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1. 发明授权

US07549890B2 Alien next compensation for adjacently placed connectors 有权
标题翻译：外星人接下来赔偿相邻的连接器
公开(公告)号：US07549890B2
公开(公告)日：2009-06-23
申请号：US11621330
申请日：2007-01-09
申请人： Amid Hashim
发明人： Amid Hashim
IPC分类号： H01R11/20 , H01R4/26 , H01R4/24
CPC分类号： H01R13/6466 , H01R13/6469 , H01R13/6658 , H01R24/64 , H05K1/0216 , H05K1/117 , H05K2201/09781 , Y10S439/941 , Y10S439/951
摘要： A connector is provided for compensating crosstalk with respect to an adjacently placed connector. Each of the connectors includes a printed circuit board (PCB), a plurality of pairs of contacts on the PCB, a plurality of pads disposed at edge portions of the PCB for compensating crosstalk, and a plurality of connecting parts for connecting electrically the pads to the pairs of contacts.
摘要翻译：提供连接器用于补偿相对于相邻放置的连接器的串扰。每个连接器包括印刷电路板（PCB），PCB上的多对触点，设置在PCB的边缘部分以补偿串扰的多个焊盘，以及用于将焊盘电连接到多个连接部分这对联系人。

2. 发明申请

US20080268710A1 Next High Frequency Improvement by Using Frequency Dependent Effective Capacitance 有权
标题翻译：使用频率依赖有效电容的下一个高频改进
公开(公告)号：US20080268710A1
公开(公告)日：2008-10-30
申请号：US12168387
申请日：2008-07-07
申请人： Amid Hashim , Julian Robert Pharney
发明人： Amid Hashim , Julian Robert Pharney
IPC分类号： H01R13/66
CPC分类号： H05K1/0228 , H01R13/6469 , H01R24/64 , H05K1/0298 , H05K1/162 , H05K1/165 , H05K2201/09236 , H05K2201/10189 , Y10S439/941
摘要： A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.
摘要翻译：提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。连接器包括在PCB的第一级区域设置在PCB的内部金属化层上的第一补偿结构和设置在PCB的第二级区域的第二补偿结构，用于以增加的频率增加补偿电容。

3. 发明授权

US07322847B2 110-style connecting block with balanced insulation displacement contacts 有权
标题翻译： 110型连接块，平衡绝缘位移触点
公开(公告)号：US07322847B2
公开(公告)日：2008-01-29
申请号：US11689047
申请日：2007-03-21
申请人： Amid Hashim , Scott M. Keith
发明人： Amid Hashim , Scott M. Keith
IPC分类号： H01R4/24
CPC分类号： H01R4/245 , H01R13/6467 , Y10S439/942
摘要： An insulation displacement contact (IDC) includes: upper and lower ends, each of the upper and lower ends including a slot configured to receive a conductor therein, the slots being generally parallel and non-collinear; and a transitional area merging with the upper and lower ends. An IDC of this configuration can be employed, for example, in 110-style connectors, and can enable such connectors to compensate for differential to common mode crosstalk between adjacent IDC pairs.
摘要翻译：绝缘位移触点（IDC）包括：上端和下端，每个上端和下端包括被配置为在其中接纳导体的槽，所述槽大致平行和非共线; 以及与上下两端并流的过渡区。这种配置的IDC可以用于例如110型连接器，并且可以使这种连接器能够补偿相邻IDC对之间的差模到共模串扰。

4. 发明授权

US07190594B2 Next high frequency improvement by using frequency dependent effective capacitance 有权
公开(公告)号：US07190594B2
公开(公告)日：2007-03-13
申请号：US10845104
申请日：2004-05-14
申请人： Amid Hashim , Julian Robert Pharney
发明人： Amid Hashim , Julian Robert Pharney
IPC分类号： H05K7/06 , H01R24/04
CPC分类号： H05K1/0228 , H01R13/6469 , H01R24/64 , H05K1/0298 , H05K1/162 , H05K1/165 , H05K2201/09236 , H05K2201/10189 , Y10S439/941
摘要： A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.

