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    • 2. 发明授权
    • Linker compound, ligand conjugate, and production methods thereof
    • 接头化合物,配体缀合物及其制备方法
    • US07838549B2
    • 2010-11-23
    • US10588612
    • 2005-02-04
    • Yasuo SudaAkio AranoShoichi KusumotoMichael SobelMasahiro Wakao
    • Yasuo SudaAkio AranoShoichi KusumotoMichael SobelMasahiro Wakao
    • A61K31/385C07D409/14
    • C07H15/04C07D339/04G01N33/54353
    • The present invention provides a novel linker compound which minimizes any nonspecific hydrophobic interactions and is capable of easily adjusting the length to a disulfide group subjected to metal bond to thereby enable effective formation of a metal-sulfur bond; novel ligand conjugate and ligand carrier, and a process for producing them. The linker compound is of a structure represented by the following general formula (1) where a, b, d, e are independently an integer of 0 to 6. X has a structure serving as a multi-branched structure moiety including three or more hydrocarbon derivative chains, wherein the hydrocarbon derivative chains each include an aromatic amino group at an end thereof, and may or may not include a carbon-nitrogen bond in a main chain thereof. The ligand conjugate includes the linker compound having a sugar molecule introduced therein.
    • 本发明提供了一种新的接头化合物,其使任何非特异性疏水相互作用最小化,并且能够容易地将长度调节至经受金属键的二硫键,从而有效形成金属 - 硫键; 新型配体结合物和配体载体,及其制备方法。 连接体化合物为下述通式(1)所示的结构,其中a,b,d,e独立地为0〜6的整数。X具有作为多支链结构部分的结构,包含三个以上的烃 衍生链,其中所述烃衍生物链各自在其末端包括芳族氨基,并且在其主链中可以包括或不包括碳 - 氮键。 配体缀合物包括其中引入糖分子的连接体化合物。
    • 3. 发明授权
    • Radiation-sensitive resin composition
    • 辐射敏感树脂组合物
    • US06384103B1
    • 2002-05-07
    • US09701851
    • 2000-12-01
    • Akio AranoKenji Yamamoto
    • Akio AranoKenji Yamamoto
    • C08F248
    • G03F7/0236
    • Radiation-sensitive resin composition having excellent and well-balanced various properties required for photoresist, such as sensitivity, pattern profile and heat resistance. The radiation-sensitive resin composition comprises an alkali-soluble resin and a photosensitizer having a quinonediazide group. The alkali-soluble resin is a phenol novolak resin which is treated by a thin film distillation method to selectively remove monomer and dimer. The novolak resin treated by thin film distillation method preferably shows the following ratio in area in its profile in gel permeation chromatography with a detector at 280 nm: B2/B1≧0.95; C2/(A2+B2+C2)≦0.060 wherein A1 is a high-molecular region, B1 is a middle-molecular region, and C1 is a monomer/dimer region before the treatment of the starting novolak resin, and A2, B2 and C2 are the corresponding counterparts after the treatment of the novolak resin.
