Thomas Urbanek , Marion Gebhardt , Bernhard Schuch , Andreas Reif , Stefan Gottschling
IPC分类号： H05K5/06 , H05K3/30
CPC分类号： H05K5/069 , H01L23/055 , H01L23/10 , H01L23/26 , H01L2224/48091 , H01L2224/48228 , H01L2224/49175 , H01L2924/16152 , H05K3/306 , Y10T29/49139 , H01L2924/00014
摘要： A control device for a motor vehicle includes a housing having a housing cover and a housing base, a sealing device between the housing cover and the housing base, at least one circuit carrier having electrically conductive tracks, and at least one electronic component disposed on the circuit carrier. The control device further includes at least one conductor structure extending out of the interior of the housing, and at least one electrically conductive connecting line which connects the electronic component to the conductor structure. A getter layer is thermally sprayed on the inner face of the housing to protect the metal parts, which transmit current or data in the interior of the control device, against corrosive gases. The getter layer has a high specific surface area.
摘要翻译：用于机动车辆的控制装置包括具有壳体盖和壳体基座的壳体，壳体盖和壳体基座之间的密封装置，至少一个具有导电轨道的电路载体，以及至少一个电子部件，电路载体。控制装置还包括至少一个延伸出壳体内部的导体结构，以及将电子部件连接到导体结构的至少一个导电连接线。吸气剂层被热喷涂在壳体的内表面上，以保护将控制装置内部的电流或数据传输到腐蚀性气体的金属部件。吸气剂层具有高比表面积。

4. 发明授权

US06190941B1 Method of fabricating a circuit arrangement with thermal vias 有权
标题翻译：制造具有热通孔的电路装置的方法
公开(公告)号：US06190941B1
公开(公告)日：2001-02-20
申请号：US09396661
申请日：1999-09-15
申请人： Helmut Heinz , Bernhard Schuch
发明人： Helmut Heinz , Bernhard Schuch
IPC分类号： H01L2144
CPC分类号： H05K7/205 , H01L23/3677 , H01L2924/0002 , H05K1/0206 , H05K1/113 , H05K3/0058 , H05K3/0094 , H05K3/1216 , H05K3/341 , H05K3/3452 , H05K7/20854 , H05K2201/066 , H05K2201/09572 , H05K2201/0959 , H05K2201/10166 , H05K2201/10969 , H05K2203/1476 , Y02P70/613 , H01L2924/00
摘要： An electronic component is mounted on a substrate such as a circuit board by means of a soldering process such as reflow soldering. The circuit board has a thermal via hole therethrough to provide a heat dissipation path from the top surface to the bottom surface of the circuit board, for dissipating heat from the electronic component. To prevent molten solder from penetrating through the via hole during the soldering process, the via hole is sealed prior to the soldering process. The via hole is sealed from the bottom surface of the substrate by carrying out a screen printing process including at least two printing passes to print a sealing material into the open hole of the thermal via.
摘要翻译：电子部件通过诸如回流焊接的焊接工艺安装在诸如电路板的基板上。电路板具有穿过其中的热通孔以提供从电路板的顶表面到底表面的散热路径，用于从电子部件散热。为了防止熔融焊料在焊接过程中穿透通孔，通孔在焊接过程之前被密封。通过进行包括至少两个印刷通道的丝网印刷工艺将通孔从基材的底表面密封，以将密封材料印刷到热通孔的开孔中。

5. 发明授权

US5130526A Circuit array for optical Schmitt trigger 失效
标题翻译：光学仪器触发电路阵列
公开(公告)号：US5130526A
公开(公告)日：1992-07-14
申请号：US663025
申请日：1991-03-01
申请人： Peter Mischel , Bernhard Schuch , Ulrich Wicke
发明人： Peter Mischel , Bernhard Schuch , Ulrich Wicke
IPC分类号： H03K3/0233 , H03K17/795
CPC分类号： H03K17/795 , H03K3/02337
摘要： The invention relates to a circuit array for an optical Schmitt trigger in which an optical input signal is converted into an electrical output signal by means of a light-sensitive receiver element, an amplifier stage, a Schmitt trigger stage and an output stage.It is provided in accordance with the invention that the amplifier stage contains a transimpedance amplifier stage, a differential amplifier stage, a first reference network and a compensating element, that the Schmitt trigger stage comprises a differential amplifier stage, a second reference network and a positive-feedback network, and that the output signal is emitted at the circuit output of the output stage.
摘要翻译：本发明涉及一种用于光学施密特触发器的电路阵列，其中通过光敏接收器元件，放大器级，施密特触发级和输出级将光输入信号转换成电输出信号。根据本发明提供的是，放大器级包含跨阻抗放大器级，差分放大级，第一参考网络和补偿元件，施密特触发级包括差分放大级，第二参考网和正反馈网络，输出信号在输出级的电路输出端发出。

