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1. 发明申请

WO1995016362A1 PROCESS FOR PRODUCING PRODUCT FROM PULSE AND FOOD CONTAINING PRODUCT FROM PULSE 审中-公开
标题翻译：从脉冲生产产品的过程和从脉冲产生的食品
公开(公告)号：WO1995016362A1
公开(公告)日：1995-06-22
申请号：PCT/JP1994002103
申请日：1994-12-14
申请人： NICHIMO CO., LTD. , HISHIROKU, CO., LTD. , TAKEBE, Minoru , ANDO, Yoshio , KIKUSHIMA, Sunao
发明人： NICHIMO CO., LTD. , HISHIROKU, CO., LTD.
IPC分类号： A23L01/20
CPC分类号： A23K10/30 , A21D2/362 , A21D8/04 , A23K10/12 , A23L11/09 , A23L11/37 , A61K36/48
摘要： An efficient process for producing food, livestock feed and aquacultural feed which are excellent in the effects of preventing and suppressing cancer, treating osteoporosis and suppressing immune responses and can be taken in large quantities from leguminous grains or cakes. The obtained food such as biscuit has the abovementioned excellent pharmacological effects and is good for the health. It is possible to decompose a glycoside of an isoflavone compound contained in pulse to thereby generate an isoflavone compound containing the aglycon and to remove phytic acid present in pulse to thereby obtain a compound having excellent pharmacological effects.
摘要翻译：一种生产食品，牲畜饲料和水产养殖的有效方法，其具有优异的预防和抑制癌症的作用，治疗骨质疏松症和抑制免疫应答，并且可以大量从豆科植物或蛋糕中摄取。所得食品如饼干具有上述优异的药理作用，对健康有益。可以分解脉冲中含有的异黄酮化合物的糖苷，从而生成含有糖苷配基的异黄酮化合物，并除去存在于脉冲中的植酸，得到具有优异药理作用的化合物。

2. 发明申请

WO1997030475A1 ADHESIVE SHEET FOR SEMICONDUCTOR CONNECTING SUBSTRATE, ADHESIVE-BACKED TAPE FOR TAB, ADHESIVE-BACKED TAPE FOR WIRE-BONDING CONNECTION, SEMICONDUCTOR CONNECTING SUBSTRATE, AND SEMICONDUCTOR DEVICE 审中-公开
标题翻译：用于半导体连接衬底的粘合片，用于板的粘合带，用于电线连接的粘合带，用于连接衬底的半导体连接器和半导体器件
公开(公告)号：WO1997030475A1
公开(公告)日：1997-08-21
申请号：PCT/JP1997000453
申请日：1997-02-19
申请人： TORAY INDUSTRIES, INC. , SAWAMURA, Yasushi , KIGOSHI, Shoji , HATANO, Taku , KONISHI, Yukitsuna , ANDO, Yoshio
发明人： TORAY INDUSTRIES, INC.
IPC分类号： H01L21/60
CPC分类号： H01L24/50 , C08G59/245 , C08L55/00 , C08L77/00 , C08L2666/02 , C09J7/22 , C09J7/35 , C09J163/00 , C09J2203/326 , C09J2463/00 , H01L23/49572 , H01L23/49816 , H01L24/45 , H01L24/48 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/45144 , H01L2224/48095 , H01L2224/48465 , H01L2224/73265 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/04953 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/351 , Y10T428/28 , Y10T428/2826 , Y10T428/2848 , Y10T428/287 , Y10T428/2883 , Y10T428/31511 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An adhesive sheet for semiconductor connecting substrate is a laminate which has an adhesive layer containing a thermosetting resin (A) and an epoxy resin (B), the epoxy resin (B) containing, as an essential component, at least one kind of epoxy selected from among (I) an epoxy resin having a dicyclopentadien skeleton, (II) an epoxy resin having a terpene skeleton, (III) an epoxy resin having a biphenyl skeleton, and (IV) an epoxy resin having a naphthalene skeleton. An adhesive-backed tape for TAB is a laminate which has an adhesive layer and a protective film layer both formed on a flexible insulating film, the softening temperature of the adhesive layer after curing being 60-100 DEG C and the insulation resistance dropping time of the layer when the layer is left after a DC voltage of 100 V is applied across the layer in an environment of 130 DEG C temperature and 85 % relative humidity being more than 50 hours. An adhesive-backed tape for wire-bonding connection is constituted of a laminate which has an adhesive layer and a protective layer both formed on a flexible insulating film, the softening temperature of the adhesive layer after curing being 120-170 DEG C, the storage elastic modulus D' at 150 DEG C of the adhesive layer being 20-100 MPa, and the insulation resistance dropping time of the layer when the layer is left after a DC voltage of 100 V is applied across the layer in the environment of 130 DEG C temperature and 85 % relative humidity being more than 50 hours. The adhesive sheet for semiconductor connecting substrate, adhesive-backed tape for TAB, and adhesive-backed tape for wire-bonding connection have excellent adhesive forces, insulating properties, dimensional accuracy, etc., and can improve the reliabilities of semiconductor integrated circuit connecting substrates and semiconductor devices.
摘要翻译：用于半导体连接基板的粘合片是具有含有热固性树脂（A）和环氧树脂（B）的粘合剂层的层压体，所述环氧树脂（B）含有至少一种选自环氧树脂（I）具有二环戊二烯骨架的环氧树脂，（II）具有萜骨架的环氧树脂，（III）具有联苯骨架的环氧树脂和（Ⅳ）具有萘骨架的环氧树脂。用于TAB的胶粘背带是具有在柔性绝缘膜上形成的粘合剂层和保护膜层的层压体，固化后的粘合剂层的软化温度为60-100℃，绝缘电阻下降时间在130℃的温度和85％的相对湿度的环境中，跨层施加100V的直流电压之后的层被放置的层超过50小时。用于引线接合连接的粘合剂背衬带由具有在柔性绝缘膜上形成的粘合剂层和保护层的层压体构成，固化后的粘合剂层的软化温度为120-170℃，储存粘合剂层的150℃下的弹性模量D'为20〜100MPa，当在100℃的直流电压下留下该层时的层的绝缘电阻下降时间在130℃的环境下施加 C温度和85％相对湿度大于50小时。用于半导体连接衬底的粘合片，用于TAB的粘合剂背衬带和用于引线接合连接的粘合剂背衬带具有优异的粘合力，绝缘性能，尺寸精度等，并且可以提高半导体集成电路连接基板的可靠性和半导体器件。