    • 对光致抗蚀剂所需的各种性能优异且良好平衡的辐射敏感性树脂组合物,例如灵敏度,图案轮廓和耐热性。 辐射敏感性树脂组合物包含碱溶性树脂和具有醌二叠氮基的光敏剂。 碱溶性树脂是通过薄膜蒸馏法选择性除去单体和二聚体的苯酚酚醛清漆树脂。 通过薄膜蒸馏法处理的酚醛清漆树脂优选在280nm处使用检测器在凝胶渗透色谱中在其轮廓面积中的以下比率:其中A1是高分子区域,B1是中分子区域,C1是 在起始酚醛清漆树脂处理之前的单体/二聚体区域,A2,B2和C2是处理酚醛清漆树脂后的相应对应物。
    • 8. 发明授权
    • Positively photosensitive resin composition
    • 正光敏树脂组合物
    • US06475693B1
    • 2002-11-05
    • US09622179
    • 2000-08-10
    • Kenji SusukidaAkio AranoMasato Nishikawa
    • Kenji SusukidaAkio AranoMasato Nishikawa
    • G03F7023
    • G03F7/0226G03F7/023G03F7/0236
    • A positive-working radiation-sensitive resin composition showing a good throughput upon production of semiconductors or the like and less process dependence of dimensional accuracy as well as having high sensitivity and high resolution, and being able to form a pattern with good shape and a high aspect ratio. The positive-working radiation-sensitive resin composition comprises (i) a radiation-sensitive novolak resin comprising a reaction product between an alkali-soluble novolak resin from which low-molecular-weight components have been removed by fractional treatment and an o-naphthoquinonediazide compound, or a product obtained by removing low-molecular-weight components by fractional treatment from a reaction product between an alkali-soluble novolak resin and an o-naphthoquinonediazide compound, and (ii) a low-molecular compound represented by the general formula (I) and having phenolic hydroxyl group or groups: wherein R1, R2, R3, R4, R5, R6 and R7 each represents independently H, a C1 to C4 alkyl group, a C1 to C4 alkoxyl group, a cyclohexyl group or a group represented by the formula: wherein R8 represents H, a C1 to C4 alkyl group, a C1 to C4 alkoxyl group or a cyclohexyl group; each of m and n is 0, 1 or 2; each of a, b, c, d, e, f, g and h is 0 or an integer of 1 to 5 satisfying a+b≦5, c+d≦5, e+f≦5, and g+h≦5; and i is 0, 1 or 2.
    • 在半导体等的制造中显示出良好的生产能力以及尺寸精度的工艺依赖性以及具有高灵敏度和高分辨率的正性辐射敏感性树脂组合物,并且能够形成具有良好形状和高度的图案 宽高比。 正性工作辐射敏感性树脂组合物包含(i)辐射敏感性酚醛清漆树脂,其包含通过分级处理除去低分子量组分的碱溶性酚醛清漆树脂与邻萘醌二叠氮化合物 或通过从碱溶性酚醛清漆树脂和邻萘醌二叠氮化合物之间的反应产物中分级处理除去低分子量成分得到的产物,和(ii)由通式(I)表示的低分子化合物 )和具有酚羟基或基团:其中R1,R2,R3,R4,R5,R6和R7各自独立地表示H,C1至C4烷基,C1至C4烷氧基,环己基或由 式中,R8表示H,C1〜C4烷基,C1〜C4烷氧基或环己基; m和n各自为0,1或2; a,b,c,d,e,f,g和h中的每一个为0或1〜5的整数,满足+ b <= 5,c + d <= 5,e + f <= 5,g + h <= 5; 我是0,1或2。
    • 9. 发明授权
    • Positively photosensitive resin composition
    • 正光敏树脂组合物
    • US06391513B1
    • 2002-05-21
    • US09647306
    • 2001-03-16
    • Kenji SusukidaMasato NishikawaAkio Arano
    • Kenji SusukidaMasato NishikawaAkio Arano
    • G03F7021
    • G03F7/023
    • The positive-working radiation sensitive resin composition which has high sensitivity, high resolution and no residues in development and ability to form a pattern having a good profile. The positive-working radiation sensitive resin composition contains a mixed radiation sensitive novolak resin comprising the mixture of 1,2-naphthoquinonediazide-4-sulfonic acid ester of an alkali soluble novolak resin and 1,2-naphthoquinonediazide-5-sulfonic acid ester of an alkali soluble novolak resin, wherein the ratio by weight of the 1,2-naphthoquinonediazide-4-sulfonyl group and 1,2-naphthoquinonediazide-5-sulfonyl group ranges from 5:95 to 20:80.
    • 具有高灵敏度,高分辨率和无残留发展的正性辐射敏感性树脂组合物,形成具有良好外形的图案的能力。 正性辐射敏感性树脂组合物含有包含碱溶性酚醛清漆树脂的1,2-萘醌二叠氮化物-4-磺酸酯和1,2-萘醌二叠氮化物-5-磺酸酯的混合物的混合辐射敏感酚醛清漆树脂 碱溶性酚醛清漆树脂,其中1,2-萘醌二叠氮化物-4-磺酰基和1,2-萘醌二叠氮化物-5-磺酰基的重量比为5:95至20:80。