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    • 2. 发明授权
    • Wet etch processing
    • 湿式蚀刻处理
    • US07651946B2
    • 2010-01-26
    • US11637020
    • 2006-12-12
    • Nicolle WilkeAnthony Morrissey
    • Nicolle WilkeAnthony Morrissey
    • H01L21/311
    • A61M37/0015A61M2037/003A61M2037/0046A61M2037/0053B81B2201/055B81C1/00626B81C99/0065B81C2201/0133B81C2201/0138
    • A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.
    • 湿蚀刻的方法产生用于医疗应用的高精度微针阵列。 该方法通过精确地识别蚀刻时间终点,通过使用氢氧化钾(KOH)溶液对硅进行湿蚀刻,在单晶片或批次水平上实现了微针制造的精确过程控制。 因此,实现了精确要求的高度,形状,锐度和表面质量的微针。 结果是可靠,可重现,稳健且相对便宜的微针制作工艺。 通过KOH湿蚀刻形成的微针具有非常光滑的表面,并且对其干蚀刻的对应物表现出优异的机械和结构坚固性。 这些性能为这种硅微针提供了额外的可靠性,使其成为医疗应用的理想选择。 针也可以是中空的。 湿法蚀刻的硅微针可用作主机,通过模制复制其他材料(如聚合物)中改进的表面和结构性能。
    • 5. 发明申请
    • Wet etch processing
    • 湿式蚀刻处理
    • US20070134829A1
    • 2007-06-14
    • US11637020
    • 2006-12-12
    • Nicolle WilkeAnthony Morrissey
    • Nicolle WilkeAnthony Morrissey
    • H01L21/00
    • A61M37/0015A61M2037/003A61M2037/0046A61M2037/0053B81B2201/055B81C1/00626B81C99/0065B81C2201/0133B81C2201/0138
    • A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.
    • 湿蚀刻的方法产生用于医疗应用的高精度微针阵列。 该方法通过精确地识别蚀刻时间终点,通过使用氢氧化钾(KOH)溶液对硅进行湿蚀刻,在单晶片或批次水平上实现了微针制造的精确过程控制。 因此,实现了精确要求的高度,形状,锐度和表面质量的微针。 结果是可靠,可重现,稳健且相对便宜的微针制作工艺。 通过KOH湿蚀刻形成的微针具有非常光滑的表面,并且对其干蚀刻的对应物表现出优异的机械和结构坚固性。 这些性能为这种硅微针提供了额外的可靠性,使其成为医疗应用的理想选择。 针也可以是中空的。 湿法蚀刻的硅微针可用作主机,通过模制复制其他材料(如聚合物)中改进的表面和结构性能。