6. 发明授权

US08895871B2 Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller 有权
标题翻译：具有多个电路板层的电路板，所述多个电路板层具有裸露的裸片安装用于变速箱控制器
公开(公告)号：US08895871B2
公开(公告)日：2014-11-25
申请号：US13515907
申请日：2010-10-15
申请人： Juergen Sauerbier , Wolfgang Gruebl , Bernhard Schuch , Hubert Trageser , Hermann-Josef Robin
发明人： Juergen Sauerbier , Wolfgang Gruebl , Bernhard Schuch , Hubert Trageser , Hermann-Josef Robin
IPC分类号： H05K1/11 , H05K1/02 , H05K1/03
CPC分类号： H05K1/0206 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105 , H01L2924/19107 , H05K1/0373 , H05K2201/0209 , H01L2924/00014 , H01L2924/00
摘要： A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170° C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.
摘要翻译：电路板具有多个彼此排列的电路板层，并且每个电路板层包括玻璃化转变温度大于或等于170℃的电绝缘基材。电路板层至少还具有一个导热层施加到基材上。几个通孔延伸穿过电路板层中的相应电路板层以连接不同电路板层的导热层，使得通孔和导热层形成从顶部电路板层到最底层电路板层的导热桥。

7. 发明授权

US08004850B2 Arrangement for electrical and/or mechanical components on a large, flexible foil type conductor area 有权
标题翻译：在大型柔性箔型导体区域上的电气和/或机械部件的布置
公开(公告)号：US08004850B2
公开(公告)日：2011-08-23
申请号：US10551725
申请日：2004-04-02
申请人： Turhan Büyükbas , Matthias Gramann , Klaus Scharrer , Peter Guth , Joachim Buhl , Dominik Klein , Bernhard Schuch , Tilo Liebl
发明人： Turhan Büyükbas , Matthias Gramann , Klaus Scharrer , Peter Guth , Joachim Buhl , Dominik Klein , Bernhard Schuch , Tilo Liebl
IPC分类号： H05K7/00
CPC分类号： H05K1/189 , B60R16/0215 , F16H61/0006 , H01L2224/48228 , H01L2224/48472 , H05K3/0052 , H05K2201/2009 , H05K2201/2018 , Y10T29/49155
摘要： The present system and method relate to an arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area and a method for producing such an arrangement. The flexible foil-type conductor can be easily and flexibly handled and is inexpensive and process-reliable.
摘要翻译：本系统和方法涉及在大的柔性箔型导体区域上的电和/或机械部件的布置以及用于制造这种布置的方法。柔性箔型导体可以容易且灵活地处理，成本低廉且工艺可靠。

8. 发明申请

US20110048640A1 METHOD FOR PRODUCING CIRCUIT CARRIERS 审中-公开
标题翻译：生产电路载体的方法
公开(公告)号：US20110048640A1
公开(公告)日：2011-03-03
申请号：US12922712
申请日：2009-01-28
申请人： Helmut Heinz , Bernhard Schuch
发明人： Helmut Heinz , Bernhard Schuch
IPC分类号： B29C65/52 , B32B37/12 , H01B1/22
CPC分类号： H05K3/321 , C08K3/08 , C09J9/02 , C09J11/04 , H05K1/0269 , H05K2203/0315 , H05K2203/161 , Y10T156/10
摘要： A method for the automated production of circuit carriers, comprising providing a substrate for accommodating electronic components, applying an electrically conductive, metal-containing base structure on the substrate. Electronic components are also provided on the substrate and are connected to each other by the structure. Electrically conductive, metal-containing conductive adhesive structures are applied onto the substrate, and the electronic components are connected to the base structure in an electrically conductive way by the structures. The conductive adhesive structures are optically differentiated from the base structure by a colored electrically conductive, metal-containing conductive adhesive applied onto the substrate in order to produce the conductive adhesive structure. A contrast, which is necessary for the automated optical monitoring of the conductive adhesive structures and the base structure, is established between the conductive adhesive structures and the base structure.
摘要翻译：一种用于自动化生产电路载体的方法，包括提供用于容纳电子部件的基板，在所述基板上施加导电的含金属的基底结构。电子部件也设置在基板上并且通过该结构彼此连接。将导电的含金属的导电粘合剂结构施加到基底上，并且电子部件通过结构以导电的方式连接到基底结构。为了制造导电粘合剂结构，导电粘合剂结构通过涂覆在基底上的着色导电的含金属的导电粘合剂与基底结构光学地分开。在导电粘合剂结构和基础结构之间建立了对导电粘合剂结构和基底结构的自动光学监测所必需的对比。

