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1. 发明申请

WO2005015735A3 MICROMECHANICAL RESONATOR DEVICE AND METHOD OF MAKING THE MICROMECHANICAL RESONATOR DEVICE 审中-公开
标题翻译：微机电谐振器装置及制造微机电谐振器装置的方法
公开(公告)号：WO2005015735A3
公开(公告)日：2006-03-02
申请号：PCT/US0340334
申请日：2003-12-17
申请人： UNIV MICHIGAN , NGUYEN CLARK T C , ABDELMONEUM MOHAMED A
发明人： NGUYEN CLARK T C , ABDELMONEUM MOHAMED A
IPC分类号： H03H7/24 , H03H3/007 , H03H9/24
CPC分类号： H03H9/02338 , H03H3/0072 , H03H9/2431 , H03H9/2436 , H03H2009/02354 , H03H2009/02503
摘要： A micromechanical resonator device and a method of making the micromechanical resonator device, as well as other extensional mode devices are provided wherein anchor losses are minimized by anchoring at one or more side nodal points of the resonator device. Lower damping forces are experienced by the resonator device when operated in air.
摘要翻译：提供微机械谐振器装置和制造微机械谐振器装置的方法以及其它拉伸模式装置，其中锚固损耗通过锚定在谐振器装置的一个或多个侧节点处被最小化。当在空气中操作时，谐振器装置经历较低的阻尼力。

2. 发明申请

WO2011087598A3 THERMAL SENSOR USING A VIBRATING MEMS RESONATOR OF A CHIP INTERCONNECT LAYER 审中-公开
公开(公告)号：WO2011087598A3
公开(公告)日：2011-07-21
申请号：PCT/US2010/058356
申请日：2010-11-30
申请人： INTEL CORPORATION , ABDELMONEUM, Mohamed A. , FISCHER, Kevin J. , RAHAL-ARABI,, Tawfik M. , YEOH, Andrew , TAYLOR, Gregory F.
发明人： ABDELMONEUM, Mohamed A. , FISCHER, Kevin J. , RAHAL-ARABI,, Tawfik M. , YEOH, Andrew , TAYLOR, Gregory F.
IPC分类号： G01K7/32 , G01K11/26 , B81C1/00 , B81B7/02
摘要： Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect layer provides a way to implement thermal detection means which is tolerant of manufacturing process variations. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

3. 发明申请

WO2011087598A2 THERMAL SENSOR USING A VIBRATING MEMS RESONATOR OF A CHIP INTERCONNECT LAYER 审中-公开
标题翻译：利用芯片互连层振动MEMS谐振器的热传感器
公开(公告)号：WO2011087598A2
公开(公告)日：2011-07-21
申请号：PCT/US2010058356
申请日：2010-11-30
申请人： INTEL CORP , ABDELMONEUM MOHAMED A , FISCHER KEVIN J , RAHAL-ARABI TAWFIK M , YEOH ANDREW , TAYLOR GREGORY F
发明人： ABDELMONEUM MOHAMED A , FISCHER KEVIN J , RAHAL-ARABI TAWFIK M , YEOH ANDREW , TAYLOR GREGORY F
CPC分类号： G01K7/32
摘要： Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor temperature in an integrated circuit. Fabricating the resonator in an interconnect layer provides a way to implement thermal detection means which is tolerant of manufacturing process variations. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.
摘要翻译：用于监测集成电路中温度的微机电系统（MEMS）谐振器的方法和设备。在互连层中制造谐振器提供了实现耐受制造工艺变化的热检测装置的方式。如果需要，传感器读出和控制电路可以在硅上，例如，与谐振器一起形成振荡器的正反馈放大器以及计数振荡器频率的计数器。

4. 发明申请

WO2015026368A1 MEMS DEVICES UTILIZING A THICK METAL LAYER OF AN INTERCONNECT METAL FILM STACK 审中-公开
标题翻译：利用互连金属膜堆叠的金属层的MEMS器件
公开(公告)号：WO2015026368A1
公开(公告)日：2015-02-26
申请号：PCT/US2013/056431
申请日：2013-08-23
申请人： INTEL CORPORATION , MAHAMEED, Rashed , DORSEY, Kristen, L. , M M ABDELMEJEED, Mamdouh, O. , ABDELMONEUM, Mohamed, A.
发明人： MAHAMEED, Rashed , DORSEY, Kristen, L. , M M ABDELMEJEED, Mamdouh, O. , ABDELMONEUM, Mohamed, A.
IPC分类号： B81B7/00 , B81C1/00 , G01C19/56 , G01P15/14
CPC分类号： B81B3/0051 , B81B3/0021 , B81B7/008 , B81B2201/0235 , B81B2201/0242 , B81B2203/0145 , B81C1/00166 , B81C1/00246 , B81C1/00531 , B81C2203/0714 , B81C2203/0742 , G01C19/5733 , G01P15/125 , G01P2015/0814
摘要： A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.
摘要翻译： MEMS器件，例如加速度计或陀螺仪，其制造在与CMOS微电子器件兼容的互连金属化中。在实施例中，检验质量体具有利用与金属薄层分离的厚金属层的第一体区。厚金属层的膜厚度明显大于金属层的厚度，以增加质量。检测质量还包括第一感测结构，其包括薄金属层，但是缺少用于小特征尺寸的厚金属层，并且增加与周围框架的电容耦合，其包括包含薄金属层的第二检测结构，而且还缺少厚的金属层。在另外的实施例中，框架被释放并且包括具有较厚金属层的区域以更好地匹配膜应力引起的证明块的静态偏转。

