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1. 发明授权

US08378759B2 First and second coplanar microstrip lines separated by rows of vias for reducing cross-talk there between 失效
标题翻译：第一和第二共面微带线由行通道隔开，以减少它们之间的串扰
公开(公告)号：US08378759B2
公开(公告)日：2013-02-19
申请号：US12697119
申请日：2010-01-29
申请人： Alexandros Margomenos , Amin Rida
发明人： Alexandros Margomenos , Amin Rida
IPC分类号： H01P3/08
CPC分类号： H01P3/081
摘要： An apparatus for reducing crosstalk including a substrate having a bottom surface and a top surface defining a horizontal plane, a ground plane coupled to the bottom surface of the substrate, first and second microstrip lines formed on the top surface of the substrate, the first and second microstrip lines formed on the top surface of the substrate and spaced apart from one another, and a first plurality of vias traveling through the substrate from the top surface of the substrate to the ground plane and positioned between the first and second microstrip lines for reducing crosstalk between the first and second microstrip lines.
摘要翻译：一种用于减少串扰的装置，包括具有限定水平面的底表面和顶表面的衬底，耦合到衬底的底表面的接地平面，形成在衬底的顶表面上的第一和第二微带线，第一和第二微带线形成在基板的顶表面上并且彼此间隔开;以及第一多个通孔，其穿过基板从基板的顶表面移动到接地平面并且位于第一和第二微带线之间，用于还原第一和第二微带线之间的串扰。

2. 发明授权

US08138019B2 Integrated (multilayer) circuits and process of producing the same 有权
标题翻译：集成（多层）电路及其制造方法
公开(公告)号：US08138019B2
公开(公告)日：2012-03-20
申请号：US12611285
申请日：2009-11-03
申请人： Sang Won Yoon , Alexandros Margomenos
发明人： Sang Won Yoon , Alexandros Margomenos
IPC分类号： H01L21/00 , H01L21/30
CPC分类号： H01L25/0657 , B81C1/00238 , B81C2203/0771 , B81C2203/0792 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/18 , H01L25/50 , H01L2224/11003 , H01L2224/111 , H01L2224/11334 , H01L2224/1145 , H01L2224/11462 , H01L2224/1148 , H01L2224/1184 , H01L2224/11845 , H01L2224/11849 , H01L2224/13099 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/13299 , H01L2224/133 , H01L2224/276 , H01L2224/2784 , H01L2224/27845 , H01L2224/29011 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/30181 , H01L2224/73104 , H01L2224/811 , H01L2224/81903 , H01L2224/83101 , H01L2224/83203 , H01L2224/838 , H01L2224/8385 , H01L2224/9221 , H01L2225/06513 , H01L2225/06517 , H01L2225/06562 , H01L2225/06565 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/14 , H01L2924/1461 , H01L2924/1579 , H01L2924/00014 , H01L2924/00 , H01L2924/01027 , H01L2924/3512
摘要： A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers.
摘要翻译：一种形成半导体集成电路的方法，包括以下步骤：至少形成具有导电材料的第一图案的第一元件，并且包括围绕导电材料的聚合物层，至少形成具有第二导电材料图案的第二元件并且包括围绕所述导电材料的聚合物层，相对于所述第二元件定位所述第一元件，以及在低于所述第一和第二元件的导电材料的熔融温度的温度下将所述第一和第二元件的聚合物层粘合，其中第一元件的导电材料接触第二元件的导电材料，并通过结合的聚合物层保持在适当的位置。

