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    • 1. 发明授权
    • High temperature chemical vapor deposition chamber
    • 高温化学气相沉积室
    • US06364954B2
    • 2002-04-02
    • US09211998
    • 1998-12-14
    • Salvador P. UmotoySteve H. ChiaoAnh N. NguyenBe V. VoJoel HustonJames J. ChenLawrence Chung-Lai Lei
    • Salvador P. UmotoySteve H. ChiaoAnh N. NguyenBe V. VoJoel HustonJames J. ChenLawrence Chung-Lai Lei
    • C23C1600
    • C23C16/45565C23C16/4401C23C16/4405C23C16/4412C23C16/45514C23C16/45574C23C16/4584C23C16/5096
    • An apparatus for wafer processing, which comprises a chamber body and a heated liner which are thermally isolated from each other by isolating pins. During wafer processing, e.g., deposition of titanium nitride film by thermal reaction between titanium tetrachloride and ammonia, a wafer substrate is heated to a reaction temperature in the range of 600-700° C. by a heated support pedestal. The chamber liner and the interior chamber walls are maintained at a temperature between 150-250° C. to prevent deposition of undesirable by-products inside the chamber. This facilitates the chamber cleaning procedure, which can be performed using an in-situ chlorine-based process. The excellent thermal isolation between the heated liner and the chamber body allows the chamber exterior to be maintained at a safe operating temperature of 60-65° C. A heated exhaust assembly is also used in conjunction with the process chamber to remove exhaust gases and reaction by-products. External heaters are used to maintain the exhaust assembly at a temperature of about 150-200° C. to minimize undesirable deposits on the interior surfaces of the exhaust assembly.
    • 一种用于晶片处理的装置,其包括通过隔离销彼此热隔离的室主体和加热衬套。 在晶片加工期间,例如通过四氯化钛和氨之间的热反应沉积氮化钛膜,通过加热的支撑基座将晶片基板加热至600-700℃范围内的反应温度。 腔室衬里和内部室壁保持在150-250℃之间的温度,以防止在室内沉积不期望的副产物。 这有助于室清洁程序,其可以使用原位氯基方法进行。 加热的衬套和腔体之间的良好的隔热能使室外保持在60-65℃的安全工作温度。加热排气组件还与处理室结合使用以除去废气和反应 副产品。 使用外部加热器将排气组件保持在约150-200℃的温度下,以使排气组件的内表面上的不期望的沉积物最小化。