专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

WO02054421A3 MULTIPLE TIER ARRAY CAPACITOR AND METHODS OF FABRICATION THEREFOR 审中-公开
标题翻译：多层阵列电容器及其制造方法
公开(公告)号：WO02054421A3
公开(公告)日：2003-11-06
申请号：PCT/US0144878
申请日：2001-11-28
申请人： INTEL CORP , MOSLEY LARRY E , DO HUONG , FIGUEROA DAVID G , BROWN KENNETH M , CHAKRAVORTY KISHORE K , RODRIGUEZ JORGE P
发明人： MOSLEY LARRY E , DO HUONG , FIGUEROA DAVID G , BROWN KENNETH M , CHAKRAVORTY KISHORE K , RODRIGUEZ JORGE P
IPC分类号： H01G2/06 , H01G4/30 , H01G4/38 , H05K1/00 , H05K1/16
CPC分类号： H01G4/30 , H01L23/642 , H01L2224/16225 , H01L2924/00014 , H05K1/0298 , H05K1/162 , H01L2224/0401
摘要： A capacitor includes multiple tiers (302, 304, 306, 1210, 1212, 1310, 1312, 1380, Figures 3, 12, 13) which provide capacitance to a load at different inductance values. Each tier includes multiple layers (311-325, 1220, 1222, 1320, 1322, 1382, Figures 3, 12, 13) of patterned conductive material, which are separated by layers of dielectric material. In one embodiment, tiers are stacked in a vertical direction, and are electrically connected through vias (330, 332, 334, 1230, 1232, Figures 3, 12) that extend through some or all of the tiers. In another embodiment, one or more tieres (1310, 1312, Figure 13) are located in a peripheral region (1408, Figure 14) of the capacitor, and one or more other tiers (1380, Figure 13) are located in a peripheral region (1408, Figure 14) of the capacitor. In that embodiment, the center tiers and peripheral tiers are electrically connected through one or more additional layers (1370, Figure 13) of patterned conductive material. The capacitors of the various embodiments can be used as discretedevices, which are mountable on or embeddable within a housing (e.g., a package, interposer, socket or PC board), or they can be integrally fabricatad within the housing.
摘要翻译：电容器包括以不同的电感值向负载提供电容的多层（302,304,306,1210,1212,1310,1312,1380，图3,12,13）。每个层包括由介电材料层隔开的图案化导电材料的多层（311-325,1220,1222,1320,1322,1382，图3,12,13）。在一个实施例中，层在垂直方向上堆叠，并且通过延伸穿过层的一些或全部的通孔（330,332,334,1230,1232，图3,12）电连接。在另一个实施例中，一个或多个连接件（1310,1312，图13）位于电容器的外围区域（1408，图14）中，并且一个或多个其它层（1380，图13）位于周边区域（1408，图14）。在该实施例中，中心层和外围层通过图案化导电材料的一个或多个附加层（1370，图13）电连接。各种实施例的电容器可以用作可安装在壳体（例如，封装，插入件，插座或PC板）中或嵌入在壳体（例如，封装，插入件，插座或PC板）中）的隔离装置，或者它们可以整体地装配在壳体内。

IPRDB

热门服务

关于我们

友情链接

联系方式