3. 发明申请

US20110010926A1 MICROWAVE ANTENNA AND METHOD FOR MAKING SAME 有权
标题翻译：微波天线及其制造方法
公开(公告)号：US20110010926A1
公开(公告)日：2011-01-20
申请号：US12888473
申请日：2010-09-23
申请人： Alexandros Margomenos
发明人： Alexandros Margomenos
IPC分类号： H01P11/00
CPC分类号： B29C59/02 , B29C59/026 , H01Q1/32 , H01Q13/02 , H01Q13/0283 , Y10T29/49016
摘要： A method for fabricating a microwave horn antenna in which a thermoplastic sacrificial layer is mounted to a thermoplastic horn layer. A heated horn embossing plate having at least one horn shaped embossing element is then moved into the horn layer so that the horn element penetrates through the horn layer and extends partially into the sacrificial layer thus forming a horn opening in the horn layer complementary in shape to the horn element. The horn layer and sacrificial layer are then separated from each other and the horn opening and at least a portion of the back surface of the horn layer is covered with a metal coating. A thermoplastic wave guide layer formed by embossing wave guide channels into the layer is covered with metal and attached to the back side of the horn layer to form the antenna. Alternatively, a portion of the horn and the remaining portion of a microwave channel are formed in both a first and second thermoplastic section. These portions of the microwave guide channel and horn are then coated with a metal material and the sections are secured together in a facing relationship so that the horn portions and wave guide channel portions on both the first and second sections register with each other.
摘要翻译：一种制造微波喇叭天线的方法，其中热塑性牺牲层安装在热塑性喇叭层上。具有至少一个喇叭形压花元件的加热喇叭压花板然后被移动到喇叭层中，使得喇叭元件穿透喇叭层并部分地延伸到牺牲层中，从而在喇叭形层中形成一个喇叭形开口，形状互补，形状与喇叭元素。然后将喇叭层和牺牲层彼此分离，喇叭开口和喇叭层的后表面的至少一部分被金属涂层覆盖。通过将波导通道压印到该层中而形成的热塑性波导层被金属覆盖并附接到喇叭层的背面以形成天线。或者，喇叭的一部分和微波通道的剩余部分形成在第一和第二热塑性部分中。然后微波引导通道和喇叭的这些部分涂覆有金属材料，并且这些部分以面对的关系固定在一起，使得第一和第二部分上的喇叭部分和波导通道部分彼此配准。

4. 发明申请

US20100225410A1 WAVEGUIDE TO MICROSTRIP TRANSITION 有权
标题翻译：波导到微波转换
公开(公告)号：US20100225410A1
公开(公告)日：2010-09-09
申请号：US12400027
申请日：2009-03-09
申请人： Alexandros Margomenos , Paul D. Schmalenberg
发明人： Alexandros Margomenos , Paul D. Schmalenberg
IPC分类号： H03H5/00
CPC分类号： H01P5/107
摘要： A waveguide to microstrip transition having a waveguide open at one end. A dielectric substrate includes a first and a second side and a ground plane covers the first side of the substrate. The dielectric substrate overlies the waveguide opening so that the ground plane faces the waveguide and an opening in the ground plane registers with the waveguide opening. A back short having a housing is positioned on the second side of the dielectric substrate. The back short housing forms a cavity which registers with at least a portion of the ground plane opening so that microwave energy from the waveguide passes through the dielectric substrate and into the cavity defined by the back short housing. The back short housing has at least one opening to the cavity along the second side of the dielectric substrate. A pair of spaced apart microstrips on the second side of the substrate each have a free end positioned in the cavity so that the free ends of the microstrips are spaced apart from each other.
摘要翻译：波导到微带转换，其波导在一端开口。电介质基板包括第一侧面和第二侧面，并且接地面覆盖基板的第一面。电介质衬底覆盖波导开口，使得接地平面面向波导，并且接地平面中的开口与波导开口对准。具有壳体的背部短距离定位在电介质基板的第二侧上。后短壳体形成空腔，其与接地平面开口的至少一部分对准，使得来自波导的微波能量通过电介质基板并进入由后短壳体限定的空腔中。后短壳体具有沿着电介质基板的第二侧的至少一个到空腔的开口。在基板的第二侧上的一对间隔开的微带，每个具有位于空腔中的自由端，使得微带的自由端彼此间隔开。

5. 发明授权

US07760142B2 Vertically integrated transceiver array 失效
标题翻译：垂直集成收发器阵列
公开(公告)号：US07760142B2
公开(公告)日：2010-07-20
申请号：US11733564
申请日：2007-04-10
申请人： Kazem F. Sabet , Linda P. B. Katehi , Alexandros Margomenos
发明人： Kazem F. Sabet , Linda P. B. Katehi , Alexandros Margomenos
IPC分类号： H01Q1/38
CPC分类号： H01Q21/0025
摘要： A transceiver array that employs vertically integrated circuits in one or more wafers. The array includes a digital wafer having digital circuits. A plurality of RF cubes are formed to the digital wafer, where each RF cube includes an antenna wafer and at least one lower wafer, and where each RF cube represents a separate channel of the array. The antenna wafer includes a patch antenna and a resonating cavity. The at least one lower wafer includes high frequency RF integrated circuits and intermediate frequency RF integrated circuits. The array has application as a front-end for a digital beam-forming system.
摘要翻译：在一个或多个晶片中采用垂直集成电路的收发器阵列。该阵列包括具有数字电路的数字晶片。多个RF立方体形成到数字晶片，其中每个RF立方体包括天线晶片和至少一个下晶片，并且其中每个RF立方体代表阵列的单独通道。天线晶片包括贴片天线和谐振腔。所述至少一个下晶片包括高频RF集成电路和中频RF集成电路。该阵列作为数字波束形成系统的前端应用。