5. 发明申请

US20050239338A1 Alien next compensation for adjacently placed connectors 有权
标题翻译：外星人接下来赔偿相邻的连接器
公开(公告)号：US20050239338A1
公开(公告)日：2005-10-27
申请号：US10831325
申请日：2004-04-26
申请人： Amid Hashim
发明人： Amid Hashim
IPC分类号： H01R4/24 , H01R12/16 , H01R13/646 , H01R13/66 , H01R24/00 , H04B15/00 , H05K1/02 , H05K1/11
CPC分类号： H01R13/6466 , H01R13/6469 , H01R13/6658 , H01R24/64 , H05K1/0216 , H05K1/117 , H05K2201/09781 , Y10S439/941 , Y10S439/951
摘要： A connector is provided for compensating crosstalk with respect to an adjacently placed connector. Each of the connectors includes a printed circuit board (PCB), a plurality of pairs of contacts on the PCB, a plurality of pads disposed at edge portions of the PCB for compensating crosstalk, and a plurality of connecting parts for connecting electrically the pads to the pairs of contacts.
摘要翻译：提供连接器用于补偿相对于相邻放置的连接器的串扰。每个连接器包括印刷电路板（PCB），PCB上的多对触点，设置在PCB的边缘部分以补偿串扰的多个焊盘，以及用于将焊盘电连接到多个连接部分这对联系人。

6. 发明授权

US08047879B2 Printed wiring boards and communication connectors having series inductor-capacitor crosstalk compensation circuits that share a common inductor 有权
标题翻译：具有串联电感器 - 电容串扰补偿电路的印刷电路板和通信连接器，其共用公共电感器
公开(公告)号：US08047879B2
公开(公告)日：2011-11-01
申请号：US12359453
申请日：2009-01-26
申请人： Amid Hashim
发明人： Amid Hashim
IPC分类号： H01R24/00
CPC分类号： H05K1/0228 , H01R4/2429 , H01R13/6464 , H01R13/6466 , H01R13/6467 , H01R13/6625 , H01R13/6633 , H01R13/6658 , H01R13/719 , H01R24/64 , H05K1/162 , H05K1/165 , H05K2201/10189
摘要： Printed wiring boards for communications connectors are provided that include a mounting substrate having at least first through third input terminals and first through third output terminals. A first conductive path connects the first input terminal to the first output terminal, a second conductive path connects the second input terminal to the second output terminal and a third conductive path connects the third input terminal to the third output terminal. A first inductor and a first capacitor are coupled between the first conductive path and the second conductive path, where the first inductor and the first capacitor are arranged in series to provide a first series inductor-capacitor circuit. A second capacitor is coupled between the third conductive path and the second conductive path through the first inductor to provide a second series inductor-capacitor circuit that shares the inductor of the first series inductor-capacitor circuit. Communications connectors that include such wiring boards or equivalent structures are also provided.
摘要翻译：提供了用于通信连接器的印刷线路板，其包括具有至少第一至第三输入端子和第一至第三输出端子的安装基板。第一导电路径将第一输入端子连接到第一输出端子，第二导电路径将第二输入端子连接到第二输出端子，第三导电路径将第三输入端子连接到第三输出端子。第一电感器和第一电容器耦合在第一导电路径和第二导电路径之间，其中第一电感器和第一电容器串联布置以提供第一串联电感器 - 电容器电路。第二电容器通过第一电感器耦合在第三导电路径和第二导电路径之间，以提供共享第一串联电感器 - 电容器电路的电感器的第二串联电感器 - 电容器电路。还提供了包括这种接线板或等效结构的通信连接器。

7. 发明申请

US20100136835A1 Next High Frequency Improvement by Using Frequency Dependent Effective Capacitance 有权
标题翻译：使用频率依赖有效电容的下一个高频改进
公开(公告)号：US20100136835A1
公开(公告)日：2010-06-03
申请号：US12698390
申请日：2010-02-02
申请人： Amid Hashim , Julian Robert Pharney
发明人： Amid Hashim , Julian Robert Pharney
IPC分类号： H01R13/66
CPC分类号： H01R13/6466 , H01R13/7195 , H01R24/64 , H05K1/0228 , H05K1/0237 , H05K1/0298 , H05K1/162 , H05K1/165 , H05K2201/09236 , H05K2201/10189 , Y10S439/941
摘要： A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes a first compensation structure provided on an inner metalized layer of the PCB at a first stage area of the PCB, and a second compensation structure, provided at a second stage area of the PCB, for increasing compensation capacitance with increasing frequency.
摘要翻译：提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。连接器包括在PCB的第一级区域设置在PCB的内部金属化层上的第一补偿结构和设置在PCB的第二级区域的第二补偿结构，用于以增加的频率增加补偿电容。

