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    • 2. 发明申请
    • Bonding plate mechanism for use in anodic bonding
    • 用于阳极接合的粘合板机构
    • US20070249098A1
    • 2007-10-25
    • US11786307
    • 2007-04-11
    • Raymond Charles CadyAlexander LakotaWilliam Edward LockJohn Christopher ThomasJohn Joseph Costello
    • Raymond Charles CadyAlexander LakotaWilliam Edward LockJohn Christopher ThomasJohn Joseph Costello
    • H01L21/00H01L21/30
    • H01L21/67092H01L21/67121H01L21/68H01L21/76254
    • A bonding plate mechanism for use in anodic bonding of first and second material sheets together, the apparatus comprising: a base including first and second spaced apart surfaces; a thermal insulator supported by the second surface of the base and operable to impede heat transfer to the base; a heating disk directly or indirectly coupled to the insulator and operable to produce heat in response to electrical power; and a thermal spreader directly or indirectly coupled to the heating disk and operable to at least channel heat from the heating disk, and impart voltage, to the first material sheet, wherein the heat and voltage imparted to the first material sheet are in accordance with respective heating and voltage profiles to assist in the anodic bonding of the first and second material sheets, and a thermal inertia of the bonding plate mechanism is relatively low such that heating of the first material sheet to a temperature of about 600° C. or greater is achieved in less than about one-half hour.
    • 一种用于将第一和第二材料片阳极接合在一起的粘合板机构,所述装置包括:基部,包括第一和第二间隔开的表面; 由所述基座的第二表面支撑并且可操作以阻止对所述基座的热传递的绝热绝缘体; 直接或间接地耦合到所述绝缘体并且可操作以响应于电功率产生热量的加热盘; 以及散热器,其直接或间接地耦合到所述加热盘并且可操作以至少使来自所述加热盘的热量传递给所述第一材料片,并且赋予所述第一材料片的电压,其中施加到所述第一材料片的热和电压根据相应的 加热和电压曲线以帮助第一和第二材料片的阳极接合,并且粘合板机构的热惯性相对较低,使得将第一材料片加热至约600℃或更高的温度 实现时间不到一个半小时。
    • 6. 发明申请
    • High temperature anodic bonding apparatus
    • 高温阳极接合装置
    • US20070246450A1
    • 2007-10-25
    • US11417445
    • 2006-05-03
    • Raymond CadyAlexander LakotaWilliam LockJohn ThomasJohn Costello
    • Raymond CadyAlexander LakotaWilliam LockJohn ThomasJohn Costello
    • D06F75/26
    • H01L21/67092H01L21/67121H01L21/67144H01L21/76254
    • An anodic bonding apparatus includes: a first bonding plate mechanism operable to engage a first material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a second bonding plate mechanism operable to engage a second material sheet, and to provide at least one of controlled heating, voltage, and cooling thereto; a pressure mechanism operatively coupled to the first and second bonding plate mechanisms and operable to urge the first and second bonding plate mechanisms toward one another to achieve controlled pressure of the first and second material sheets against one another along respective surfaces thereof; a control unit operable to produce control signals to the first and second bonding plate mechanisms and the pressure mechanism to provide heating, voltage, and pressure profiles sufficient to achieve anodic bonding between the first and second material sheets.
    • 阳极接合装置包括:第一接合板机构,其可操作以接合第一材料片,并且提供受控加热,电压和冷却中的至少一个; 第二接合板机构,其可操作以接合第二材料片,并且提供受控制的加热,电压和冷却中的至少一个; 压力机构,其可操作地联接到所述第一和第二接合板机构并且可操作以将所述第一和第二接合板机构朝向彼此推动,以实现所述第一和第二材料片在其相应表面上彼此相对的受控压力; 控制单元,可操作以产生对第一和第二接合板机构和压力机构的控制信号,以提供足以实现第一和第二材料片之间的阳极接合的加热,电压和压力分布。