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2. 发明授权

US5471090A Electronic structures having a joining geometry providing reduced capacitive loading 失效
标题翻译：具有提供降低的电容负载的接合几何形状的电子结构
公开(公告)号：US5471090A
公开(公告)日：1995-11-28
申请号：US28023
申请日：1993-03-08
申请人： Alina Deutsch , David A. Lewis , Chandrasekhar Narayan , Anthony L. Plachy
发明人： Alina Deutsch , David A. Lewis , Chandrasekhar Narayan , Anthony L. Plachy
IPC分类号： H01L23/12 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/11 , H05K3/46 , H01L23/48 , H01L29/44
CPC分类号： H01L23/5385 , H05K1/0216 , H05K1/111 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0289 , H05K2201/0373 , H05K2201/0792 , H05K2201/0939 , H05K2201/09427 , H05K2201/10719 , H05K2203/061 , H05K3/4614 , Y02P70/611
摘要： Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates. By using a plurality of discrete substrates, a multilayer dielectric/electrical conductor structure can be fabricated from individual discrete substrates each of which can be tested prior to forming a composite stack so that defects in each discrete substrate can be eliminated before inclusion into the stack. Electrical interconnection between adjacent substrate is provided by an array of contact locations on each surface of the adjacent substrates. Corresponding contacts on adjacent substrates are adapted for mutual electrical engagement. Adjacent contact locations can be thermocompression bonded. To reduce the parasitic capacitance and coupled noise between the contact pads and the electrical conductors within the interior of each discrete substrate, the contact pads on each substrate have elongated shape. The elongated contact pads or lattice pads on adjacent substrates are nonparallel and preferably orthogonal so that the corresponding pads of adjacent substrates electrically interconnect an intersecting area which varies in location along the elongated contact pads as the placement of the adjacent substrates varies in the manufacture.
摘要翻译：描述电互连结构。电互连结构通过在堆叠中电互连而形成，多个分立的衬底。通过使用多个分立的衬底，多层电介质/电导体结构可以由单独的离散衬底制成，每个离散衬底可以在形成复合堆叠之前进行测试，以便在包含在堆叠中之前可以消除每个离散衬底中的缺陷。相邻基板之间的电气互连通过相邻基板的每个表面上的接触位置阵列来提供。相邻基板上的相应触点适于相互电接合。相邻的接触位置可以热压粘合。为了减小接触焊盘和每个离散衬底内部的电导体之间的寄生电容和耦合噪声，每个衬底上的接触焊盘具有细长形状。相邻基板上的细长接触焊盘或网格焊盘是不平行的并且优选地是正交的，使得相邻衬底的相应焊盘在制造中随着相邻衬底的布置变化而沿着细长的接触焊盘将位置变化的相交区域电连接。

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