8. 发明申请

US20090137154A1 Communications Connectors with Self-Compensating Insulation Displacement Contacts 有权
标题翻译：具有自补偿绝缘位移触点的通信连接器
公开(公告)号：US20090137154A1
公开(公告)日：2009-05-28
申请号：US12362764
申请日：2009-01-30
申请人： Amid Hashim
发明人： Amid Hashim
IPC分类号： H01R13/66 , H01R4/26
CPC分类号： H01R4/2433 , H01R4/245 , H01R13/6467 , Y10S439/922 , Y10S439/939
摘要： Communications connectors are disclosed that include a housing having an upper end and a lower end, the upper end of the housing including a plurality of slits that define a plurality of pillars. First and second pairs of tip and ring insulation displacement contacts (IDCs) are mounted in the housing. Each of the IDCs has an upper end that has a first slot, a lower end that has a second slot and an intermediate portion between the upper end and the lower end, the lower end being offset from the upper end. The first slot of each IDC is aligned with a respective one of the slits. The housing further includes through slots that are separated by dividers, where each of the through slots is sized to receive the upper end of a respective one of the IDCs, and each slit of the plurality of slits exposes inner edges of the first slot of a respective one of the IDCs.
摘要翻译：公开了通信连接器，其包括具有上端和下端的壳体，壳体的上端包括限定多个支柱的多个狭缝。第一和第二对尖端和环形绝缘位移触点（IDC）安装在外壳中。每个IDC具有上端，其具有第一槽，具有第二槽的下端和在上端和下端之间的中间部分，下端偏离上端。每个IDC的第一槽与相应的一个狭缝对准。壳体还包括通过分隔件隔开的通孔，其中每个通孔的尺寸被设计成接纳相应一个IDC的上端，并且多个狭缝的每个狭缝暴露出第一槽的内边缘各自的IDC之一。

9. 发明授权

US07265300B2 Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes 有权
标题翻译：使用具有不同介电常数频率斜率的两种材料的混合基板进行下一次高频改进
公开(公告)号：US07265300B2
公开(公告)日：2007-09-04
申请号：US10800696
申请日：2004-03-16
申请人： Luc Adriaenssens , Amid Hashim , Troy Long
发明人： Luc Adriaenssens , Amid Hashim , Troy Long
IPC分类号： H05K1/00
CPC分类号： H01R13/6466 , H05K1/0228 , H05K1/0231 , H05K1/0298 , H05K1/162 , H05K3/4688 , H05K2201/09236 , H05K2201/09245 , H05K2201/09672 , H05K2201/10189
摘要： A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.
摘要翻译：提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。连接器包括由具有不同介电频率特性的材料制成的PCB衬底。

10. 发明申请

US20070082557A1 Communications Connectors with Floating Wiring Board for Imparting Crosstalk Compensation Between Conductors 有权
标题翻译：具有浮动接线板的通信连接器，用于引导导体之间的串扰补偿
公开(公告)号：US20070082557A1
公开(公告)日：2007-04-12
申请号：US11610125
申请日：2006-12-13
申请人： Amid Hashim
发明人： Amid Hashim
IPC分类号： H01R24/00
CPC分类号： H01R13/6469 , H01R4/2429
摘要： A communications connector includes: a dielectric mounting substrate; a plurality of conductors mounted in the mounting substrate; and a wiring board. Each of the conductors includes a fixed end portion mounted in the mounting substrate and a free end portion, each of the free end portions being positioned in side-by-side and generally parallel relationship, and each of the fixed end portions being positioned in side-by side and generally parallel relationship. The wiring board is positioned between the fixed and free end portions of the conductors, the wiring board being generally perpendicular to the conductors, the wiring board including first and second conductive traces that are electrically insulated from each other. First and second conductors are electrically connected with the first and second traces. The first and second conductive traces are arranged on the wiring board to create a crossover between the first and second conductors.
摘要翻译：通信连接器包括：电介质安装基板; 安装在安装基板上的多个导体; 和接线板。每个导体包括安装在安装基板中的固定端部和自由端部，每个自由端部并排并且大致平行的关系，并且每个固定端部位于侧面 - 侧面和一般平行关系。布线板位于导体的固定端和自由端之间，布线板大致垂直于导体，布线板包括彼此电绝缘的第一和第二导电迹线。第一和第二导体与第一和第二迹线电连接。第一和第二导电迹线布置在布线板上以在第一和第二导体之间产生交叉。

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