9. 发明授权

US5966291A Power module for the control of electric motors 失效
标题翻译：用于电动机控制的电源模块
公开(公告)号：US5966291A
公开(公告)日：1999-10-12
申请号：US963199
申请日：1997-11-03
申请人： Hermann Baumel , Kurt Geiger , Hermann Kilian , Gunter Leicht , Bernhard Schuch
发明人： Hermann Baumel , Kurt Geiger , Hermann Kilian , Gunter Leicht , Bernhard Schuch
IPC分类号： H01L23/473 , H01L25/07 , H01L25/16 , H01L25/18 , H05K5/00 , H05K7/20
CPC分类号： H05K7/20927 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L25/162 , H01L2924/13055 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025
摘要： A power module for the control of electric motors is described which displays an integrated design and provides the following functional units: A power unit with a circuit arrangement on the upper side of a substrate with power semiconductor components. A cooling unit with a cooling medium flowing through it, which has a heat sink with structured surface formed as an insert section onto which the underside of the substrate is directly fitted. A control unit with semiconductor components arranged on a carrier, which is arranged in parallel to and at a given distance from the substrate of the power unit. Contact pins between the substrate of the power unit and the carrier of the control unit for the connection and contacting of the circuit arrangement of the power unit with the semiconductor components on the control unit. A housing body, which encloses the power unit and the control unit. Two conductor bars which are led parallel to the substrate of the power unit and the carrier of the control unit and out through the housing body for the power supply to the circuit arrangement of the power unit. Connecting bars, which are led out of the housing body and connected to the circuit arrangement of the power unit and/or the semiconductor components of the control unit, for the application of control signals for the control of the power module and/or to tap off output signals from the power module.
摘要翻译：描述了用于控制电动机的电源模块，其显示集成设计并提供以下功能单元：具有功率半导体部件的具有电路布置在衬底的上侧上的电源单元。具有流过其中的冷却介质的冷却单元，其具有形成为嵌入部分的结构化表面的散热器，衬底的下侧直接安装在该插入部分上。具有布置在载体上的半导体组件的控制单元，其布置成与所述功率单元的基板并联并且距离所述基板的给定距离。电源单元的基板和控制单元的载体之间的接触引脚，用于将电源单元的电路装置与控制单元上的半导体部件连接和接触。封闭电源单元和控制单元的外壳主体。两个导线条平行于电源单元的基板和控制单元的载体引出，并通过外壳主体引出，供电源供电单元的电路装置。连接杆从外壳主体引出并连接到电源单元的电路装置和/或控制单元的半导体部件，用于施加用于控制功率模块的控制信号和/或抽头关闭电源模块的输出信号。

10. 发明授权

US5319243A Electronic assembly with first and second substrates 失效
标题翻译：具有第一和第二基板的电子组装
公开(公告)号：US5319243A
公开(公告)日：1994-06-07
申请号：US841534
申请日：1992-02-26
申请人： Gunter Leicht , Bernhard Schuch
发明人： Gunter Leicht , Bernhard Schuch
IPC分类号： G06F15/78 , H01L23/538 , H01L25/18 , H01L23/02
CPC分类号： H01L23/5386 , H01L23/5385 , H01L25/18 , H01L2224/48091 , H01L2224/48227 , H01L2924/19105
摘要： In an electronic assembly whose components or circuit components are combined into at least two sub-assemblies or function units, one or more of the sub-assemblies or function units are disposed on a first substrate comprising a first substrate material. The first substrate is in its turn disposed with one or more further sub-assemblies or function units on a second substrate comprising a second substrate material.
摘要翻译：在其组件或电路组件组合成至少两个子组件或功能单元的电子组件中，一个或多个子组件或功能单元设置在包括第一衬底材料的第一衬底上。第一衬底又在第二衬底上设置有一个或多个另外的子组件或功能单元，所述第二衬底包括第二衬底材料。

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