6. 发明申请

US20090251356A1 DUAL-BAND ANTENNA ARRAY AND RF FRONT-END FOR AUTOMOTIVE RADARS 有权
标题翻译：双带天线阵列和RF前端用于汽车雷达
公开(公告)号：US20090251356A1
公开(公告)日：2009-10-08
申请号：US12340448
申请日：2008-12-19
申请人： Alexandros Margomenos
发明人： Alexandros Margomenos
IPC分类号： G01S13/88
CPC分类号： G01S13/931 , G01S7/03 , G01S13/87 , G01S2013/9321 , G01S2013/9375 , G01S2013/9378 , G01S2013/9389 , H01L2224/48091 , H01L2224/48227 , H01Q1/3233 , H01Q5/42 , H01Q21/064 , H01Q21/065 , H01L2924/00014
摘要： The automotive radar includes a printed circuit board having a top surface and a bottom surface, and a processor mounted on the bottom surface of the printed circuit board. The automotive radar also includes a second liquid crystal polymer layer formed on the top surface of the printed circuit board, a second microstrip array printed on the second liquid crystal polymer layer, the second microstrip array having a patch, a first liquid crystal polymer layer formed on the second liquid crystal polymer layer, a first microstrip array printed on the first liquid crystal polymer layer, the first microstrip array having a perforated patch, and a transmit/receive module connected to a bottom surface of the second liquid crystal polymer layer and configured to transmit a first frequency signal to the first microstrip array and a second frequency signal to the second microstrip array.
摘要翻译：汽车雷达包括具有顶表面和底表面的印刷电路板，以及安装在印刷电路板的底表面上的处理器。汽车雷达还包括形成在印刷电路板的顶表面上的第二液晶聚合物层，印刷在第二液晶聚合物层上的第二微带阵列，具有贴片的第二微带阵列，形成第一液晶聚合物层在第二液晶聚合物层上，印刷在第一液晶聚合物层上的第一微带阵列，具有穿孔贴片的第一微带阵列和连接到第二液晶聚合物层的底表面的发射/接收模块，将第一频率信号发送到第一微带阵列，并将第二频率信号发送到第二微带阵列。

7. 发明申请

US20080252401A1 Evanescent Mode Resonator Including Tunable Capacitive Post 审中-公开
标题翻译：包含可调谐电容信号的衰减模式谐振器
公开(公告)号：US20080252401A1
公开(公告)日：2008-10-16
申请号：US11735269
申请日：2007-04-13
申请人： Alexandros Margomenos , Linda P.B. Katehi
发明人： Alexandros Margomenos , Linda P.B. Katehi
IPC分类号： H01P1/219
CPC分类号： H01P1/219
摘要： An evanescent mode resonator including a cavity formed in a substrate of semiconductor material. The resonator includes a capacitive post positioned within the cavity, and a tuning element positioned within the wall of the cavity proximate to the capacitive post, where a gap between the flexible element and the post sets the tuning of the resonator.
摘要翻译：包括形成在半导体材料的衬底中的空腔的消逝模式谐振器。所述谐振器包括位于所述空腔内的电容柱，以及调谐元件，所述调谐元件位于靠近所述电容柱的所述腔的壁内，其中所述柔性元件和所述柱之间的间隙设定所述谐振器的调谐。