5. 发明申请

WO2014200819A1 SELF-CALIBRATED THERMAL SENSORS OF AN INTEGRATED CIRCUIT DIE 审中-公开
标题翻译：集成电路的自校准热传感器
公开(公告)号：WO2014200819A1
公开(公告)日：2014-12-18
申请号：PCT/US2014/041157
申请日：2014-06-05
申请人： INTEL CORPORATION , ABDELMONEUM, Mohamed A. , DUARTE, David E. , TAYLOR, Gregory F.
发明人： ABDELMONEUM, Mohamed A. , DUARTE, David E. , TAYLOR, Gregory F.
IPC分类号： H01L27/14
CPC分类号： G01K15/005 , G01K7/00 , G01K7/32
摘要： Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein resonator is thermally coupled with circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate first temperature corresponding with first frequency of the resonator in the first mode using a first equation, calculate second temperature corresponding with second frequency of the resonator in the second mode using a second equation, and add offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.
摘要翻译：本公开的实施例提供集成电路（IC）裸片的自校准热传感器以及相关联的技术和配置。在一个实施例中，自校准热感测装置包括谐振器，其配置为在与集成电路（IC）管芯的电路的温度相对应的频率下振荡，其中谐振器与电路热耦合并且被配置为以第一模式操作，第二模式和与所述谐振器可操作地耦合的逻辑，并且被配置为使用第一等式在所述第一模式中计算与所述谐振器的第一频率相对应的第一温度，使用第二模式计算与所述谐振器的第二频率相对应的第二温度等式，并且基于第一温度和第二温度的比较结果，将第一等式和第二等式相加。可以描述和/或要求保护其他实施例。

6. 发明申请

WO2011087565A2 THERMAL SENSORS HAVING FLEXIBLE SUBSTRATES AND USES THEREOF 审中-公开
标题翻译：具有柔性基板的热传感器及其用途
公开(公告)号：WO2011087565A2
公开(公告)日：2011-07-21
申请号：PCT/US2010057164
申请日：2010-11-18
申请人： INTEL CORP , ABDELMONEUM MOHAMED A , KAYSEN DAVID A
发明人： ABDELMONEUM MOHAMED A , KAYSEN DAVID A
CPC分类号： G01K7/32
摘要： Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.
摘要翻译：微机电系统（MEMS）谐振器的监测平台温度的方法和装置。在相对低成本的柔性聚合物基材而不是硅上制造谐振器提供机械灵活性以及相对于传感器放置的设计灵活性。如果需要，传感器读出和控制电路可以在硅上，例如，正反馈放大器以与谐振器一起形成振荡器，并计数振荡器频率。

7. 发明申请

WO2015088626A2 BIOMETRIC SENSORS FOR PERSONAL DEVICES 审中-公开
标题翻译：个人设备用生物测定传感器
公开(公告)号：WO2015088626A2
公开(公告)日：2015-06-18
申请号：PCT/US2014/057581
申请日：2014-09-26
申请人： INTEL CORPORATION , PANT, Mondira D. , ABDELMONEUM, Mohamed A. , KARNIK, Tanay , PISENTI, Stephen , POISNER, David I. , MAHAMEED, Rashed
发明人： PANT, Mondira D. , ABDELMONEUM, Mohamed A. , KARNIK, Tanay , PISENTI, Stephen , POISNER, David I. , MAHAMEED, Rashed
IPC分类号： G06K9/00 , G06F21/32
CPC分类号： G01N29/265 , G01N2291/106 , G06F21/32 , G06F2221/2111 , G06K9/0002 , Y10T29/49005
摘要： Methods and systems may provide for a system having a flexible substrate, an ultrasonic transducer array coupled to the flexible substrate and a processor coupled to the ultrasonic transducer array. The processor may identify a fingerprint based on a signal from the ultrasonic transducer array. The system may also include an external component having a curved profile, wherein the ultrasonic transducer array is embedded in the external component and includes a read surface that conforms to the curved profile. In one example, the external component includes a button having a function that is separate from identification of the fingerprint.
摘要翻译：方法和系统可以提供具有柔性衬底，耦合到柔性衬底的超声换能器阵列和耦合到超声换能器阵列的处理器的系统。处理器可以基于来自超声换能器阵列的信号来识别指纹。该系统还可以包括具有弯曲轮廓的外部部件，其中超声波换能器阵列嵌入在外部部件中并且包括符合弯曲轮廓的读取表面。在一个例子中，外部部件包括具有与识别指纹分开的功能的按钮。

