会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Method and apparatus for process control of burnishing
    • 抛光过程控制的方法和装置
    • US07185521B2
    • 2007-03-06
    • US11128565
    • 2005-05-13
    • Dale Robert LombardoAlberto LunaMichael J. Brunck
    • Dale Robert LombardoAlberto LunaMichael J. Brunck
    • B21D17/04B21B37/00
    • B24B39/00Y10T29/47
    • An apparatus for process control of a burnishing process comprising a body having a first end and a second end, at least one process control coupon, and structure for attaching the process control coupon to the body. At least one edge of the process control coupon is clamped along the entire length thereof during burnishing. A method of process control for burnishing of components comprising selecting at least one process control coupon, selecting an apparatus for holding the process control coupon(s), attaching the process control coupon(s) to the apparatus, selecting a region on the surface of the process control coupon(s) for burnishing, burnishing a patch on the selected region using a burnishing process, and, measuring at least one physical parameter at a selected location of the process control coupon(s) after burnishing.
    • 一种用于抛光工艺的过程控制的设备,包括具有第一端和第二端的主体,至少一个过程控制优惠券和用于将过程控制优惠券附接到身体的结构。 在抛光期间,过程控制券的至少一个边沿其整个长度被夹紧。 一种用于抛光组件的过程控制的方法,包括选择至少一个过程控制优惠券,选择用于保持过程控制优惠券的设备,将过程控制优惠券附接到设备,选择表面上的区域 用于抛光的过程控制优惠券,使用抛光过程抛光所选区域上的贴片,以及在抛光之后测量过程控制券的所选位置处的至少一个物理参数。
    • 8. 发明申请
    • Method and apparatus for process control of burnishing
    • 抛光过程控制的方法和装置
    • US20060254333A1
    • 2006-11-16
    • US11128565
    • 2005-05-13
    • Dale LombardoAlberto LunaMichael Brunck
    • Dale LombardoAlberto LunaMichael Brunck
    • B21D17/04
    • B24B39/00Y10T29/47
    • An apparatus for process control of a burnishing process comprising a body having a first end and a second end, at least one process control coupon, and structure for attaching the process control coupon to the body. At least one edge of the process control coupon is clamped along the entire length thereof during burnishing. A method of process control for burnishing of components comprising selecting at least one process control coupon, selecting an apparatus for holding the process control coupon(s), attaching the process control coupon(s) to the apparatus, selecting a region on the surface of the process control coupon(s) for burnishing, burnishing a patch on the selected region using a burnishing process, and, measuring at least one physical parameter at a selected location of the process control coupon(s) after burnishing.
    • 一种用于抛光工艺的过程控制的设备,包括具有第一端和第二端的主体,至少一个过程控制优惠券和用于将过程控制优惠券附接到身体的结构。 在抛光期间,过程控制券的至少一个边沿其整个长度被夹紧。 一种用于抛光组件的过程控制的方法,包括选择至少一个过程控制优惠券,选择用于保持过程控制优惠券的设备,将过程控制优惠券附接到设备,选择表面上的区域 用于抛光的过程控制优惠券,使用抛光过程抛光所选区域上的贴片,以及在抛光之后测量过程控制券的所选位置处的至少一个物理参数。