8. 发明申请

US20120026043A1 THREE-DIMENSIONAL ARRAY ANTENNA ON A SUBSTRATE WITH ENHANCED BACKLOBE SUPPRESSION FOR MM-WAVE AUTOMOTIVE APPLICATIONS 有权
标题翻译：基于具有增强的MM波形汽车应用背景抑制的基板上的三维阵列天线
公开(公告)号：US20120026043A1
公开(公告)日：2012-02-02
申请号：US12845003
申请日：2010-07-28
申请人： Amin Rida , Li Yang , Alexandros Margomenos , Manos Tentzeris
发明人： Amin Rida , Li Yang , Alexandros Margomenos , Manos Tentzeris
IPC分类号： H01Q1/38
CPC分类号： H01Q1/3233 , H01Q19/021 , H01Q21/0006 , H01Q21/065
摘要： A multilayer antenna including a first microstrip patch positioned along a first plane, a second microstrip patch positioned along a second plane that is substantially parallel to the first plane, and a ground plane having a slot formed therein. The multilayer antenna also includes a microstrip feeding line for propagating signals through the slot in the ground plane and to the second microstrip patch and a backlobe suppression reflector for receiving some of the signals and reflecting the signals to the slot in the ground plane.
摘要翻译：一种多层天线，包括沿着第一平面定位的第一微带贴片，沿着基本上平行于第一平面的第二平面定位的第二微带贴片以及其中形成有槽的接地平面。多层天线还包括微带馈电线，用于通过接地平面中的狭槽和第二微带贴片传播信号，以及用于接收一些信号并将信号反射到接地平面中的槽的旁瓣抑制反射器。

9. 发明申请

US20110101827A1 ENERGY HARVESTING DEVICE 有权
标题翻译：能量采集设备
公开(公告)号：US20110101827A1
公开(公告)日：2011-05-05
申请号：US12610771
申请日：2009-11-02
申请人： Sang Won Yoon , Alexandros Margomenos
发明人： Sang Won Yoon , Alexandros Margomenos
IPC分类号： H02N2/18
CPC分类号： H02N2/186 , H01L41/1134 , H01L41/1136
摘要： The present invention discloses an energy harvesting device that converts small magnitude and low frequency vibrations into electrical energy. The device can include a base, a low frequency element, and a piezoelectric element. The low frequency element can be movably attached to the base and the piezoelectric element can also be attached to the base and be spaced apart from the low frequency element with a vacant space therebetween. Upon vibration of the low frequency element resulting from environmental vibrations, the low frequency element can impact the piezoelectric element and cause elastic deformation thereto.
摘要翻译：本发明公开了一种将小振幅和低频振动转换为电能的能量收集装置。该器件可以包括基极，低频元件和压电元件。低频元件可以可移动地附接到基座，并且压电元件也可以附接到基座并且与低频元件间隔开，其间具有空隙。由于环境振动引起的低频元件的振动，低频元件可能会冲击压电元件并引起弹性变形。

10. 发明授权

US07824997B2 Membrane suspended MEMS structures 失效
标题翻译：膜悬浮MEMS结构
公开(公告)号：US07824997B2
公开(公告)日：2010-11-02
申请号：US12056780
申请日：2008-03-27
申请人： Alexandros Margomenos , Linda P. B. Katehi , Yuxing Tang
发明人： Alexandros Margomenos , Linda P. B. Katehi , Yuxing Tang
IPC分类号： H01L21/20
CPC分类号： H03H9/462 , H01P1/127
摘要： A method for micro-machining a varactor that is part of a membrane suspended MEMS tunable filter. In one non-limiting embodiment, the method includes providing a main substrate; depositing a membrane on the main substrate; depositing and patterning a plurality of sacrificial photoresist layers at predetermined times during the fabrication of the varactor; depositing metal layers that define a fabricated varactor structure enclosed within photoresist; coupling a carrier substrate to the fabricated structure opposite to the main substrate using a release layer; etching a central portion of the main substrate to expose the membrane; removing the carrier substrate by dissolving the release layer in a material that attacks the release layer but does not dissolve the photoresist; and removing the photoresist layers to provide a released varactor.
摘要翻译：一种用于微机械加工可变电抗器的方法，该变容二极管是膜悬浮的MEMS可调滤波器的一部分。在一个非限制性实施例中，该方法包括提供主衬底; 在主衬底上沉积膜; 在制造变容二极管期间的预定时间沉积和图案化多个牺牲光致抗蚀剂层; 沉积限定在光致抗蚀剂内包围的制造的变容二极管结构的金属层; 使用剥离层将载体衬底耦合到与主衬底相对的制造结构; 蚀刻主衬底的中心部分以暴露膜; 通过将剥离层溶解在攻击剥离层但不溶解光致抗蚀剂的材料中去除载体基材; 并去除光致抗蚀剂层以提供释放的变容二极管。

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