3. 发明申请

WO1994026127A1 CEREAL PRODUCT, USE THEREOF, AND PROCESS FOR PRODUCING THE SAME 审中-公开
标题翻译：谷物产品，其用途及其生产方法
公开(公告)号：WO1994026127A1
公开(公告)日：1994-11-24
申请号：PCT/JP1994000763
申请日：1994-05-11
申请人： NICHIMO CO., LTD. , TAKEBE, Minoru , ANDO, Yoshio , KIKUSHIMA, Sunao
发明人： NICHIMO CO., LTD.
IPC分类号： A23L01/20
CPC分类号： A23K10/12 , A23K10/30 , A23L5/28 , A23L7/104 , A23L11/37 , Y10S426/807
摘要： Products obtained from cereal such as soybean, rice, wheat, corn and meals thereof and usable as food, animal feed and aquacultural feed. The production process comprises decomposing phytic acid contained in cereal. The products are superior in digestion efficiency to the conventional ones, and the process is superior in productivity to the conventional ones.
摘要翻译：从谷物如大豆，水稻，小麦，玉米和其他食物中获得的产品，可用作食品，动物饲料和水产养殖饲料。生产过程包括分解谷物中含有的植酸。该产品的消化效率优于常规产品，该方法的生产率优于常规方法。

4. 发明专利

JPS5557326A BONDING METHOD OF CORRUGATED PLATE 失效
公开(公告)号：JPS5557326A
公开(公告)日：1980-04-28
申请号：JP12905778
申请日：1978-10-21
申请人： ANDO YOSHIO , KATAYAMA YUTAKA
发明人： ANDOU YOSHIO , KATAYAMA YUTAKA
IPC分类号： B21D13/04 , B21C37/15
摘要： PURPOSE:To bond the end faces of corrugated plates readily and perfectly by once elongating flat the both ends of the corrugated plates having been bent prior to bonding then bonding both and reproducing corrugations in this bonded portion. CONSTITUTION:A metal plate 6 wound in roll form passes between corrugating rollers 7 to be made to a corrugated plate 8 which is then cut to a required length. Both ends 10 are elongated flat to erase or reduce corrugations. Next, the plate is formed to such a shape as cylinder or square and the end parts are fusion welded. Next, the bond part is passed through corrugating rolls 9 to reproduce the continuous corrugations similar to those of periphery to the bond part. This method enables a large-size bellows of a large cross sectional area used for large-size exhaust ducts or the like to be manufactured without requiring any costly bulging defining frame.

5. 发明专利

JPS5233193A ELECTROMOTIVE GRINDER WITH DRESSING DEVICE 失效
公开(公告)号：JPS5233193A
公开(公告)日：1977-03-14
申请号：JP10963675
申请日：1975-09-10
申请人： ANDO YOSHIO
发明人： ANDOU YOSHIO
IPC分类号： B24B53/047
摘要： PURPOSE:An electromotive grinder with dressing device, wherein center grinding of a workpiece is readily and efficiently performed and also dressing of the grinder can be carried out easily as required.

6. 发明专利

JPS55116318A SWITCHGEAR FOR COVER AND SEAT PLATE OF FOREIGN STYLE TOILET STOOL 失效
公开(公告)号：JPS55116318A
公开(公告)日：1980-09-06
申请号：JP2265479
申请日：1979-02-28
申请人： ANDO YOSHIO , ANDO SEIJI , SATO TAMIO
发明人： ANDOU YOSHIO , ANDOU SEIJI , SATOU TAMIO
IPC分类号： A47K13/10

7. 发明专利

JP2001115300A ELECTROPLATING TREATMENT DEVICE 失效
公开(公告)号：JP2001115300A
公开(公告)日：2001-04-24
申请号：JP32864499
申请日：1999-10-14
申请人： ANDO YOSHIO
发明人： ANDO YOSHIO
IPC分类号： C25D21/00 , C25D17/08
摘要： PROBLEM TO BE SOLVED: To make the man power saving and rationalizing of an electroplating treatment device higher than heretofore by devising the intricate work of mounting and dismounting works to and from jigs like heretofore to the simple work of merely involving the insertion and removal of the works into and out of a basket, whereas, with the conventional system of the plating treatment, many operators are needed for the intricate work of mounting and dismounting the works because of the structure to execute power feeding and holding by mounting the works in the form of having the works pinched in the jigs utilizing the force of springs or the like. SOLUTION: This electroplating treatment device for various kinds has the structure to enable the plating treatment by installing an in-liquid power feeder 8 for feeding electricity to the works 1 in the inside bottom of a plating treating vessel 9 in such a manner that, when the basket 2 for transportation treatment in the state of inserting and holding the works 1 therein is immersed in the plating treating vessel 9, the in-liquid power feeder 8 intrudes into the bottom of the basket 2 and the works 1 held in the basket 2 comes into contact with the in-liquid power feeder 8 in the form of riding thereon and the electricity is fed to the works 1 from the in-liquid power feeder 8.

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