8. 发明申请

WO2011087565A3 THERMAL SENSORS HAVING FLEXIBLE SUBSTRATES AND USES THEREOF 审中-公开
公开(公告)号：WO2011087565A3
公开(公告)日：2011-07-21
申请号：PCT/US2010/057164
申请日：2010-11-18
申请人： INTEL CORPORATION , ABDELMONEUM, Mohamed A. , KAYSEN, David A.
发明人： ABDELMONEUM, Mohamed A. , KAYSEN, David A.
IPC分类号： G01K11/00 , B81B7/02 , B81C1/00
摘要： Methods and apparatuses for Micro-Electro-Mechanical Systems (MEMS) resonator to monitor the platform temperature. Fabricating the resonator on a relatively low cost flexible polymer substrate rather than silicon provides mechanical flexibility as well as design flexibility with respect to sensor placement. Sensor readout and control circuits can be on silicon if desired, for example, a positive feedback amplifier to form an oscillator in conjunction with the resonator and a counter to count oscillator frequency.

9. 发明申请

WO2005015735A2 MICROMECHANICAL RESONATOR DEVICE AND METHOD OF MAKING A MICROMECHANICAL DEVICE 审中-公开
标题翻译：微机械谐振器装置及制造微机电装置的方法
公开(公告)号：WO2005015735A2
公开(公告)日：2005-02-17
申请号：PCT/US2003/040334
申请日：2003-12-17
申请人： THE REGENTS OF THE UNIVERSITY OF MICHIGAN , NGUYEN, Clark, T., C. , ABDELMONEUM, Mohamed, A.
发明人： NGUYEN, Clark, T., C. , ABDELMONEUM, Mohamed, A.
IPC分类号： H03H
CPC分类号： H03H9/02338 , H03H3/0072 , H03H9/2431 , H03H9/2436 , H03H2009/02354 , H03H2009/02503
摘要： A micromechanical resonator device and a method of making the micromechanical resonator device, as well as other extensional mode devices are provided wherein anchor losses are minimized by anchoring at one or more side nodal points of the resonator device. Lower damping forces are experienced by the resonator device when operated in air.
摘要翻译：提供微机械谐振器装置和制造微机械谐振器装置的方法以及其它拉伸模式装置，其中锚固损耗通过锚定在谐振器装置的一个或多个侧节点处被最小化。当在空气中操作时，谐振器装置经历较低的阻尼力。

10. 发明申请

WO2015088626A3 BIOMETRIC SENSORS FOR PERSONAL DEVICES 审中-公开
标题翻译：用于个人设备的生物量传感器
公开(公告)号：WO2015088626A3
公开(公告)日：2015-08-13
申请号：PCT/US2014057581
申请日：2014-09-26
申请人： INTEL CORP , PANT MONDIRA D , ABDELMONEUM MOHAMED A , KARNIK TANAY , PISENTI STEPHEN , POISNER DAVID I , MAHAMEED RASHED
发明人： PANT MONDIRA D , ABDELMONEUM MOHAMED A , KARNIK TANAY , PISENTI STEPHEN , POISNER DAVID I , MAHAMEED RASHED
IPC分类号： G06K9/00 , G06F21/32
CPC分类号： G01N29/265 , G01N2291/106 , G06F21/32 , G06F2221/2111 , G06K9/0002 , Y10T29/49005
摘要： Methods and systems may provide for a system having a flexible substrate, an ultrasonic transducer array coupled to the flexible substrate and a processor coupled to the ultrasonic transducer array. The processor may identify a fingerprint based on a signal from the ultrasonic transducer array. The system may also include an external component having a curved profile, wherein the ultrasonic transducer array is embedded in the external component and includes a read surface that conforms to the curved profile. In one example, the external component includes a button having a function that is separate from identification of the fingerprint.
摘要翻译：方法和系统可以提供具有柔性衬底，耦合到柔性衬底的超声换能器阵列和耦合到超声换能器阵列的处理器的系统。处理器可以基于来自超声换能器阵列的信号识别指纹。该系统还可以包括具有弯曲轮廓的外部部件，其中超声换能器阵列嵌入在外部部件中并且包括符合弯曲轮廓的读取表面。在一个示例中，外部组件包括具有与指纹的识别分离的功能的按钮。

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