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1. 发明申请

US20060193114A1 Frame-level thermal interface component for transfer of heat from an electronic component of a computer system 有权
公开(公告)号：US20060193114A1
公开(公告)日：2006-08-31
申请号：US11415559
申请日：2006-05-01
申请人： Barrett Faneuf , David Lorenzo
发明人： Barrett Faneuf , David Lorenzo
IPC分类号： H05K7/20
CPC分类号： H05K7/20809
摘要： A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

2. 发明授权

US07149086B2 Systems to cool multiple electrical components 有权
公开(公告)号：US07149086B2
公开(公告)日：2006-12-12
申请号：US11009173
申请日：2004-12-10
申请人： Barrett Faneuf , Tomm Aldridge
发明人： Barrett Faneuf , Tomm Aldridge
IPC分类号： H05K7/20
CPC分类号： G06Q30/0601 , F28D15/0266 , H01L23/427 , H01L2924/0002 , H05K1/0203 , H05K1/141 , H05K7/1092 , H05K7/20309 , H05K2201/064 , H05K2201/10477 , H05K2201/10515 , H05K2201/1056 , H01L2924/00
摘要： According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a first electrical component coupled to transmit heat to the first contact surface and a second electrical component coupled to transmit heat to the second contact surface.

3. 发明申请

US20060163622A1 Apparatus and method for manufacturing thermal interface device having aligned carbon nanotubes 审中-公开
标题翻译：用于制造具有排列的碳纳米管的热界面装置的装置和方法
公开(公告)号：US20060163622A1
公开(公告)日：2006-07-27
申请号：US11367092
申请日：2006-03-03
申请人： Stephen Montgomery , Barrett Faneuf , Richard Montgomery
发明人： Stephen Montgomery , Barrett Faneuf , Richard Montgomery
IPC分类号： H01L29/80 , H01L31/112
CPC分类号： C09K5/14 , B82Y10/00 , H01L21/4871 , H01L23/373 , H01L23/3737 , H01L23/433 , H01L2224/73253 , H01L2924/15312 , H01L2924/16152
摘要： A method and apparatus for manufacturing a coupon of material having aligned carbon nanotubes. The coupon having aligned carbon nanotubes may be used as a thermal interface device in a packaged integrated circuit device.
摘要翻译：一种用于制造具有排列碳纳米管的材料试样的方法和装置。具有对准的碳纳米管的试样可以用作封装的集成电路器件中的热界面器件。

4. 发明申请

US20080160330A1 Copper-elastomer hybrid thermal interface material to cool under-substrate silicon 审中-公开
标题翻译：铜 - 弹性体混合热界面材料，用于冷却底部衬底硅
公开(公告)号：US20080160330A1
公开(公告)日：2008-07-03
申请号：US11648214
申请日：2006-12-29
申请人： David Song , Kelly Lofgreen , Barrett Faneuf , Chia-Pin Chiu , Stephen Montgomery , Todd Young , Seth Reynolds
发明人： David Song , Kelly Lofgreen , Barrett Faneuf , Chia-Pin Chiu , Stephen Montgomery , Todd Young , Seth Reynolds
IPC分类号： C22C28/00
CPC分类号： C22C9/00 , B32B15/08 , H01L23/3735 , H01L23/3736 , H01L23/3737 , H01L23/427 , H01L25/18 , H01L2224/16225 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/10253 , H01L2924/15313 , H01L2924/15323 , Y10T428/12007 , H01L2924/00 , H01L2224/0401
摘要： In some embodiments, copper-elastomer hybrid thermal interface material to cool under-substrate silicon is presented. In this regard, an apparatus is introduced having a layer of copper, a layer of elastomer, and a layer of thin film thermal interface material between the copper and elastomer layers. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，提出了用于冷却底部衬底硅的铜 - 弹性体混合热界面材料。在这方面，引入在铜和弹性体层之间具有铜层，弹性体层和薄膜热界面材料层的装置。还公开并要求保护其他实施例。

5. 发明申请

US20060126294A1 Systems to cool multiple electrical components 有权
标题翻译：系统冷却多个电气组件
公开(公告)号：US20060126294A1
公开(公告)日：2006-06-15
申请号：US11009173
申请日：2004-12-10
申请人： Barrett Faneuf , Tomm Aldridge
发明人： Barrett Faneuf , Tomm Aldridge
IPC分类号： H05K7/20
CPC分类号： G06Q30/0601 , F28D15/0266 , H01L23/427 , H01L2924/0002 , H05K1/0203 , H05K1/141 , H05K7/1092 , H05K7/20309 , H05K2201/064 , H05K2201/10477 , H05K2201/10515 , H05K2201/1056 , H01L2924/00
摘要： According to some embodiments, a cooling device may comprise first and second contact surfaces to transfer heat to a cooling medium. The cooling device may further comprise, in some embodiments, a first electrical component coupled to transmit heat to the first contact surface and a second electrical component coupled to transmit heat to the second contact surface.
摘要翻译：根据一些实施例，冷却装置可以包括将热量传递到冷却介质的第一和第二接触表面。在一些实施例中，冷却装置还可以包括耦合以将热传递到第一接触表面的第一电气部件和耦合以将热传递到第二接触表面的第二电气部件。

6. 发明申请

US20050030712A1 High capacity air-cooling systems for electronic apparatus 失效
标题翻译：用于电子设备的大容量空气冷却系统
公开(公告)号：US20050030712A1
公开(公告)日：2005-02-10
申请号：US10931634
申请日：2004-09-01
申请人： Barrett Faneuf , William Berry , Ven Holalkere
发明人： Barrett Faneuf , William Berry , Ven Holalkere
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： H05K7/20727
摘要： An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.
摘要翻译：用于高性能，高密度电子设备的改进的空气冷却系统在一个实施例中包括具有径向叶轮的单个风扇，具有有效地将空气引导到风扇进气口中的入口部分的挡板和两层出口增压室以特定地引导一个气流在最高的发热部件和所有部件的另一个气流。空气冷却系统设计用于为诸如服务器的低高度，高发热电子模块提供最大的冷却。通过仅使用与挡板的低阻气流特性匹配的单个风扇，空气冷却系统比多风扇系统具有显着的优点。还描述了一种计算机服务器和制造散热设备的方法。

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