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1. 发明申请

WO1996034413A1 ENCAPSULATION OF TRANSMITTER AND RECEIVER MODULES 审中-公开
标题翻译：发射机和接收机模块的封装
公开(公告)号：WO1996034413A1
公开(公告)日：1996-10-31
申请号：PCT/SE1996000554
申请日：1996-04-26
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (publ) , STEIJER, Odd , BAKSZT, Josef , ERIKSEN, Paul
发明人： TELEFONAKTIEBOLAGET LM ERICSSON (publ)
IPC分类号： H01L23/52
CPC分类号： H01L31/0203 , G02B6/421 , G02B6/4249 , G02B6/4253 , G02B6/426 , G02B6/4265 , G02B6/4274 , G02B6/4281 , G02B6/4283 , H01L21/56 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： An encapsulated optocomponent comprises an optocomponent assembly (14) having an optical interface at one side, which comprises guide pins (27) for positioning a connected optical component or optical connector. The assembly (14) is attached to the outermost portion (10) of a flexible tongue (9), which is an integral part of a dielectric carrier such as a polymer carrier (7). On or inside the carrier and the tongue (9) thereof electrical conductive paths are arranged which are connected to the optoassembly (14) and to electrical driver circuits in a driver circuit assembly (13), so that the carrier also has the function of a conventional lead frame. The entire device is moulded into an encapsulating plastic material (25). In the moulding operation the positioning of the optoassembly in an accurately determined position and the retainment thereof in this position is facilitated by the flexibility of the tongue (9), not being affected for example by the fact that an injected encapsulating material may possibly displace the significantly larger driver circuit assembly (13) and its attachment area (5) on the carrier (7). This construction can also allow that only the optoassembly is encapsulated, the driver circuit assembly being protected in some other way, so that the flexible tongue (9) is exposed. This design can facilitate the accurate positioning of the optocomponent assembly on a circuit board.
摘要翻译：封装的光学组件包括在一侧具有光学接口的光学组件（14），其包括用于定位连接的光学部件或光学连接器的引导销（27）。组件（14）附接到柔性舌状物（9）的最外部分（10），柔性舌片（9）是诸如聚合物载体（7）的电介质载体的组成部分。在载体和/或其内部布置导电路径，其导电路径被连接到驱动电路组件（13）中的光组件（14）和电驱动器电路，使得载体还具有常规引线框架。整个装置被模制成包封塑料材料（25）。在模制操作中，光组件在精确确定的位置的定位及其在该位置的保持由舌（9）的柔性促进，不受例如注入的封装材料可能移位的事实的影响显着较大的驱动电路组件（13）及其在载体（7）上的附接区域（5）。这种结构还可以允许仅封装光组件，驱动电路组件以其它方式被保护，使得柔性舌片（9）被暴露。该设计可以有助于光电组件在电路板上的准确定位。

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