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    • 5. 发明专利
    • LOW-TEMPERATURE DOPING PROCESSES FOR SILICON WAFER DEVICES
    • CA2661047A1
    • 2007-11-22
    • CA2661047
    • 2007-05-15
    • ARISE TECHNOLOGIES CORP
    • SIVOTHTHAMAN SIVAFARROKH-BAROUGHI MAHDI
    • C30B25/20C30B25/02H01L31/042H01L31/18H01L49/02
    • A low temperature method and system configuration for depositing a doped silicon layer on a silicon substrate of a selected grade. The silicon substr ate for functioning as a light absorber and the doped silicon layer for func tioning as an emitter. The method comprises the acts of: positioning the sil icon substrate in a chamber suitable for chemical vapour deposition of the d oped silicon layer on the silicon substrate, an external surface of the sili con substrate suitable for promoting crystalline film growth; using a plural ity of process parameters for adjusting growth of the doped silicon layer, t he plurality of process parameters including a first process parameter of a process temperature for inhibiting diffusion of dopant atoms into the extern al surface of the silicon substrate, and a second process parameter of a hyd rogen dilution level for providing excess hydrogen atoms to affect a layer c rystallinity of the atomic structure of the doped silicon layer; exposing th e external surface of the silicon substrate in the chamber to a vapour at ap propriate ambient chemical vapour deposition conditions, the vapour includin g silicon atoms, dopant atoms and the excess hydrogen atoms, the atoms for u se in growing the doped silicon layer; and originating growth of the doped s ilicon layer on the external surface to form aninterface between the doped s ilicon layer and the silicon substrate, such that the doped silicon layer in cludes first atomic structural regions having a higher quality of the layer crystallinity next to the interface with adjacent second atomic structural r egions having a lower quality of the layer crystallinity with increasing con centrations of crystal defects for increasing thickness of the doped silicon layer from the interface. The resultant silicon substrate and doped layer ( or thin film) can be used in solar cell manufacturing.